Core 2 Duo

Intel® CoreTM 2 Duo Processor and
Intel ® Q35 Express Chipset

Development Kit
User’s Manual
October 2007
Order Number: 318476-001US
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Intel® CoreTM 2 Duo Processor and Intel ®

Q35 Express Chipset Development Kit
User’s Manual October 2007
2 Order Number: 318476-001US

Contents—Intel Core 2 Duo Processor and Intel Q35 Express Chipset
Contents
1.0 About This Manual ..................................................................................................... 6

1.1 Content Overview................................................................................................ 6
1.2 Text Conventions ................................................................................................ 6
1.3 Glossary of Terms and Acronyms...........................................................................7
1.4 Support Options .................................................................................................. 8
1.4.1 Electronic Support Systems ....................................................................... 8
1.4.2 Additional Technical Support ......................................................................8
1.5 Product Literature ............................................................................................... 8
2.0 Development Kit Hardware Features ....................................................................... 10
2.1 Intel® Q35 Express Chipset Development Kit Overview .......................................... 10
2.2 System Block Diagram ....................................................................................... 11
2.3 Development Kit Inventory Checklists .................................................................. 12
2.4 Processor Support ............................................................................................. 14
2.5 System Memory ................................................................................................ 14
2.5.1 Dual Channel (Interleaved) Mode Configurations ........................................ 15
2.5.2 Single Channel (Asymmetric) Mode Configurations...................................... 17
2.6 Back-Panel Connectors....................................................................................... 18
2.6.1 Audio-Connectors ................................................................................... 18
2.6.2 RJ-45 LAN Connector with Integrated LEDs ................................................ 19
2.6.3 USB Port ............................................................................................... 19
2.6.4 Coaxial S/PDIF In/Out Connector.............................................................. 19
2.6.5 eSATA Port ............................................................................................ 19
2.7 Debug Features................................................................................................. 20
2.7.1 Extended Debug Probe (XDP)................................................................... 20
2.7.2 Power LEDs ........................................................................................... 20
2.7.3 Port 80 POST Code LEDs ......................................................................... 20
2.7.4 Voltage Reference .................................................................................. 21
2.8 Development Kit Major Connectors and Jumpers.................................................... 21
2.8.1 Jumper Functions ................................................................................... 22
2.8.2 USB 2.0 Front Panel ............................................................................... 22
2.8.3 1394a Header ........................................................................................ 22
2.9 SPI Removal / Installation Technique ................................................................... 23
2.9.1 SPI Device Removal................................................................................ 24
2.9.2 SPI Device Installation ............................................................................ 24
3.0 Setting Up and Configuring the Development Kit ..................................................... 26
3.1 Overview ......................................................................................................... 26
3.2 Installing Board Standoffs .................................................................................. 26
3.3 BTX Heatsink Setup with SRM ............................................................................. 28
3.3.1 SRM Alignment on any BTX Board ............................................................ 28
3.4 Board Setup and Configuration before Boot........................................................... 30
3.5 Post Codes Definitions........................................................................................ 32
3.5.1 Normal Post Codes ................................................................................. 32
Figures
1 Board Features ........................................................................................................ 11
2 Intel® Q35 Express Chipset Development Kit block diagram .......................................... 12
3 Memory Channel and DIMM Configuration ................................................................... 15
4 Dual Channel (Interleaved) Mode Configuration with 2x DIMMs ...................................... 16
5 Dual Channel (Interleaved) Mode Configuration with 3x DIMMs ...................................... 16

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Intel Core 2 Duo Processor and Intel Q35 Express Chipset—Contents
6 Dual Channel (Interleaved) Mode Configuration with 4x DIMMs.......................................17

7 Single Channel (Asymmetric) Mode Configuration with 1x DIMM .....................................17
8 Single Channel (Asymmetric) Mode Configuration with 3x DIMMs ....................................18
9 Back-panel Connectors..............................................................................................18
10 LAN Connector LED locations......................................................................................19
11 ITP-XDP Connector location (J2BC) .............................................................................20
12 Major Jumper and Header Locations ............................................................................21
13 Location for 1394a Header and USB Front Panel ...........................................................23
14 SPI Socket with Retaining Clip....................................................................................24
15 SPI Device Installation ..............................................................................................25
16 Intel® Q35 Development Kits ....................................................................................26
17 Mounting Hole Locations ............................................................................................27
18 Mounting the Standoff for BTX Heatsink.......................................................................28
19 Casing with “Support and Retention Module” ................................................................28
20 BTX board alignment on SRM .....................................................................................29
21 Heatsink Alignment...................................................................................................29
22 Tightening Heatsink on the SRM and Board ..................................................................30
23 CPU Fan location ......................................................................................................31
24 2x12 Standard power supply and 2x2 power supply ......................................................32
Tables
1 Definition ................................................................................................................. 7
2 Intel Literature Centers .............................................................................................. 9
3 Development Kit Hardware Items ...............................................................................12
4 Development Kit Board Specification ...........................................................................13
5 Internal I/O headers .................................................................................................13
6 Supported Intel Technologies .....................................................................................13
7 Additional Features ...................................................................................................14
8 LAN Connector LED status .........................................................................................19
9 Voltage Reference detail ............................................................................................21
10 Intel® CoreTM 2 Duo Processor and Intel ® Q35 Express Chipset Development Kit Board
Jumpers Description .................................................................................................22
11 USB Front Panel .......................................................................................................22
12 1394a Header ..........................................................................................................23

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Revision History—Intel Core 2 Duo Processor and Intel Q35 Express Chipset
Revision History
Date Revision Description
October 2007 001 Initial release

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Intel Core 2 Duo Processor and Intel Q35 Express Chipset—About This Manual
1.0 About This Manual
This user’s manual describes the use of the Intel® Q35 Express Chipset Development
Kit. This manual has been written for OEMs, system evaluators, and embedded system
developers. All jumpers, headers, LED functions, and their locations on the board,
along with subsystem features and POST codes, are defined in this document.
For the latest information about the Intel® Q35 Express Chipset Development Kit
reference platform, visit:
http://developer.intel.com/design/intarch/devkits/
index.htm?iid=embed_body+devkits
For design documents related to this platform, such as schematics and layout, please
contact your Intel Representative.
1.1 Content Overview

Chapter 1.0, “About This Manual”
This chapter contains a description of conventions used in this manual. The last few
sections explain how to obtain literature and contact customer support.
Chapter 2.0, “Development Kit Hardware Features”
This chapter provides information on the development kit features and the board
capability. This includes the information on board component features, jumper settings,
pin-out information for connectors and overall development kit board capability.
Chapter 3.0, “Setting Up and Configuring the Development Kit”
This chapter provides instructions on how to configure the evaluation board and
processor assembly by setting BTX heatsink, jumpers, connecting peripherals,
providing power, and configuring the BIOS.
1.2 Text Conventions

The following notations may be used throughout this manual.
# The pound symbol (#) appended to a signal name indicates that
the signal is active low.
Variables Variables are shown in italics. Variables must be replaced with
correct values.
Instructions Instruction mnemonics are shown in uppercase. When you are
programming, instructions are not case-sensitive. You may use
either upper-case or lower-case.
Numbers Hexadecimal numbers are represented by a string of
hexadecimal digits followed by the character H. A zero prefix is
added to numbers that begin with A through F. (For example, FF

6 Order Number: 318476001US

About This Manual—Intel Core 2 Duo Processor and Intel Q35 Express Chipset
is shown as 0FFH.) Decimal and binary numbers are

represented by their customary notations (That is, 255 is a
decimal number and 1111 1111 is a binary number). In some
cases, the letter B is added for clarity.
Units of Measure The following abbreviations are used to represent units of
measure:
GByte gigabytes
KByte kilobytes
MByte megabytes
MHz megahertz
W watts
V volts
Signal Names Signal names are shown in uppercase. When several signals
share a common name, an individual signal is represented by
the signal name followed by a number, while the group is
represented by the signal name followed by a variable (n). For
example, the lower chip-select signals are named CS0#, CS1#,
CS2#, and so on; they are collectively called CSn#. A pound
symbol (#) appended to a signal name identifies an active-low
signal. Port pins are represented by the port abbreviation, a
period, and the pin number (e.g., P1.0).
1.3 Glossary of Terms and Acronyms

This section defines conventions and terminology used throughout this document.
Table 1. Definition (Sheet 1 of 2)

Term Description
Advanced Digital Display Card – 2nd Generation. This card provides digital display options
for an Intel Graphics Controller that supports ADD2+ cards. It plugs into a x16 PCI
Express* connector but uses the multiplexed SDVO interface. The card adds Video In
ADD2 Card
capabilities to platform. This Advanced Digital Display Card will not work with an Intel
Graphics Controller that supports DVO and ADD cards. It will function as an ADD2 card in
an ADD2 supported system, but video in capabilities will not work.
ACPI Advanced Configuration and Power Interface
Core The internal base logic in the (G)MCH
DDR2 A second generation Double Data Rate SDRAM memory technology

DMI (G)MCH-IntelÆ ICH9 Direct Media Interface
Digital Video Interface. Specification that defines the connector and interface for digital
DVI
displays.
FSB Front Side Bus. FSB is synonymous with Host or processor bus
GMA 3100 Intel® Graphic Media Accelerator 3100
Eighth generation I/O Controller Hub component that contains additional functionality
compared to previous ICHs. The I/O Controller Hub component contains the primary PCI
IntelÆ ICH9
interface, LPC interface, USB2, ATA-100, and other I/O functions. It communicates with
the (G)MCH over a proprietary interconnect called DMI.
IGD Internal Graphics Device.
Low Voltage Differential Signaling. A high speed, low power data transmission standard
LVDS
used for display connections to LCD panels.

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Intel Core 2 Duo Processor and Intel Q35 Express Chipset—About This Manual
Table 1. Definition (Sheet 2 of 2)
Term Description
nd
Advanced Digital Display Card – 2 Generation. This card provides digital display options
for an Intel Graphics Controller that supports ADD2+ cards. It plugs into a x16 PCI
Express* connector but uses the multiplexed SDVO interface. The card adds Video In
ADD2 Card
capabilities to platform. This Advanced Digital Display Card will not work with an Intel
Graphics Controller that supports DVO and ADD cards. It will function as an ADD2 card in
an ADD2 supported system, but video in capabilities will not work.
Memory Controller Hub component that contains the processor interface, DRAM
controller, and x16 PCI Express* port (typically, the external graphics interface). It
MCH
communicates with the I/O controller hub (Intel ICH9) and other I/O controller hubs over
the DMI interconnect. In this document MCH refers to the Intel® Q35 MCH component.
MEC Media Expansion Card, also known as ADD2+ card. Refer to ADD2+ term for description.
Third Generation input/output graphics attach called PCI Express* Graphics. PCI Express*
is a high-speed serial interface whose configuration is software compatible with the
PCI Express*
existing PCI specifications. The specific PCI Express* implementation intended for
connecting the (G)MCH to an external Graphics Controller is a x16 link and replaces AGP.
The Primary PCI is the physical PCI bus that is driven directly by the ICH9 component.
Primary PCI Communication between Primary PCI and the (G)MCH occurs over DMI. Note that the
Primary PCI bus is not PCI Bus 0 from a configuration standpoint.
Serial Digital Video Out (SDVO). SDVO is a digital display channel that serially transmits
digital display data to an external SDVO device. The SDVO device accepts this serialized
format and then translates the data into the appropriate display format (i.e., TMDS,
SDVO
LVDS, TV-Out). This interface is not electrically compatible with the previous digital
display channel - DVO. For the 82Q965 GMCH, it will be multiplexed on a portion of the
x16 graphics PCI Express* interface.
Third party codec that uses SDVO as an input. May have a variety of output formats,
SDVO Device
including DVI, LVDS, HDMI, TV-out, etc.
System Management Interrupt. SMI is used to indicate any of several system conditions
SMI (such as, thermal sensor events, throttling activated, access to System Management
RAM, chassis open, or other system state related activity).
A unit of DRAM corresponding to eight x8 SDRAM devices in parallel or four x16 SDRAM
Rank devices in parallel, ignoring ECC. These devices are usually, but not always, mounted on a
single side of a DIMM.
1.4 Support Options
1.4.1 Electronic Support Systems

Intel’s site on the World Wide Web (http://www.intel.com/) provides up-to-date
technical information and product support. This information is available 24 hours per
day, 7 days per week, providing technical information whenever you need it.
Product documentation is provided online in a variety of web-friendly formats at:
(http://developer.intel.com/)
1.4.2 Additional Technical Support

If you require additional technical support, please contact your field sales
representative or local distributor.
1.5 Product Literature

Product literature can be ordered from the following Intel literature centers:


About This Manual—Intel Core 2 Duo Processor and Intel Q35 Express Chipset
Table 2. Intel Literature Centers

Location Telephone Number
U.S. and Canada 1-800-548-4725
U.S. (from overseas) 708-296-9333
Europe (U.K.) 44(0)1793-431155

Germany 44(0)1793-421333
France 44(0)1793-421777
Japan (fax only) 81(0)120-47-88-32


Intel Core 2 Duo Processor and Intel Q35 Express Chipset—Development Kit Hardware Features
2.0 Development Kit Hardware Features
This chapter describes the features of the Intel® Q35 Development Kit. These
recommendations would largely apply to other designs incorporating Intel® Q35
chipset. This documentation should be used in conjunction with the datasheets,
specification updates and platform design guides for the Intel® I/O Controller Hub 9
(ICH9) Family and the Intel® Q35 Express Chipset. Contact your Intel representative
for the availability of these documents.
2.1 Intel® Q35 Express Chipset Development Kit Overview

Figure 1 shows overview of the major features present on the development kit board.
Refer to next page for system block diagram of the development kit’s motherboard.


Development Kit Hardware Features—Intel Core 2 Duo Processor and Intel Q35 Express Chipset
Figure 1. Board Features
Reset button
PCI Slot
PCI Express
x1 Slot Power Button
SPI EEPROM
(Secondary)
Port 80 LED Display
SPI EEPROM
(Primary)
PCI Express
x16 Graphics
Slot
LGA775 Processor
Socket
Intel® I/O
Controller Hub
(ICH)
SATA Port
Intel® Q35 Memory

Controller Hub (MCH)
2x2 Standard
Power Supply
2x12
Standard
Power Supply
2-DIMM per channel DDR2 2-DIMM per channel DDR2

667/800 (Channel-B) 667/800 (Channel-A)
2.2 System Block Diagram

This section will document the common features that are applicable to the Intel®
CoreTM 2 Duo Processor and Intel ® Q35 Express Chipset Development Kit. Figure 2
shows a simple block diagram of the development kit.


Figure 2. Intel® Q35 Express Chipset Development Kit block diagram
2.3 Development Kit Inventory Checklists

This section describes major hardware items which should be available on this
development kit.
Table 3. Development Kit Hardware Items

1x 4-Layer Micro-BTX form factor (targeted dimensions: 10.5” x 10.4”) motherboard
1x Intel® CoreTM 2 Duo E6400 Processors in the LGA775 Socket
2x 1 GBytes DDR2 800 DIMM

1x BTX Heatsink with fan
1x CD-ROM contain chipset drivers (this include Intel® GMA3100 driver)
8x hex standoffs and 4x screws for bench top usage


Table 4. Development Kit Board Specification

1 PCI Express x16, 2 PCIe x1, 1 PCI expansion slots
1394a
• 1 front panel headers for support of 1 port
• 1 back panel port

Universal Serial Bus 2.0
• 2 front panel headers for support of 4 ports
• 1 internal header for support of 2 ports
• 6 back panel ports

6 SATA 3 Gb/sec ports (1 port used for eSATA)
Table 5. Internal I/O headers

2x5 Front Panel I/O header
2x7 Front Panel audio header
1x2 Chassis intrusion header

3 four-wire fan headers
2x8 High Definition audio header
Table 6. Supported Intel Technologies (Sheet 1 of 2)
Technology Features/support Reference Documentation
• Enables remote, down-the-wire management

of out-of-band networked systems regardless
of system state, helping improve efficiency,
Intel® Active Management asset management and system security and
Technology with System availability. http://www.intel.com/technology/
Defense feature (Intel® • System Defense Feature can help block platform-technology/intel-amt/
ICH8 DO only) incoming software attacks, isolate a device
from the network if infected, and proactively
alert embedded system vendors if critical
software agents are missing.
• Dual independent display expands viewable

workspace for devices such as point-of-sale
terminals with two monitors.
• Provides next-generation graphics
Intel® Graphics Media http://www.intel.com/products/chipsets/
performance for advanced embedded
Accelerator 3000 gma3000/demo/demo.html
operating systems.
• Delivers richer visual color and picture clarity
without the need for additional discrete
graphics cards.


Table 6. Supported Intel Technologies (Sheet 2 of 2)
Technology Features/support Reference Documentation
• Helps improve system performance by

optimizing use of available memory
bandwidth and reducing latency of memory
http://www.intel.com/products/chipsets/
Intel® Fast Memory Access access by monitoring all pending read/write
q965_q963/demo/demo.html
requests; allows safe and efficient
overlapping of commands on all system bus
interfaces.
• With a second hard drive added, provides
Intel® Matrix Storage quicker access to digital photo, video and
http://www.intel.com/design/chipsets/
Technology (Intel® ICH8 data files with RAID 0, 5 and 10, and greater
matrixstorage_sb.htm
DO only) data protection against a hard disk drive
failure with RAID 1, 5 and 10.
• Enables premium digital sound and delivers

advanced features such as multiple audio
streams and jack re-tasking. http://www.intel.com/design/chipsets/
Intel® High Definition Audio
• Support for microphone array enables hdaudio.htm
enhanced voice capture for high-quality input
to voice-driven activities.
Table 7. Additional Features

6 Analog audio connectors and 2 digital audio connectors
Piezo speaker for BIOS POST codes

BIOS configuration jumper
Clear CMOS jumper
Power Button
Reset Button
XDP connector
2.4 Processor Support

The Intel® Q35 Development Kit supports the following processors in the LGA775
Socket with FSB of 800/1067/1333 MHz.
These processors, with long-life support are also supported by this development kit:
• Intel® CoreTM 2 Duo E6400 (Included in the development kit)
• Intel® CoreTM 2 Duo E4300
• Intel® Pentium® Dual-Core Processor E2160
• Intel® Celeron® 440
Refer to this link for other processors which is also supported by Intel® Q35 Express
Chipset.
http://developer.intel.com/products/chipsets/Q35_Q33/index.htm
2.5 System Memory

The Intel® Q35 Express Chipset supports two types of memory organization. These are
interleaved mode and asymmetric mode. The Q35 supports:
Listed here are the summary of the system memory supported.


• Non-ECC DDR2 (667/800)

• 512Mb, 1Gb and 2Gb technology
• 4 DIMMs, 4GB maximum per channel, 8GB total memory
• Dual channel (Interleaved) mode. This mode offers the highest throughput for real
world applications. Dual channel mode is enabled when the installed memory
capacities of both DIMM channels are equal. Technology and device width can vary
from one channel to the other but the installed memory capacity for each channel
must be equal. If different speed DIMMs is used between channels, the slowest
memory timing will be used.
• Single channel (Asymmetric) mode. This mode is equivalent to single channel
bandwidth operation for real world applications. This mode is used when only a
single DIMM is installed or the memory capacities are unequal. Technology and
device width can vary from one channel to the other. If different speed DIMMs is
used between channels, the slowest memory timing will be used.
Figure 3 illustrates the memory channel and DIMM configuration.
Figure 3. Memory Channel and DIMM Configuration
Channel A DIMM 0
Channel A DIMM 1
Channel B DIMM 0
Channel B DIMM 1
2.5.1 Dual Channel (Interleaved) Mode Configurations

Figure 4 shows a dual channel configuration using two DIMMs. In this example, the
DIMM 0 sockets of both channels are populated with identical DIMMs.


Figure 4. Dual Channel (Interleaved) Mode Configuration with 2x DIMMs
Figure 5 shows a dual channel configuration using 3 DIMMs. In this example, the
combined capacity of the two DIMMs in Channel A equal the capacity of the single
DIMM in the DIMM 0 socket of Channel B.
Figure 6 shows a dual channel configuration using 4 DIMMs. In this example, the
combined capacity of the 2x DIMMs in Channel A equals the combined capacity of the
2x DIMMs in Channel B. Also, the DIMMs are matched between DIMM 0 and DIMM 1 of
both channels.


2.5.2 Single Channel (Asymmetric) Mode Configurations

Figure 7 shows a single channel configuration using 1x DIMM. In this example, only the
DIMM 0 socket of Channel A is populated. Channel B is not populated.
Figure 7. Single Channel (Asymmetric) Mode Configuration with 1x DIMM
Figure 8 shows a single channel configuration using 3x DIMMs. In this example, the
combined capacity of the 2x DIMMs in Channel A does not equal the capacity of the
single DIMM in the DIMM 0 socket of Channel B.


Figure 8. Single Channel (Asymmetric) Mode Configuration with 3x DIMMs
2.6 Back-Panel Connectors

Figure 9 shows back-panel connectors for the development kit.
Figure 9. Back-panel Connectors
Side
Speaker Line-in Jack
RJ-45 LAN Port Out
1394a Port
Rear Line-out
Speaker Jack
Out
USB Port S/PDIF IN Center/ Mic In Jack

VGA Analog
(Total 6 eSATA Port S/PDIF OUT Sub
Display
Ports) Woofer
Speaker
Out Jack
2.6.1 Audio-Connectors
This development kit board supports up to 7.1-channel audio configuration. It is
backward compatible with 5.1, 2.1 and stereo (2-channel) audio configuration as well.
Line In Jack (Light Blue)
This audio jack is used to for line in devices, including some optical devices.
Line Out Jack (Light Green)
This audio jack is used for line out devices. It’s used in 2.1, 5.1 and 7.1 channel- audio
configuration. It can be used for headphone and stereo speaker as well.
Mic In Jack (Pink)
This audio jack is use for microphone input.


Center/Subwoofer Speaker Out Jack (Orange)
This audio jack is used to connect to center/subwoofer speakers in a 5.1 and 7.1-
channel audio configuration.
Rear Speaker Out (Black)
This audio jack is used to connect to rear speakers in a 5.1 and 7.1-channel audio
configuration.
Side Speaker Out (Gray)
This audio jack is used to connect to side speakers for 7.1-channel audio configuration
only.
2.6.2 RJ-45 LAN Connector with Integrated LEDs

Two LEDs are built into the RJ-45 LAN connector (as shown in Figure 10). Table 8
describes the LED states when the board is powered up and the Gigabit LAN subsystem
is operating.
Figure 10. LAN Connector LED locations
Table 8. LAN Connector LED status

LED Color LED State Condition
Off LAN link is not established
Left Green On LAN link is established
Blinking LAN activity is occurring
N/A Off 10 Mbits/sec data rate is selected

Right Green On 100 Mbits/sec data rate is selected
Yellow On 1000 Mbits/sec data rate is selected
2.6.3 USB Port

The USB port supports the USB 1.1/2.0 specification.
2.6.4 Coaxial S/PDIF In/Out Connector

This connector provides digital audio input and output from external audio system that
supports digital coaxial audio. Ensure that the audio system provides a coaxial digital-
in/out connector.
2.6.5 eSATA Port

This development kits support the first generation eSATA port.


2.7 Debug Features
2.7.1 Extended Debug Probe (XDP)

The reference board provides a JTAG-compliant test access port (TAP) for attachment
of an XDP connector. The XDP connector and associated circuitry enable the use of the
ITP for the particular processor to interrupt the boot sequence and view processor
status.
The XDP connector is located on the backside of the board at location J2BC. Refer to
Figure 11 to the XDP connector location. Take notes that ITP-XDP SSA connector is
needed. Refer to diagram below for the ITP-XDP SSA connector.
Figure 11. ITP-XDP Connector location (J2BC)
ITP-XDP
Connector
ITP-XDP SSA Connector is

needed in order to
connect to ITP-XDP2/3
tools
2.7.2 Power LEDs

Power LEDs on the board indicate when standby power is being applied to the standby
planes. When lit they indicate that no DIMM modules should be inserted or removed. To
install or replace DIMM modules insure that AC power to the power supply is removed
by unplugging the AC power cord from the power supply or placing the switch on the
power supply to the open position.
Caution: Removing DIMM modules when the standby power LEDs is lit could result in damage to
the memory devices on those modules.
2.7.3 Port 80 POST Code LEDs

Two LEDs display the POST codes output from Port 80 to indicate the progress of the
boot sequence or display the POST code of the last operation successfully completed
during the boot sequence. Please refer to Section 3.4 for more information on Port 80
code reference.


2.7.4 Voltage Reference

See Table 9 for details of the expected voltage levels for each voltage rail on the CRB.
Table 9. Voltage Reference detail

Voltage Rail Expected Voltage Voltage Rail Expected Voltage
VCC 5.0 V_1P25_CORE 1.25

VCC3 3.3 V_1P25_CL_MCH 1.25
+12V 12 V_1P25_PCIEXPRESS 1.25
-12V -12 V_SM 1.8
V_5P0_STBY\G 5.0 V_SM_VTT 0.9

V_3P3_STBY\G 3.3 V_3P3_CL 3.3
V_1P5_ICH 1.5 V_3P3_PCIVAUX 3.3

V_1P05_ICH_CORE 1.05 VDD_CLK 3.3
V_FSB_VTT 1.2 VCC_CLK_IO 0.8
VCCP Varies
2.8 Development Kit Major Connectors and Jumpers

Figure 12 shows major jumpers and headers used on the development kit.
Figure 12. Major Jumper and Header Locations
J4LB/J10LB
J6LB
J115LB
J14LB
J15LB
J16LB
J7LB


2.8.1 Jumper Functions

Table 10 provides a list of the setting definitions for the Intel® CoreTM 2 Duo Processor
and Intel ® Q35 Express Chipset Development Kit.
Table 10. Intel® CoreTM 2 Duo Processor and Intel ® Q35 Express Chipset Development
Kit Board Jumpers Description
Jumper Description Default Position
Clear CMOS
J6LB 1-2
(1-2: Normal, 2-3: Clear CMOS)
RTC Reset
J115LB 1-2
(1-2: Normal, 2-3: Clear)
Config /Recovery
J7LB (1-2: Normal, 2-3: Configure, jumper removed – 1-2
recovery)
Manufacturing mode
J4LB/J10LB Empty
(enable if jumper plug-in)
2.8.2 USB 2.0 Front Panel

There are 4 USB 2.0 Front Panel can be found in the development kits board. Front
panel USB header thermistor protection is required. USB front panel is label as U14LB,
U15LB, U16LB and U1FW on the boards. Refer to Figure 12 for header location of
U14LB, U15LB and U16LB. Refer to Figure 13 for U1FW.
Table 11. USB Front Panel

Pin Number Definition
1 5V
2 5V
3 USB Dx-
4 USB Dy-
5 USB Dx+
6 USB Dy+
7 GND
8 GND
9 No pin
10 No connect
2.8.3 1394a Header

The development kit board supports a 1394a solution on the PCIe bus with a single
1394a port on the back panel (see Figure 9) and another header supporting a 1394a
port (see Figure 13). Front panel 1394a header thermistor protection is required.


Figure 13. Location for 1394a Header and USB Front Panel
J24LB
1394a
Header
U1FW
(USB Front
Panel)
Table 12. 1394a Header

Pin Number Definition
1 NDCD A-
2 NSIN A
3 NSOUT A
4 NDTR A-
5 GND
6 NDSR A-
7 NRTS A-
8 NCTS A-
9 NRI A-
10 No Pin
2.9 SPI Removal / Installation Technique

When removing or installing the SPI device, care must be taken to avoid damage to the
SPI socket. The cap is constructed of plastic and can easily be damaged.


2.9.1 SPI Device Removal

To remove the SPI device from the socket, use a tweezer tip to gently pry one leg of the
cap away from the socket. There is a small latch on the bottom of the leg of the cap.
Once the cap latch is disengaged, the cap may be removed without causing damage to
the latches on the ends.
With the SPI device exposed, move the small retaining clip to release the SPI device
from the socket (see Figure 14). The SPI device should now spring up to allow removal
from the socket.
Figure 14. SPI Socket with Retaining Clip
1. Follow the unclench process 2. Clamp the fresh IC at

to unclench the cover. location 1 and location 2 with
tweezers.
3. Remove the fresh IC from

the socket.
2.9.2 SPI Device Installation

To Install an SPI device in a socket, first place the side opposite from the retaining clip
into the socket at an angle of approximately 15 degrees. Continue to gently insert the
device into the socket until the metal retaining clip latches the device in place, as
shown in Figure 15. Carefully place the cap straight down over the device until both
ends latch into the socket. The installation is now complete.


Figure 15. SPI Device Installation
1. Place the fresh IC into the 2. Close the cover.

socket. Match pin 1. on the IC
to pin 1 on the socket.
3. Lock the cover with

the hook.


Intel Core 2 Duo Processor and Intel Q35 Express Chipset—Setting Up and Configuring the
Development Kit
3.0 Setting Up and Configuring the Development Kit
This chapter discusses basic board set up and operation. Please refer to Chapter 2.0 for
the board layout, jumper setting location and the component reference designator.
3.1 Overview
The board consists of a baseboard populated with one Intel® Core™ 2 Duo processor
E6400, the Intel® Q35 Express chipset, and other system board components and
peripheral connectors.
Note: This board is shipped as an open system allowing for maximum flexibility in changing
hardware configuration and peripherals. Since the board is not in a protective chassis,
take extra precaution when handling and operating the system.
Figure 16. Intel® Q35 Development Kits
3.2 Installing Board Standoffs

Caution: The evaluation board in this development kit is shipped as an open system allowing for
maximum flexibility in changing hardware configuration and peripherals in the lab


Setting Up and Configuring the Development Kit—Intel Core 2 Duo Processor and Intel Q35
Express Chipset
environment. Since the board is not in a protective chassis, the user is required to
observe extra precautions when handling and operating the system.
The board is a standard uBTX form factor and provides non-plated mounting holes with
top and bottom ground rings. If the board is not going to be used in a chassis,
standoffs are included for bench top use in the lab environment.
The development kit includes eight hex standoffs and for screws to attach to the board
for bench top use. Four of the standoffs are used to mount the heatsink (refer to
Section 3.3 for heatsink installation). Attach standoffs to the screws to the board at the
following mounting hole locations.
1. Insert screw through top mounting hole for the BTX Heatsink. Refer to Figure 17 for
the mounting hole location.
2. Place standoff on backside of board and hand tighten to screw. Refer to Figure 18
for guide.
3. Repeat for additional standoffs on the board until all standoffs are installed. Refer
to Figure 17 for recommended mounting hole locations.
Figure 17. Mounting Hole Locations
J24LB
Recommended
Mounting Hole
Locations
Mounting Hole for

BTX heatsink
Locations


Development Kit
Figure 18. Mounting the Standoff for BTX Heatsink
3.3 BTX Heatsink Setup with SRM

This section describes BTX casing which uses “Support and Retention Module (SRM)” as
shown in Figure 19.
Note: SRM is not included in this development kits.
Figure 19. Casing with “Support and Retention Module”
3.3.1 SRM Alignment on any BTX Board

Attach the BTX Thermal Module Assembly (TMA) over the processor to the Support and
Retention Module (SRM) by following procedures described below.


Express Chipset
1. Place the uBTX board on the Support and Retention Module (SRM) so that the holes
A, B, C and D on the PCB line up with the corresponding locations on the SRM (see
Figure 19). The board and SRM assembly should look like Figure 20.
Figure 20. BTX board alignment on SRM
2. Place the heatsink on top of the processor. The heatsink should align with the holes
on the SRM and board as shown below Figure 21. Clean the surface of the
processor with isopropyl alcohol before attaching the heatsink.
Figure 21. Heatsink Alignment
3. Use two 6-32 screws to partially tighten the rear end of the heatsink to the board
and the SRM as shown in Figure 22. The screw uses the threaded holes of the SRM
for retention.


Development Kit
Figure 22. Tightening Heatsink on the SRM and Board
3.4 Board Setup and Configuration before Boot

Follow the steps below to operate the board.
Warning: Before starting, ensure the power supply is not connected to the board.
Ensure a safe and static-free work environment before removing any components from
their anti-static packaging. The Development Platform is susceptible to electrostatic
discharge, which may cause failure or unpredictable operation.
The Development Platform must be operated on a flame retardant surface because a

chassis is not included with the platform.
Caution: Connecting the wrong cable or reversing a cable may damage the board and may
damage the device being connected. Since the board is not in a protective chassis, use
caution when connecting cables to the board.
Caution: The power supply cord is the main disconnect device to main power (AC power). The
socket outlet should be installed near the equipment and should be readily accessible.
To avoid shock, ensure that the power cord is connected to a properly wired and
grounded receptacle. Do not connect/disconnect any cables or perform installation/
maintenance of the boards in this product during an electrical storm. Ensure that any
equipment to which this product will be attached is also connected to properly wired
and grounded receptacles.
Note: Ensure that setting up the ATX power supply is the final step performed in the process
of assembly.
1. Physically inspect the motherboard for obvious defects. Note that each reference
board has been tested prior to distribution, but a visual check should be performed
to ensure no damage has occurred during shipping.


Express Chipset
2. Set jumpers to default positions. Refer to Section 2.8.1 for default positions.
3. Install the processor and ensure the 4-pin CPU fan power connector is installed on
header shown in Figure 23.
Figure 23. CPU Fan location
4-pin CPU Fan Power
4. Install the DDR2 DIMM in the Channel A Slot 0 connector. DIMMs should never be
inserted or removed unless the power supply is disconnected from the AC power
source. Refer to Section 2.5 for system memory configuration.
5. Connect a SATA hard drive, USB keyboard, USB mouse, and VGA monitor (video
card is optional).
6. Connect a 2x12 standard power supply and 2x2 standard power supply as well.
Refer to Figure 24 for the location.
7. Plug the power cable into the back of the power supply, leaving the switch in the
OFF position.
8. Once the board is set up, plug the cord into the power source. Switch on the power
supply.
9. Press the power button. Refer to Figure 24 or Figure 1 for power-on button
location.


Development Kit
Figure 24. 2x12 Standard power supply and 2x2 power supply
Power-on button
2x12 Standard
power supply
2x2 Standard
power supply
3.5 Post Codes Definitions

The CRB BIOS writes progress and error codes to Port 80 during POST. These codes are
defined below.
3.5.1 Normal Post Codes

Uncompressed INIT code checkpoints
Before D1 – Early chipset and SIO initialization. NMI disabled.

D1 Perform keyboard controller BAT test. Save power-on CPUID to
scratch CMOS.
D0 Go to flat mode with 4GB limit. Start checksum verification.
D2 Disable cache and begin sizing full memory array.
D3 Additional chipset initialization, re-enable cache.
D4 Test base 512 MB of memory, adjust policies and cache first 8
MB.
D5 Bootblock code copied from ROM to lower system memory. BIOS
now executes out of RAM.
D6 Check for recovery mode and verify main BIOS checksum.
If either in recovery mode or main BIOS checksum is bad, go to check point E0

else goto checkpoint D7.


Express Chipset
D7 Restore CPUID value to register. Bootblock runtime module

transferred to system memory.
D8 Main BIOS runtime code is to be decompressed.
D9 Copy main BIOS into system memory.
E1-E8 OEM memory detection/configuration error. Range reserved for
chipset vendors/OEMs.
EC-EE
Boot Block Recovery Code Checkpoints

E0 Initialize Floppy Controller, DMA controller and interrupt
controller.
E9 Set up floppy controller and data. Attempt to read from floppy.
EA Enable ATAPI hardware. Attempt to read from ARMD and ATAPI
CDROM.
EB Disable ATAPI hardware. Jump back to checkpoint E9.
EF Read error occurred on media. Jump back to checkpoint EB.
EF Floppy read error.
F0 Search for pre-defined recovery file in root directory.
F1 Recovery file not found.
F2 Start reading FAT table and analyze FAT to find the clusters
occupied by the recovery file.
F3 Start reading recovery file cluster by cluster.
F5 Disable L1 cache.
FA Check validity of recovery file configuration against
configuration of FLASH part.
FB Enable FLASH write through POEM and chipset specific method.
Detect FLASH type.
F4 Recovery file size does not match FLASH part size.
FC Erase FLASH.
FD Program FLASH.
FF Flash program successful. Disable FLASH write. Restore CPUID
into register.
Runtime POST Code Checkpoints

03 Disable NMI, Parity, EGA video and DMA controllers. Initialize
BIOS, POST and runtime data area.
04 Verify CMOS checksum. Initialize status register A.
05 Initialize interrupt hardware and interrupt vector table.
06 Do R/W to CH-2 count reg. Initialize CH-0 as system timer.
Install POSTINTCH handler.
Enable IRQ0 in PIC for system timer interrupt.


Development Kit
08 Initialize CPU. The BAT test performed on KBC. Auto detection

of KB and MS.
C0 Early CPU Init Start. Disable cache and init local APIC.
C1 Set up boot strap processor information.
C2 Set up boot strap processor for POST.
C5 Enumerate and set up application processors.
C6 Re-enable cache for boot strap processor.
C7 Early CPU Init Exit.
0A Initialize 8042 compatible keyboard controller.
0B Detect PS/2 mouse.
0C Detect keyboard in KBC port.
0E Test and initialization of different input devices. Uncompress all
language, BIOS logo and Silent logo.
13 Early POST initialization of chipset registers.
11 Going to check pressing of <INS>, <END> key during power-
on.
12 To init CMOS if “Init CMOS in every boot” is set or <END> key
is pressed. Going to disable DMA and Interrupt controllers.
13 Video display is disabled and port-B is initialized. Chipset init
about to begin.
24 Uncompress and initialize platform specific BIOS modules.
30 Initialize System Management Interrupt.
2A Initialize different devices through Device Initialization Manager
(DIM).
2C Detect and initialize video adapter with optional ROM.
2E Initialize all output devices.
31 Allocate memory for ADM module. Uncompress and initialize
ADM module.
33 Initialize silent boot mode. Set window to display text
information.
37 Display sign-on message, CPU information, setup message and
OEM specific information.
38 Initialize different devices through DIM.
39 Initialize DMAC-1 and DMAC-2.
3A Initialize RTC date/time.
3B Test and display total memory in system.
3C Mid POST initialization of chipset registers.
40 Detect peripheral devices.
50 Program memory hole or implementation specific adjustments
to system memory.
52 Update CMOS memory size. Allocate memory for extended BIOS
data area.


Express Chipset
60 Initialize NUM-LOCK status and program typematic rate.

75 Initialize INT-13 and prepare for IPL detection.
78 Initialize IPL devices controlled by BIOS and option ROMs.
7A Initialize option RMs.
7C Generate and write contents of ESCD in NVRAM.
84 Log errors encountered during POST.
85 Display errors and prompt for user response.
87 Execute BIOS setup if requested.
8C Late POST chipset register initialization.
8D Build ACPI tables if supported.
8E Program peripheral parameters. Enable/Disable NMI as
selected.
90 Late POST initialization of system management interrupt.
A0 Check for boot password.
A1 Clean-up work needed before boot to OS.
A2 Prepare runtime image for different BIOS modules. Initialize MS
IRQ Routing Table.
A4 Initialize runtime language module.
A7 Display system configuration screen. Initialize CPU for boot,
program MTRRs.
A8 Prepare CPU for boot including final MTRR values.
A9 Wait for user input at configuration display if needed.
AA Uninstall POST INT1CH vector and INT09 vector. De-initialize
ADM module.
AB Prepare BBS for INT19 boot.
AC End of POST initialization of chipset registers.
B1 Save system context for ACPI.
00 Pass control to OS loader via INT19.
61-70 OEM POST error. Reserved for chipset vendors and system
manufacturers.


Development Kit


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Intel® CoreTM 2 Duo Processor and

Intel ® Q35 Express Chipset

Order Number: 318476-001US

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Intel® CoreTM 2 Duo Processor and Intel ®

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1.0 About This Manual ..................................................................................................... 6

Intel® CoreTM 2 Duo Processor and Intel ®

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6 Dual Channel (Interleaved) Mode Configuration with 4x DIMMs.......................................17

Intel® CoreTM 2 Duo Processor and Intel ®

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Date Revision Description

October 2007 001 Initial release

Intel® CoreTM 2 Duo Processor and Intel ®

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1.0 About This Manual

1.1 Content Overview

Chapter 2.0, “Development Kit Hardware Features”

Chapter 3.0, “Setting Up and Configuring the Development Kit”

1.2 Text Conventions

Intel® CoreTM 2 Duo Processor and Intel ®

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is shown as 0FFH.) Decimal and binary numbers are

1.3 Glossary of Terms and Acronyms

Table 1. Definition (Sheet 1 of 2)

ACPI Advanced Configuration and Power Interface

Core The internal base logic in the (G)MCH

DDR2 A second generation Double Data Rate SDRAM memory technology

GMA 3100 Intel® Graphic Media Accelerator 3100

Intel® CoreTM 2 Duo Processor and Intel ®

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Table 1. Definition (Sheet 2 of 2)

1.4 Support Options

1.4.1 Electronic Support Systems

Product documentation is provided online in a variety of web-friendly formats at:

1.4.2 Additional Technical Support

1.5 Product Literature

Intel® CoreTM 2 Duo Processor and Intel ®

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Table 2. Intel Literature Centers

U.S. (from overseas) 708-296-9333

Europe (U.K.) 44(0)1793-431155

Japan (fax only) 81(0)120-47-88-32

Intel® CoreTM 2 Duo Processor and Intel ®

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2.0 Development Kit Hardware Features

2.1 Intel® Q35 Express Chipset Development Kit Overview

Intel® CoreTM 2 Duo Processor and Intel ®

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Figure 1. Board Features

Intel® Q35 Memory

2-DIMM per channel DDR2 2-DIMM per channel DDR2

2.2 System Block Diagram

Intel® CoreTM 2 Duo Processor and Intel ®

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Figure 2. Intel® Q35 Express Chipset Development Kit block diagram

2.3 Development Kit Inventory Checklists

Table 3. Development Kit Hardware Items