Excess Carrier Phenomenon in Semiconductors
Excess Carrier Phenomenon in Semiconductors
Excess Carrier Phenomenon in Semiconductors
6.1. Introduction
The generation of excess carriers in a semiconductor may be accomplished by
either electrical or optical means. For example, electron–hole pairs are created
in a semiconductor when photons with energies exceeding the band gap energy
of the semiconductor are absorbed. Similarly, minority carrier injection can be
achieved by applying a forward bias voltage across a p-n junction diode or a bipo-
lar junction transistor. The inverse process to the generation of excess carriers
in a semiconductor is that of recombination. The annihilation of excess carriers
generated by optical or electrical means in a semiconductor may take place via
different recombination mechanisms. Depending on the ways in which the energy
of an excess carrier is removed during a recombination process, there are three
basic recombination mechanisms that are responsible for carrier annihilation in
a semiconductor. They are (1) nonradiative recombination (i.e., the multiphonon
process), (2) band-to-band radiative recombination, and (3) Auger band-to-band
recombination. The first recombination mechanism, known as the nonradiative
or multiphonon recombination process, is usually the predominant recombination
process for indirect band gap semiconductors such as silicon and germanium.
In this process, recombination is accomplished via a deep-level recombination
center in the forbidden gap, and the energy of the excess carriers is released via
phonon emission. The second recombination mechanism, band-to-band radiative
recombination, is usually the predominant process occurring in direct band gap
semiconductors such as GaAs and InP. In this case, the band-to-band recombi-
nation of electron-hole pairs is accompanied by the emission of a photon. Auger
band-to-band recombination is usually the predominant recombination process oc-
curring in degenerate semiconductors and small-band-gap semiconductors such as
InSb and HgCdTe materials. The Auger recombination process can also become
the predominant recombination mechanism under high-injection conditions. Un-
like the nonradiative and radiative recombination processes, which are two-particle
processes, Auger band-to-band recombination is a three-particle process, which
involves two electrons and one hole for n-type semiconductors, or one electron
and two holes for p-type semiconductors. For an n-type semiconductor, Auger
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6.2. Nonradiative Recombination: The Shockley–Read–Hall Model 135