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LG 43LX310C Service Manual

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Internal Use Only

North/Latin America http://aic.lgservice.com


Europe/Africa http://eic.lgservice.com
Asia/Oceania http://biz.lgservice.com

LED TV
SERVICE MANUAL
CHASSIS : LA5CD

MODEL : 43LX310C 43LX310C-UA


CAUTION
BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

P/NO : MFL69152107 (1505-REV00) Printed in Korea


CONTENTS

CONTENTS ............................................................................................... 2

SAFETY PRECAUTIONS ......................................................................... 3

SERVICING PRECAUTIONS .................................................................... 4

SPECIFICATION ....................................................................................... 6

ADJUSTMENT INSTRUCTION ................................................................ 9

TROUBLESHOOTING GUIDE................................................................. 14

BLOCK DIAGRAM................................................................................... 19

EXPLODED VIEW ................................................................................... 20

SCHEMATIC CIRCUIT DIAGRAM ............................................ APPENDIX

Copyright © LG Electronics. Inc. All rights reserved. -2- LGE Internal Use Only
Only for training and service purposes
SAFETY PRECAUTIONS

IMPORTANT SAFETY NOTICE


Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.

General Guidance Leakage Current Hot Check (See below Figure)


Plug the AC cord directly into the AC outlet.
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC Do not use a line Isolation Transformer during this check.
power line. Use a transformer of adequate power rating as this Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor
protects the technician from accidents resulting in personal injury between a known good earth ground (Water Pipe, Conduit, etc.)
from electrical shocks. and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
It will also protect the receiver and it's components from being with 1000 ohms/volt or more sensitivity.
damaged by accidental shorts of the circuitry that may be Reverse plug the AC cord into the AC outlet and repeat AC voltage
inadvertently introduced during the service operation. measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
If any fuse (or Fusible Resistor) in this TV receiver is blown, 0.5 mA.
replace it with the specified. In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
When replacing a high wattage resistor (Oxide Metal Film Resistor, repaired before it is returned to the customer.
over 1 W), keep the resistor 10 mm away from PCB.
Leakage Current Hot Check circuit
Keep wires away from high voltage or high temperature parts.

Before returning the receiver to the customer,

always perform an AC leakage current check on the exposed


metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.

Leakage Current Cold Check(Antenna Cold Check)


With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1 MΩ and 5.2 MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.

Copyright © LG Electronics. Inc. All rights reserved. -3- LGE Internal Use Only
Only for training and service purposes
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service 2. After removing an electrical assembly equipped with ES
manual and its supplements and addenda, read and follow the devices, place the assembly on a conductive surface such as
SAFETY PRECAUTIONS on page 3 of this publication. aluminum foil, to prevent electrostatic charge buildup or expo-
NOTE: If unforeseen circumstances create conflict between the sure of the assembly.
following servicing precautions and any of the safety precautions 3. Use only a grounded-tip soldering iron to solder or unsolder ES
on page 3 of this publication, always follow the safety precautions. devices.
Remember: Safety First. 4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as “anti-static” can generate
General Servicing Precautions electrical charges sufficient to damage ES devices.
1. Always unplug the receiver AC power cord from the AC power 5. Do not use freon-propelled chemicals. These can generate
source before; electrical charges sufficient to damage ES devices.
a. Removing or reinstalling any component, circuit board mod- 6. Do not remove a replacement ES device from its protective
ule or any other receiver assembly. package until immediately before you are ready to install it.
b. Disconnecting or reconnecting any receiver electrical plug or (Most replacement ES devices are packaged with leads electri-
other electrical connection. cally shorted together by conductive foam, aluminum foil or
c. Connecting a test substitute in parallel with an electrolytic comparable conductive material).
capacitor in the receiver. 7. Immediately before removing the protective material from the
CAUTION: A wrong part substitution or incorrect polarity leads of a replacement ES device, touch the protective material
installation of electrolytic capacitors may result in an explo- to the chassis or circuit assembly into which the device will be
sion hazard. installed.
2. Test high voltage only by measuring it with an appropriate CAUTION: Be sure no power is applied to the chassis or circuit,
high voltage meter or other voltage measuring device (DVM, and observe all other safety precautions.
FETVOM, etc) equipped with a suitable high voltage probe. 8. Minimize bodily motions when handling unpackaged replace-
Do not test high voltage by "drawing an arc". ment ES devices. (Otherwise harmless motion such as the
3. Do not spray chemicals on or near this receiver or any of its brushing together of your clothes fabric or the lifting of your
assemblies. foot from a carpeted floor can generate static electricity suf-
4. Unless specified otherwise in this service manual, clean ficient to damage an ES device.)
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable General Soldering Guidelines
non-abrasive applicator; 10 % (by volume) Acetone and 90 % 1. Use a grounded-tip, low-wattage soldering iron and appropriate
(by volume) isopropyl alcohol (90 % - 99 % strength) tip size and shape that will maintain tip temperature within the
CAUTION: This is a flammable mixture. range or 500 °F to 600 °F.
Unless specified otherwise in this service manual, lubrication of 2. Use an appropriate gauge of RMA resin-core solder composed
contacts in not required. of 60 parts tin/40 parts lead.
5. Do not defeat any plug/socket B+ voltage interlocks with which 3. Keep the soldering iron tip clean and well tinned.
receivers covered by this service manual might be equipped. 4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
6. Do not apply AC power to this instrument and/or any of its bristle (0.5 inch, or 1.25 cm) brush with a metal handle.
electrical assemblies unless all solid-state device heat sinks are Do not use freon-propelled spray-on cleaners.
correctly installed. 5. Use the following unsoldering technique
7. Always connect the test receiver ground lead to the receiver a. Allow the soldering iron tip to reach normal temperature.
chassis ground before connecting the test receiver positive (500 °F to 600 °F)
lead. b. Heat the component lead until the solder melts.
Always remove the test receiver ground lead last. c. Quickly draw the melted solder with an anti-static, suction-
8. Use with this receiver only the test fixtures specified in this type solder removal device or with solder braid.
service manual. CAUTION: Work quickly to avoid overheating the circuit
CAUTION: Do not connect the test fixture ground strap to any board printed foil.
heat sink in this receiver. 6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
Electrostatically Sensitive (ES) Devices (500 °F to 600 °F)
Some semiconductor (solid-state) devices can be damaged eas- b. First, hold the soldering iron tip and solder the strand against
ily by static electricity. Such components commonly are called the component lead until the solder melts.
Electrostatically Sensitive (ES) Devices. Examples of typical ES c. Quickly move the soldering iron tip to the junction of the
devices are integrated circuits and some field-effect transistors component lead and the printed circuit foil, and hold it there
and semiconductor “chip” components. The following techniques only until the solder flows onto and around both the compo-
should be used to help reduce the incidence of component dam- nent lead and the foil.
age caused by static by static electricity. CAUTION: Work quickly to avoid overheating the circuit
1. Immediately before handling any semiconductor component or board printed foil.
semiconductor-equipped assembly, drain off any electrostatic d. Closely inspect the solder area and remove any excess or
charge on your body by touching a known earth ground. Alter- splashed solder with a small wire-bristle brush.
natively, obtain and wear a commercially available discharging
wrist strap device, which should be removed to prevent poten-
tial shock reasons prior to applying power to the unit under test.

Copyright © LG Electronics. Inc. All rights reserved. -4- LGE Internal Use Only
Only for training and service purposes
IC Remove/Replacement 3. Solder the connections.
Some chassis circuit boards have slotted holes (oblong) through CAUTION: Maintain original spacing between the replaced
which the IC leads are inserted and then bent flat against the cir- component and adjacent components and the circuit board to
cuit foil. When holes are the slotted type, the following technique prevent excessive component temperatures.
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique Circuit Board Foil Repair
as outlined in paragraphs 5 and 6 above. Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
Removal board causing the foil to separate from or "lift-off" the board. The
1. Desolder and straighten each IC lead in one operation by following guidelines and procedures should be followed whenever
gently prying up on the lead with the soldering iron tip as the this condition is encountered.
solder melts.
2. Draw away the melted solder with an anti-static suction-type At IC Connections
solder removal device (or with solder braid) before removing To repair a defective copper pattern at IC connections use the
the IC. following procedure to install a jumper wire on the copper pattern
Replacement side of the circuit board. (Use this technique only on IC connec-
1. Carefully insert the replacement IC in the circuit board. tions).
2. Carefully bend each IC lead against the circuit foil pad and
solder it. 1. Carefully remove the damaged copper pattern with a sharp
3. Clean the soldered areas with a small wire-bristle brush. knife. (Remove only as much copper as absolutely necessary).
(It is not necessary to reapply acrylic coating to the areas). 2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
"Small-Signal" Discrete Transistor 3. Bend a small "U" in one end of a small gauge jumper wire and
Removal/Replacement carefully crimp it around the IC pin. Solder the IC connection.
1. Remove the defective transistor by clipping its leads as close 4. Route the jumper wire along the path of the out-away copper
as possible to the component body. pattern and let it overlap the previously scraped end of the
2. Bend into a "U" shape the end of each of three leads remaining good copper pattern. Solder the overlapped area and clip off
on the circuit board. any excess jumper wire.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding At Other Connections
leads extending from the circuit board and crimp the "U" with Use the following technique to repair the defective copper pattern
long nose pliers to insure metal to metal contact then solder at connections other than IC Pins. This technique involves the
each connection. installation of a jumper wire on the component side of the circuit
board.
Power Output, Transistor Device
Removal/Replacement 1. Remove the defective copper pattern with a sharp knife.
1. Heat and remove all solder from around the transistor leads. Remove at least 1/4 inch of copper, to ensure that a hazardous
2. Remove the heat sink mounting screw (if so equipped). condition will not exist if the jumper wire opens.
3. Carefully remove the transistor from the heat sink of the circuit 2. Trace along the copper pattern from both sides of the pattern
board. break and locate the nearest component that is directly con-
4. Insert new transistor in the circuit board. nected to the affected copper pattern.
5. Solder each transistor lead, and clip off excess lead. 3. Connect insulated 20-gauge jumper wire from the lead of the
6. Replace heat sink. nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Diode Removal/Replacement Carefully crimp and solder the connections.
1. Remove defective diode by clipping its leads as close as pos- CAUTION: Be sure the insulated jumper wire is dressed so the
sible to diode body. it does not touch components or sharp edges.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.

Fuse and Conventional Resistor


Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.

Copyright © LG Electronics. Inc. All rights reserved. -5- LGE Internal Use Only
Only for training and service purposes
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement.

1. Application range 3. Test method


This spec sheet is applied LED TV with LA5CD chassis 1) Performance: LGE TV test method followed
2) Demanded other specification
- Safety : CE, IEC specification
- EMC : CE, IEC specification
2. Requirement for Test
Each part is tested as below without special appointment.

1) Temperature: 25 °C ± 5 °C(77 °F ± 9 °F), CST: 40 °C ± 5 °C


2) Relative Humidity: 65 % ± 10 %
3) Power Voltage
: Standard input voltage (AC 100-240 V~, 50/60 Hz)
* Standard Voltage of each products is marked by models.
4) Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM.
5) The receiver must be operated for about 5 minutes prior to
the adjustment.

4. General Specification
No Item Specification Result Remark
1. Receiving System ATSC / NTSC-M / 64 & 256 QAM
2. Available Channel 1) VHF : 02~13
2) UHF : 14~69
3) DTV : 02-69
4) CATV : 01~135
5) CADTV : 01~135
3. Input Voltage AC 100 ~ 240V 50/60Hz Mark : 110V, 60Hz (N.America)
4. Market NORTH AMERICA
5. Screen Size 60/65 inch Wide (1920 × 1080) FHD + 120Hz All models without HD models
42/43/49/55 inch Wide (1920 × 1080) FHD + 60Hz All models without HD models
28/32 inch Wide (1366 × 768) HD + 60Hz
6. Aspect Ratio 16:9
7. Tuning System FS
8. Module Direct HC275EXN-VSDP1 CSOT 28LX330C-UA
LC320DUE-FHA3 LGD 32LX340H-UA
LC320DXE-MGA3 LGD 32LX330C -UA
LC420DUE-MGA3 LGD 42LX330C –UA, 42LX530S-UA
NC430EUN-AACR1 LGD 43LX310C-UA
LC430EUE-FHM3 LGD 43LX340H-UA
NC490EUN-AACR1 LGD 49LX310C-UA
LC490EUE-FHM3 LGD 49LX341C –UA, 49LX340H-UA
49LX540S-UA
LC550EUE-FHM3 LGD 55LX341C –UA, 55LX340H-UA,
55LX540S-UA
NC600EUF-VSCN1/3 Sharp 60LX341C-UA, 60LX540S-UA
LC650EUF-FHM3 LGD 65LX341C-UA, 65LX540S-UA
9. Operating Environment 1) Temp : 0 ~ 40 deg
2) Humidity : ~ 80 %
10. Storage Environment 1) Temp : -20 ~ 60 deg
2) Humidity : ~ 85 %

Copyright © LG Electronics. Inc. All rights reserved. -6- LGE Internal Use Only
Only for training and service purposes
5. Supported video resolutions
5.1. RGB Input (PC)
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed DDC
1. 640*350 31.46 70.09 25.17 EGA X
2. 720*400 31.46 70.08 28.32 DOS O
3. 640*480 31.46 59.94 25.17 VESA(VGA) O
4. 800*600 37.87 60.31 40.00 VESA(SVGA) O
5. 1024*768 48.36 60.00 65.00 VESA(XGA) O
6. 1152*864 54.34 60.05 81.62 VESA O
7. 1360*768 47.71 60.01 85.50 VESA (WXGA) O
8. 1280*1024 63.98 60.02 108.0 VESA (SXGA) O
9. 1920*1080 67.50 60.00 148.5 HDTV 1080P O

5.2. Component input(Y, CB/PB, CR/PR)


No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remark
1. 720*480 15.73 60.00 13.513 SDTV ,DVD 480I
2. 720*480 15.73 59.94 13.500 SDTV ,DVD 480I
3. 720*480 31.50 60.00 27.027 SDTV 480P
4. 720*480 31.47 59.94 27.000 SDTV 480P
5. 1280*720 45.00 60.00 74.250 HDTV 720P
6. 1280*720 44.96 59.94 74.176 HDTV 720P
7. 1920*1080 33.75 60.00 74.250 HDTV 1080I
8. 1920*1080 33.72 59.94 74.176 HDTV 1080I
9. 1920*1080 67.50 60.00 148.500 HDTV 1080P
10. 1920*1080 67.432 59.94 148.352 HDTV 1080P
11. 1920*1080 27.00 24.00 74.250 HDTV 1080P
12. 1920*1080 26.97 23.976 74.176 HDTV 1080P
13. 1920*1080 33.75 30.00 74.250 HDTV 1080P
14. 1920*1080 33.71 29.97 74.176 HDTV 1080P

Copyright © LG Electronics. Inc. All rights reserved. -7- LGE Internal Use Only
Only for training and service purposes
5.3. HDMI Input 1 (PC/DTV)
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed DDC
PC (DVI) DDC
1. 640*350 31.46 70.09 25.17 EGA X
2. 720*400 31.46 70.08 28.32 DOS O
3. 640*480 31.46 59.94 25.17 VESA(VGA) O
4. 800*600 37.87 60.31 40.00 VESA(SVGA) O
5. 1024*768 48.36 60.00 65.00 VESA(XGA) O
6. 1152*864 54.34 60.05 81.62 VESA O
7. 1360*768 47.71 60.01 85.50 VESA (WXGA) O
8. 1280*1024 63.98 60.02 108.0 VESA (SXGA) O
9. 1920*1080 67.50 60.00 148.5 HDTV 1080P O
DTV
1 720*480 31.50 60.00 27.027 SDTV 480P
2 720*480 31.47 59.94 27.00 SDTV 480P
3 1280*720 45.00 60.00 74.25 HDTV 720P
4 1280*720 44.96 59.94 74.176 HDTV 720P
5 1920*1080 33.75 60.00 74.25 HDTV 1080I
6 1920*1080 33.72 59.94 74.176 HDTV 1080I
7 1920*1080 67.50 60.00 148.50 HDTV 1080P
8 1920*1080 67.43 59.94 148.352 HDTV 1080P
9 1920*1080 27.00 24.00 74.25 HDTV 1080P
10 1920*1080 26.97 23.97 74.176 HDTV 1080P
11 1920*1080 33.75 30.00 74.25 HDTV 1080P
12 1920*1080 33.71 29.97 74.176 HDTV 1080P

Copyright © LG Electronics. Inc. All rights reserved. -8- LGE Internal Use Only
Only for training and service purposes
ADJUSTMENT INSTRUCTION
1. Application 4. MAIN PCBA Adjustments
This spec. sheet applies to LA5CD Chassis applied LED TV all 4.1. ADC Adjustment
models manufactured in TV factory
4.1.1. Overview
▪ ADC adjustment is needed to find the optimum black level
and gain in Analog-to-Digital device and to compensate RGB
2. Specification deviationI
(1) Because this is not a hot chassis, it is not necessary to use
an isolation transformer. However, the use of isolation 4.1.2. Equipment & Condition
transformer will help protect test instrument. (1) Protocol: RS-232C
(2) Adjustment must be done in the correct order. (2) Inner Pattern
(3) The adjustment must be performed in the circumstance of - Resolution : 1024*768(RGB)
25 ±5 ºC of temperature and 65±10% of relative humidity if - Pattern : Horizontal 100% Color Bar Pattern
there is no specific designation - Pattern level : 0.7±0.1 Vp-p
(4) The input voltage of the receiver must keep 100~240V,
50/60Hz 4.1.3. Adjustment
(5) At first Worker must turn on the SET by using Power Only 4.1.3.1. Adjustment method
key. - Connect to Jig by using RS-232(USB), adjust RGB
(6) The receiver must be operated for about 5 minutes prior to
the adjustment when module is in the circumstance of over * Manual adj (If needed in Final Assembly)
15 ºC - Required equipment : Adjustment R/C
In case of keeping module is in the circumstance of 0°C, it - Enter Service Mode by pushing “ADJ” key,
should be placed in the circumstance of above 15°C for 2 - S tart ‘OTP’ ADC Type by pushing ‘►’ key at [7. ADC
hours Calibration]
In case of keeping module is in the circumstance of below
-20°C, it should be placed in the circumstance of above 4.1.3.2. Adj. protocol (only Internal patten)
15°C for 3 hours.
Protocol CMD 1 CMD 2 Data 1 Data 2 Remark
※ Caution Enter adj a a 00 00 When transfer the
When still image is displayed for a period of 20 minutes or mode ‘Mode In’,Carry the
longer (especially where W/B scale is strong. command.
Digital pattern 13ch and/or Cross hatch pattern 09ch), there Start a d 00 10 Automatically
can some afterimage in the black level area ADC adj adjustment (Use
internal pattern)

4.1.3.3. ADC RGB


3. Adjustment items (1) Press the In-start Key on the ADJ remote after at least 1
3.1. Main PCBA Adjustments min of signal reception. Then, select ADC Calibration. And
(1) ADC adjustment : ADC adjustment is OTP (Auto ADC) Press OK Button on the menu “Start”. The adjustment will
(2) EDID download : HDMI start automatically.
(2) If ADC RGB is successful, “ADC RGB Success” is
■ Above adjustment items can be also performed in Final displayed and ADC RGB is completed. If ADC calibration is
Assembly if needed. failure, “ADC RGB Fail” is displayed.
Both Board-level and Final assembly adjustment items can (3) If ADC calibration is failure, after rechecking ADC pattern
be check using In-Start Menu (1.Adjust Check). or condition, retry calibration
 Component 1080p and RGB-PC Adjust will be calculated by
480i adjust value

3.2. Final assembly adjustment


(1) White Balance adjustment
(2) RS-232C functionality check
(3) Factory Option setting per destination
(4) Shipment mode setting (In-Stop)
(5) GND and HI-POT test

3.3. Appendix
(1) Shipment conditions
(2) Tool option menu
(3) USB Download (S/W Update, Option and Service only)
(4) Preset CH Information

Copyright © LG Electronics. Inc. All rights reserved. -9- LGE Internal Use Only
Only for training and service purposes
4.2. EDID Download 5. Final Assembly Adjustment
4.2.1. Overview 5.1. White Balance Adjustment
▪ I t is a VESA regulation. A PC or a MNT will display an
optimal resolution through information sharing without any 5.1.1. Overview
necessity of user input. It is a realization of “Plug and Play”. 5.1.1.1. W/B adj. Objective & How-it-works
(1) Objective: To reduce each Panel’s W/B deviation
4.2.2. Equipment (2) How-it-works: When R/G/B gain in the OSD is at 192, it
(1) Since EDID data is embedded, EDID download JIG, HDMI means the panel is at its Full Dynamic Range.
cable is not need. - Case : Cool Mode
(2) Adjust by using remote controller To adjust the white balance without the saturation, G
gain should be adjust at least 172 and change the
others (R,B Gain)
4.2.3. Download method * When R or B gain is over 255, G gain can be adjust
(1) Press Adj. key on the Adj. R/C.
below 172)
(2) Select EDID D/L menu.
- Case : Medium / Warm Mode
(3) By pressing Enter key, EDID download will begin
To adjust the white balance without the saturation, Fix
(4) If Download is successful, OK is display, but If Download is
the one of R/G/B gain to 192 (default data) and
failure, NG is displayed.
decrease the others.
(5) If Download is failure, Re-try downloads.
(3) Adj. condition: normal temperature
※Caution : W hen EDID Download, must remove HDMI
- Surrounding Temperature: 25±5 ºC
Cable.
- Warm-up time: About 5 Min
- Surrounding Humidity: 20% ~ 80%
4.2.3.1. Models for EDID Data
- Before White balance adjustment, Keep power on status,
DTS not Deep Color, DTS + AC3 + PCM don’t power off
Ver 0.10 2D
5.1.1.2. Adj. condition and cautionary items
8Bit_HD 8Bit_FHD 10Bit_FHD
(1) Lighting condition in surrounding area surrounding lighting
RGB 87 FF FF should be lower 10 lux. Try to isolate adj. area into dark
HDMI1 6E8D E68D E646 surrounding.
(2) Probe location: Color Analyzer (CA-210) probe should be
HDMI2 6E7D E67D E636 within 10cm and perpendicular of the module surface
(80°~ 100°)
(3) Aging time
PCM not Deep Color, PCM - After Aging Start, Keep the Power ON status during 5
Ver 0.10 2D Minutes.
8Bit_HD 8Bit_FHD 10Bit_FHD - In case of LCD, Back-light on should be checked using no
signal or Full-white pattern.
RGB 87 FF FF
HDMI1 6E08 E608 E6C1 5.1.2. Equipment
HDMI2 6EF8 E6F8 E6B1 (1) Color Analyzer: CA-210 (NCG: CH 9 / WCG: CH12 / LED:
CH14)
(2) A dj. Computer(During auto adj., RS-232C protocol is
AC3 not Deep Color, AC3 + PCM needed)
Ver 0.10 2D (3) Adjust Remocon
(4) V ideo Signal Generator MSPG-925F 720p/204-Gray
8Bit_HD 8Bit_FHD 10Bit_FHD
(Model:217, Pattern:49)
RGB 87 FF → Only when internal pattern is not available
HDMI1 6E96 E696 ※ C olor Analyzer Matrix should be calibrated using
CS-1000
HDMI2 6E86 E686

Copyright © LG Electronics. Inc. All rights reserved. - 10 - LGE Internal Use Only
Only for training and service purposes
5.1.3. Equipment connection 5.1.5. Adjustment method
5.1.5.1. Auto WB calibration
Co lo r Analyzer (1) Set TV in ADJ mode using P-ONLY key (or POWER ON
Probe RS -232C key)
Co m p ut er
(2) Place optical probe on the center of the display
RS -232C - It need to check probe condition of zero calibration before
RS -232C
adjustment.
Pat t ern Generat o r (3) Connect RS-232C Cable
Signal Source
(4) Select mode in ADJ Program and begin a adjustment.
* If TV internal pattern is used, not needed (5) When WB adjustment is completed with OK message,
check adjustment status of pre-set mode (Cool, Medium,
Warm)
5.1.4. Adjustment Command (Protocol) (6) Remove probe and RS-232C cable.
(1) RS-232C Command used during auto-adj ※ W/B Adj. must begin as start command “wb 00 00” , and
RS-232C COMMAND finish as end command “wb 00 ff”, and Adj. offset if need.
Explanation
CMD DATA ID 5.1.5.2. Manual adj. method
Wb 00 00 Begin White Balance adj. (1) Set TV in Adj. mode using POWER ON
(2) Zero Calibrate the probe of Color Analyzer, then place it on
Wb 00 ff End White Balance adj.
(internal pattern disappears ) the center of LCD module within 10cm of the surface..
(3) Press ADJ key -> EZ adjust using adj. R/C -> 6. White-
(2) Adjustment Map Balance then press the cursor to the right (KEY►).
( When KEY(►) is pressed 204 Gray(80IRE) internal
Command Data Range pattern will be displayed)
(lower case ASCII) (Hex.) Default
Adj. item (4) Adjust modes (Cool) : Fix the G gain at least 172 and
(Decimal)
CMD1 CMD2 MIN MAX change the others (R/B Gain).
* If R or B gain is over 255, G gain can be adjust below 172
Cool R Gain j g 00 C0 TBD
(5) Adjust two modes ( Medium / Warm) : Fix the one of R/G/B
G Gain j h 00 C0 TBD gain to 192 (default data) and decrease the others
B Gain j i 00 C0 TBD
※ CASE
R Cut TBD
First adjust the coordinate far away from the target value(x, y).
G Cut TBD (1) x, y > target
B Cut TBD (2) x, y < target
(3) x >target , y < target
Medium R Gain j a 00 C0 TBD
(4) x < target , y > target
G Gain j b 00 C0 TBD - Every 4 case have to fit y value by adjusting B Gain and then
B Gain j c 00 C0 TBD fit x value by adjusting R-Gain
- In this case, increasing/decreasing of B Gain and R Gain can
R Cut TBD be adjusted.
G Cut TBD
B Cut TBD ► How to adjust
(1) Fix G gain at least 172
Warm R Gain j d 00 C0 TBD Adjust R, B Gain (In Case of Mostly Blue Gain Saturation)
G Gain j e 00 C0 TBD (2) W hen R or B Gain > 255, Release Fixed G Gain and
B Gain j f 00 C0 TBD
Readjust

R Cut TBD ※ CASE Medium / Warm


G Cut TBD First adjust the coordinate far away from the target value(x, y).
(1) x, y > target
i) Decrease the R, G.
(2) x, y < target
i) First decrease the B gain,
ii) Decrease the one of the others.
(3) x > target , y < target
i) First decrease B, so make y a little more than the target.
ii) Adjust x value by decreasing the R
(4) x < target , y > target
i) First decrease B, so make x a little more than the target.
ii) Adjust x value by decreasing the G

Copyright © LG Electronics. Inc. All rights reserved. - 11 - LGE Internal Use Only
Only for training and service purposes
5.1.6. Reference 5.2. Option selection per country
( White Balance Adj. coordinate and color 5.2.1. Overview
temperature) (1) Tool option selection is only done for models in Non-USA
▪ Luminance: 204 Gray, 80IRE North America due to rating
▪ S tandard color coordinate and temperature using (2) Applied model: LA4AA Chassis applied to CANADA and
CA-210(CH-14) – by aging time MEXICO
Coordinate
Mode Temp △uv 5.2.2. Country Group selection
x y
(1) Press ADJ key on the Adj. R/C, and then select Country
Cool 0.271 0.270 13,000K 0.0000 Group Menu
Medium 0.286 0.289 9,300K 0.0000 (2) Depending on destination, select US, then on the lower
Country option, select US, CA, MX.
Warm 0.313 0.329 6,500K 0.0000
Selection is done using +, - KEY
▪ Standard color coordinate and temperature using CA-210
5.2.3. Tool Option inspection
(1) LGD , 65”AUO and 50” AUO module ▪ Press Adj. key on the Adj. R/C, then select Tool option.
Coordinate
Mode
x y
Temp △uv 5.3. Ship-out mode check (In-stop)
- After final inspection, press In-Stop key of the Adj. R/C and
Cool 0.269±0.002 0.273±0.002 13,000K 0.0000 check that the unit goes to Stand-by mode.
Medium 0.286±0.002 0.289±0.002 9,300K 0.0000
Warm 0.313±0.002 0.329±0.002 6,500K 0.0000
6. GND and HI-POT Test
(2) O/S Module(AUO, CMI, Sharp,IPS…)
6.1. GND & HI-POT auto-check preparation
Coordinate (1) Check the POWER CABLE and SIGNAL CABE insertion
Mode Temp △uv
x y condition
Cool 0.271±0.002 0.276±0.002 13,000K 0.0000
Medium 0.286±0.002 0.289±0.002 9,300K 0.0000
6.2. GND & HI-POT auto-check
(1) Pallet moves in the station. (POWER CORD / AV CORD is
Warm 0.313±0.002 0.329±0.002 6,500K 0.0000 tightly inserted)
(2) Connect the AV JACK Tester.
▪ Normal line (March ~ December) (3) Controller (GWS103-4) on.
▪ S tandard color coordinate and temperature using (4) GND Test (Auto)
CA-210(CH-14) – by aging time - If Test is failed, Buzzer operates.
Aging Cool Medium Warm - If Test is passed, execute next process (Hi-pot test).
NC (Remove A/V CORD from A/V JACK BOX)
time x y x y x y
5.0 (5) HI-POT test (Auto)
(Min) 271 270 286 289 313 329
- If Test is failed, Buzzer operates.
1 0-2 282 289 297 308 324 348
- If Test is passed, GOOD Lamp on and move to next
2 3-5 281 287 296 306 323 346
process automatically
3 6-9 279 284 294 303 321 343
4 10-19 277 280 292 299 319 339
5 20-35 275 277 290 296 317 336
6.3. Checkpoint
(1) Test voltage
6 36-49 274 274 289 293 316 333 - GND: 1.5KV/min at 100mA
7 50-79 273 272 288 291 315 331 - SIGNAL: 3KV/min at 100mA
8 80-119 272 271 287 290 314 330 (2) TEST time: 1 second
9 Over 120 271 270 286 289 313 329 (3) TEST POINT
- GND Test = P  OWER CORD GND and SIGNAL CABLE
▪ LGD TN Module(Cool temp Spec is 6500K) GND.
- Hi-pot Test = POWER CORD GND and LIVE & NEUTRAL.
Cool Medium Warm
(4) LEAKAGE CURRENT: At 0.5mArms
x y x y x y
spec 286 289 295 305 313 329
target 286 289 295 305 313 329

Copyright © LG Electronics. Inc. All rights reserved. - 12 - LGE Internal Use Only
Only for training and service purposes
7. AUDIO output check 9. Test factor for commercial model
7.1. Audio input condition 9.1. RJP TEST (Only US model)
(1) RF input: Mono, 1KHz sine wave signal, 100% Modulation
(2) CVBS, Component: 1KHz sine wave signal (0.4Vrms)
(3) RGB PC: 1KHz sine wave signal (0.7Vrms)

7.2. Specification
No Item Min Typ Max Unit Remark
1 Audio practi- 9.0 10.0 12.0 W (1) Measurement
cal max 8.5 8.9 9.9 Vrms condition
Output, L/R -E  Q/AVL/Clear RJP port
(Distor- Voice: Off
tion=10% (2) Speaker (8Ω
max Output) Impedance)
(3) 32/37/42/47/55/60
INCH
9.1.1. Overview
2 Audio practi- 9.0 10.0 12.0 W (1) Measurement ▪ Jig(Commercial Check JIG)
cal max 8.5 8.9 9.9 Vrms condition ▪ RJ45 cable
Output, L/R -E Q/AVL/Clear ▪ Power only mode
(Distor- Voice: Off
tion=10% (2) Speaker (8Ω
max Output) Impedance) 9.1.2. Test sequence
(3) 26 INCH (1) Operate JIG(Commercial Check JIG) as shown on picture1
(2) Turn on TV and press “P-ONLY” key on adjustment
remocon.
(3) Connect RJ45 cable into RJP port of the TV set.
8. USB S/W Download (4) Connect RJ45 cable into the JIG.
(5) If shown “OK” it’s normal, “NG” it’s defect.
(optional, Service only) (6) If defect, check the connection once again as done above.
(1) Put the USB Stick to the USB socket (7) If the signal power is no good, check the connection of RF
(2) Automatically detecting update file in USB Stick cable.
- If your downloaded program version in USB Stick is lower
than that of TV set, it didn’t work. Otherwise USB data is
automatically detected.
(3) Show the message “Copying files from memory” 10. External Speaker Out
5HFRPPHQGHG,QSXW6LJQDO
 5)N+]6LQHZDYH

(4) Updating is staring.

(5) Updating Completed, The TV will restart automatically (1) Connect external speaker to speaker out port with phone
(6) If your TV is turned on, check your updated version and jack on TV side as below
Tool option. (2) Check the Max. speaker output is 1W or not. Sine wave
* If downloading version is more high than your TV have, TV with 1KHz will be displayed
can lost all channel data. In this case, you have to channel (3) Check Both of the signal in speaker.
recover. If all channel data is cleared, you didn’t have a DTV/ (Power only mode -> Fived 1W Default)
ATV test on production line. -> Check the input signal(1KHZ, Sine wave) and the wave
of output by utilizing oscilloscope
* After downloading, TOOL OPTION setting is needed again.
(1) Push "IN-START" key in service remote controller.
(2) Select "Tool Option 1" and Push “OK” button.
(3) Punch in the number. (Each model has their number.)

Copyright © LG Electronics. Inc. All rights reserved. - 13 - LGE Internal Use Only
Only for training and service purposes
TROUBLE SHOOTING
1. Power-up boot check
Check stand-by Voltage. No ok Main B/ D 13.2V Line ok
Check 12pin Pow er connector Replace Power board.
P401 5, 6pin : +13.2V Short Check

ok

Check stand-by Voltage No


Replace L403
L403 : +13. 2V

ok

Check X101 clock No


Replace X101
24 MHz
ok
No
Check P401 PWR_ON. No Re-dow nload software. Replace Mstar(IC101) or Main board
1pin : 3.3V

ok

Check Multi Voltage No


Replace Power Board
P401 7, 8pin : A13.2V

ok
Check IC405, IC404, IC400, Q406
Output Voltage
IC405 : 3.5V No
Replace IC405, IC404, IC400, Q406
IC404 : 1.5V
IC400 : 1.1V & 5V
Q406 : 3.3V
ok

Check LVDS Pow er Voltage No


Q405 : 13.2V Replace Q405

ok
No
Check Mstar LVDS Output Replace Mstar(IC101) or Main Board

ok

Check DRV ON Control No


Check Pow er Board
P401 11 pin : High

ok

Change Module

Copyright © LG Electronics. Inc. All rights reserved. - 14 - LGE Internal Use Only
Only for training and service purposes
2. Digital/Analog TV Video

Check RF Cable & Signal

ok
No
Check Tuner 3.3V Power
Replace L3701,L3704
L3701, L3704

ok

Check IF_P/N Signal No


TU3700, 6/7 Pin Bad Tuner. Replace Tuner.

ok

No
Check Mstar LVDS Output Replace Mstar(IC101) or Main Board.

3. AV Video
Check input signal format.
Is it supported?

ok

Check AV Cable for damage


for damage or open conductor

ok

Check JK4400, CVBS Signal Line No


R242 Replace Jack

ok
Check CVBS_DET Signal No
R4410 Replace R4410

ok
No
Check Mstar LVDS Output Replace Mstar(IC101) or Main Board.

Copyright © LG Electronics. Inc. All rights reserved. - 15 - LGE Internal Use Only
Only for training and service purposes
4. RGB Video
Check input signal format.
Is it supported?

ok

Check RGB Cable


for damage or open conductor.

ok

Check P3300 No
R/G/B signal Line Replace Jack

ok
No
Check RGB_DET Signal Replace R3308

ok
No
Check Mstar LVDS Output Replace Mstar(IC101) or Main Board.

5. HDMI Video
Check input signal format.
Is it supported?

ok

Check HDMI Cable conductors


for damage or open conductor.

ok

Check EDID Downlaod No


Replace the defective IC or re-download EDID data

ok

Check JK800, JK801 No


Replace Jack

ok
No
Check HDMI I2C Signal Replace D800. D801

ok

No Replace HDMI1 R802, R805, R803, R808, R809, Q800


Check HDMI_DET (HPD)
HDMI2 R812, R813, R814

ok

No Check other set No


Check HDMI Signal Replace Main Board
If no problem, check signal line

ok

No
Check Mstar LVDS Output Replace Mstar(IC101) or Main Board.

Copyright © LG Electronics. Inc. All rights reserved. - 16 - LGE Internal Use Only
Only for training and service purposes
6. All Source Audio
Check the TV Speaker Menu Off
Toggle the Menu
(Menu -> Audio -> TV Speaker)

On

Check AMP IC(IC5600) Power No


Replace Amp IC(IC5600)
13.2V, 3.3V

ok

Check Mstar AUDIO_MASTER_CLK No


R123 Replace Mstar(IC101) or Main Board.

ok

Check AMP I2C Line No


R111, R112 Check signal line. Or replace Mstar(IC101)

ok
No
Check signal line, Replace Audio AMP IC(IC5600)
L5603, L5604, L5605, L5606
ok

Check Output Signal P5600 No


Replace C5630, C5632, C5633, C5631, C5634, C5635
1, 2, 3, 4 pin.

ok

No Replace connector
Check Connector & P5600
if found to be damaged.

ok

Check speaker resistance No


and connector damage. Replace speaker.

Copyright © LG Electronics. Inc. All rights reserved. - 17 - LGE Internal Use Only
Only for training and service purposes
7. Digital/Analog TV Audio

Check RF Cable & Signal

ok
No
Check Tuner 3.3V Power
Replace L3701,L3704
L3701,L3704

ok

Check IF_P/N Signal No


TU3700, 6/7 Pin Bad Tuner. Replace Tuner.

ok

Check Mstar LVDS Output

8. AV/RGB Audio

Check AV Cable for damage


for damage or open conductor

ok

Check JK4400 Signal Line No


R4408, R4409 Replace Jack

ok

Follow procedure
‘7. All source audio’
trouble shooting guide.

Copyright © LG Electronics. Inc. All rights reserved. - 18 - LGE Internal Use Only
Only for training and service purposes
BLOCK DIAGRAM

Copyright © LG Electronics. Inc. All rights reserved. - 19 - LGE Internal Use Only
Only for training and service purposes
EXPLODED VIEW
IMPORTANT SAFETY NOTICE
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.

900
502

901
400

800
LV1

521

Set + Stand
A10
A2
540

120
200

530

Copyright © LG Electronics. Inc. All rights reserved. - 20 - LGE Internal Use Only
Only for training and service purposes
TP for NON-EU models(except EU and China)

TP for CI slot TP for SCART TP for Headphone


/PCM_REG PCM_D[0] PCM_A[8] CI_TS_CLK SCART1_MUTE HP_LOUT

/PCM_OE PCM_D[1] PCM_A[9] CI_TS_VAL SC1_ID HP_ROUT

/PCM_WE PCM_D[2] PCM_A[10] CI_TS_SYNC SC1_FB SIDE_HP_MUTE

/PCM_IORD PCM_D[3] PCM_A[11] CI_TS_DATA[0] HP_DET

/PCM_IOWR PCM_D[4] PCM_A[12] CI_TS_DATA[1] DTV/MNT_VOUT

/PCM_CE PCM_D[5] PCM_A[13] CI_TS_DATA[2] SCART1_Lout

/PCM_IRQA PCM_D[6] PCM_A[14] CI_TS_DATA[3] SCART1_Rout

/PCM_CD PCM_D[7] CI_TS_DATA[4]

/PCM_WAIT CI_TS_DATA[5] SC1_R+/COMP1_Pr+


TP for L15
PCM_RST CI_TS_DATA[6] SC1_G+/COMP1_Y+ /VBUS_EN

PCM_5V_CTL CI_TS_DATA[7] SC1_B+/COMP1_Pb+ RGB_DDC_SCL

/CI_DET SC1/COMP1_DET RGB_DDC_SDA

SC1/COMP1_L_IN TU_GND_A

SC1/COMP1_R_IN

TP for S2 TP for FE_TS_DATA

FE_TS_DATA[1]

FE_TS_DATA[2]

FE_TS_DATA[3]

FE_TS_DATA[4]

FE_TS_DATA[5]

FE_TS_DATA[6]

FE_TS_DATA[7]

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES


SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS L15_M1A 140702
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. TP_NON_EU 3
POWER

FROM POWER B/D 13.2V +13.2V POWER_DET +13.2V to PANEL_VCC +3.5V_ST to +3.3V_Normal
FET_AOS
TR_KEC R435 Q406-*1
+13.2V +3.5V_ST +13.2V PANEL_VCC
Q401-*1 100K AO3435
2N3906S-RTK

D
+3.5V_ST RESET_IC_KEC OPT
E

TR_NXP R430 IC401 R438


Q401 14K KIC7529M2 4.7K L408
1% +3.5V_ST +3.3V_Normal
MMBT3906(NXP) UBW2012-121F Q405

G
B

R454 SSM3J332R
100 120OHM
VCC 3 2 OUT

D
POWER_DET

S
1 3 OPT FET_TOSHIBA
TR_KEC C415 R431 1 OPT NON_60_SHARP Q406
R412 5.6K C422 R445 C427 R451 R452 L410
Q400-*1 R406 2 33K 0.1uF 1% GND 0.1uF C425 5.6K 5.6K SSM3J332R
33K 0.22uF BLM18PG121SN1D

G
2N3904S 10K 25V 16V 0.1uF
25V

D
+3.5V_ST C 25V

S
R404
B 4.7K POWER_DET_RESET 60_SHARP
R446 C427-*1
C428 C429 C430

G
IC401-*1 120K 0.1uF R443 R447 ZD402
R400 TR_NXP PWM1_CAP 2.2uF 0.1uF 22uF
10K E C Q400 50V 10K 22K 5V
R402 R467-*1 RESET_IC_DIODES 10V 16V 10V
10K B MMBT3904(NXP) 1000pF APX803E29 R442 C C TVS_SEMTECH
TR_NXP TR_KEC
RL_ON P401 50V 10K B Q403
SMAW200-H12S5K(BK)(LTR) VCC 3 2 RESET PANEL_CTL B Q403-*1
PWM1 MMBT3904(NXP)
R401 2N3904S
E PWM1_Pulldown_R
10K +13.2V A13.2V 1 R441 R448 TVS_KEC
R467 E E
OPT 1K GND 10K 2.2K ZD402-*1
PWR_ON 1 2 PDIM#2
+3.3V_Normal TVS_SEMTECH GND 3 4 D13.2V C
L403 C
ZD404 D13.2V D13.2V MLB-201209-0120P-N2 R444 TR_NXP TR_KEC
5V 5 6 10K B Q404
+3.5V_ST A13.2V A13.2V OPT POWER_ON/OFF_1 B Q404-*1
R420 7 8 C402 MMBT3904(NXP) 2N3904S
GND GND OPT 0.1uF C433
1K R419 9 10 4.7uF
100 L414 25V E E
R426 DRV_ON 11 12 PDIM#1 50V
L415
10K R425 C TVS_KEC MLB-201209-0120P-N2
10K TR_NXP
INV_CTL B Q402 ZD404-*1 13
PWM_DIM C446
MMBT3904(NXP) 0.1uF
TR_KEC E R424 25V
Q402-*1 3.9K
2N3904S
C
B

+13.2V to +3.5V_STANDBY +3.5V_Normal to +1.5V_DDR

+13.2V +3.5V_ST
+3.3V_Normal +1.5V_DDR +5V_Normal & +1.10V_VDDC
L409 IC404 L411
AZ1117EH-ADJTRG1 CB2012PK501T
BLM18PG121SN1D
L412
BLM18PG121SN1D IN OUT
ADJ/GND OPT
C426 R449 R453 ZD403 OPT
10uF 1K R1 0 2.5V ZD406
10V 1/16W
C438 C439 1% 5.1v
10uF 0.1uF C431
10uF
25V 25V
IC405 TVS_SEMTECH
ZD405
1.3A R450
200 R2
10V
Vout=0.6(R1/R2)+0.6
1/16W
BD9D321EFJ [EP] 5V 1%
+1.10V_VDDC
R1 R470 +13.2V
10K L405
R468
6.8K
R469
68K R475
EN
1 8
VIN
C443 TVS_KEC
Vout=1.25*(1+R2/R1)+Iadj*R2 4.7uH
THERMAL

1/16W 1/16W 0.1uF


30K 16V ZD405-*1
1% 1% OPT FB BOOT R1 OPT
9

0.047uF
2 7 OPT
DCDC_2uH DCDC_10uH C411 OPT OPT C412 C413 C414

25V
L404 R411
L413 L413-*1 82pF ZD407 ZD401 10uF 22uF 22uF

C410
C440 4.7K 5.1v
2uH 10uH CB2012PK501T 50V 2.5V 6.3V 10V 10V
100pF VREG SW 1%
50V 3 6
C405 C406 R2
C444 C445 C407
SS GND 10uF 10uF 1uF

R471
R2
C441 C442
4
3A 5 22uF
10V
22uF
10V
25V 25V

OPT
10V R413
5.1K
1%
22K 1uF 2200pF

PGND1
1/16W 10V 50V C408 C416
+3.3V_Normal

[EP]

VIN1

BST1
+3.3V_Normal 22pF

SS1

V7V

LX1
1% 2200pF 50V
50V
C417
OPT

24

23

22

21

20

19
R414 3300pF
R403 R405 SS2 COMP1 10K 50V R415
Vout=0.765*(1+R1/R2) 10K 10K C409
2200pF
1
THERMAL
18 0
5%
50V EN1 25
FB1
2 17
EN2 AGND R416
5.1K
R2
R409 3 IC400 16 R422
91K ROSC/SYNC RSET 15K 1%
OPT OPT OPT OPT
C403 R473 C404 R474 4 SN1406035RGER 15
4700pF 30K 4700pF 30K +3.3V_Normal SW_EN FB2
5 14 C419
50V 50V OPT 22pF
R407 NFAULT COMP2 50V
R417
4.7K 6 13 C418
39K

10

11

12
C420 47pF
1%

9
R418 3300pF 50V
USB1_CTL 20K 50V
+5V_Normal

SW_OUT

SW_IN

VIN2

PGND2

LX2

BST2
USB1_CTL_Pull_Down R1 +5V_Normal
R472
Check the pull down 3.3K
R408 C421 L406
when AC Power On with HDD 0.047uF 4.7uH
100K 25V
USB1_OCD
C423 C424
22uF 22uF
+5V_Normal 16V 16V

+5V_USB

OCP_LEVEL_CTL_CAP_EU/AJ_T2
C432
1uF
16V
Vout=0.6(R1/R2)+0.6

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES


SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS L14_CA 150422
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. POWER 4
USB (SIDE)
USB_HDD_CAP1_10uF USB_HDD_CAP2_10uF
C700-*1 C703-*1
10uF 10uF
10V 10V +5V_USB
USB_HDD_CAP1_22uF USB_HDD_CAP2_22uF
C700 C703
22uF 22uF
10V 10V

OPT
ZD700 OPT
JK700
C704
SD05 22uF
5V 10V
3AU04S-305-ZC-(LG)

1
USB DOWN STREAM

R700
2.2
2

SIDE_USB1_DM
R701
2.2
3

SIDE_USB1_DP
OPT OPT OPT
C701 C702 D700
5pF 5pF RCLAMP0502BA
4

50V 50V
5

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES


SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS L14_CA_M1A 2014/05/20
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. USB_S1 7
HDMI (REAR 1 / SIDE 1 MHL)
HDMI_1 HDMI_2 MHL
5V_HDMI_4 5V_DET_HDMI_4
HDMI-2
5V_HDMI_2 5V_DET_HDMI_2 R814
33
R808 HPD4
10K
ESD_HDMI2 ESD_HDMI2
C VA805
TR_KEC VA808
GND
SHIELD R803
1K Q800-*1 B GND
C 2N3904S R809 HDMI-2
20 TR_NXP
10K R815 100
Q800 B E 20 DDC_SDA_4
HP_DET MMBT3904(NXP) HPD2
R802 19 HP_DET R816 100
19 DDC_SCL_4
5V 1.8K ESD_HDMI1 E R810 100 HDMI-2
DDC_SDA_2 5V
18 VA802 18 ESD_HDMI2 ESD_HDMI2
GND R805 R811 100 HDMI-2 VA809 VA810
DDC_SCL_2 GND HDMI-2
17 3.3K 17 R812
DDC_DATA VA800 ESD_HDMI1 ESD_HDMI1 1.8K R813
VA803 VA804 16 DDC_DATA 3.3K
16 ESD_HDMI1_VARISTOR
DDC_CLK
15 DDC_CLK HDMI_CEC
15
NC
HDMI_ARC 14 NC ESD_HDMI2
14
CE_REMOTE HDMI_CEC VA811
13 CE_REMOTE
13
EAG59023302

EAG62611204
CK- AR804
AR801 D803 12 CK- 5.1
12
5.1 1 10 D805
CK_GND CK-_HDMI2
11 CK_GND 1 10
11 CK-_HDMI4
CK+ 2 9
10 CK+_HDMI2
10
CK+ 2 9
CK+_HDMI4
D0- 3 8
9
9
D0- 3 8
D0_GND 4 7
8 D0-_HDMI2
8
D0_GND 4 7
D0-_HDMI4
D0+ 5 6
7 D0+_HDMI2
7
D0+ 5 6
D1- D0+_HDMI4
6 AR802 ESD_HDMI1_TMDS D1-
6 AR803 ESD_HDMI2_TMDS
D1_GND 5.1 IP4294CZ10-TBR
5 D1_GND 5.1 IP4294CZ10-TBR
5
D1+ D804
4 D1+ D806
1 10 D1-_HDMI2 4
3
D2-
D2-
1 10
2 9 D1+_HDMI2 3 D1-_HDMI4
2
D2_GND
D2_GND
2 9
3 8 2 D1+_HDMI4
1
D2+
D2+
3 8
4 7 D2-_HDMI2 1
ESD_HDMI1_VARISTOR 4 7
VA801 5 6 D2+_HDMI2 HDMI-2
D2-_HDMI4
ESD_HDMI2 5 6
JK800 D2+_HDMI4
JK801 VA806
ESD_HDMI1_CAP ESD_HDMI1_TMDS
VA800-*1 ESD_HDMI2_TMDS
1uF IP4294CZ10-TBR BODY_SHIELD

HDMI-2_MHL
10V R818 IP4294CZ10-TBR
20
0
19

ESD_HDMI1_CAP 18
HOT_PLUG_DETECT
MHL_CD_SENSE
This GND Pattern should be very narrow VA801-*1 17
VDD[+5V]

DDC/CEC_GND

HDMI jack burnt problem improvement 16


SDA
This GND Pattern should be very narrow HDMI-2_MHL HDMI-2_MHL
1uF 15

HDMI jack burnt problem improvement OPT C800


14
SCL
HDMI-2_MHL_Non R817
10V 13
RESERVED

CEC
VA807 R819 0.047uF
12
TMDS_CLK-
5.6V 25V 300K
11
TMDS_CLK_SHIELD 0
10

9
TMDS_CLK+

TMDS_DATA0-
MHL Spec
8
TMDS_DATA0_SHIELD
7
TMDS_DATA0+
6

5
TMDS_DATA1-

TMDS_DATA1_SHIELD
HDMI-2_MHL_Non
4
TMDS_DATA1+ R817-*1
3

2
TMDS_DATA2- 3.3K
TMDS_DATA2_SHIELD
1
TMDS_DATA2+

JK801-*1
DAADR019A

HDMI-2_EMI_FOOSUNG

CEC R804
100
HDMI_CEC CEC_REMOTE_S7

HDMI_DIODE_SUZHOU HDMI_DIODE_SUZHOU HDMI_DIODE_SUZHOU


D800-*1 D801-*1 D802-*1
MMBD6100 MMBD6100 MMBD6100
A1

A2

A1

A2

A1

A2
C

5V_HDMI_4 +5V_Normal
5V_HDMI_2 +5V_Normal +3.5V_ST
A1

A2

A1

A2

HDMI_DIODE_KEC
A1

A2

HDMI_DIODE_KEC HDMI_DIODE_KEC
KDS184 KDS184
KDS184 D801 D802
D800
C

C
C

R800 R801 R806 R807


2.7K 2.7K
2.7K 2.7K
DDC_SDA_2 DDC_SDA_4

DDC_SCL_2 DDC_SCL_4

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES


SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS L15_M1A 140813
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
HDMI_R1S1 8
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
SPDIF
SPDIF_OPTIC
+3.3V_Normal JK1001
JST1223-001
1

Fiber Optic
GND
2

VCC
3

SPDIF_OUT
VINPUT
4

SPDIF_OPTIC
OPT C1002
C1001 18pF FIX_POLE
1uF 50V
10V

ESD Ready

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES


SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS L14_CA_M1A 2014/06/02
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. SPDIF 10
+1.5V_DDR +1.5V_DDR +1.5V_DDR +1.5V_DDR
CLose to DDR3 CLose to MAIN IC Option : Ripple Check !!!
DDR_EXT DDR_EXT
R1201 R1204
1K 1K
1% 1%
A-MVREFDQ A-MVREFCA

DDR_EXT DDR_EXT DDR_EXT DDR_EXT DDR_EXT DDR_EXT OPT OPT OPT OPT OPT OPT OPT OPT OPT
R1202 C1201 C1202 R1205 C1213 C1214 C1216 C1217 C1218 C1219 C1220 C1221 C1222 C1223 C1224
1K 0.1uF 1000pF 1K 0.1uF 1000pF 10uF 0.1uF 0.1uF 1uF 1uF 1uF 1uF 1uF 0.1uF
1% 1% 10V

DDR_1600_1G_SS M1A_256M_UO4
IC1201 IC101 M1A_128M_UO4 M1A_256M_AVS+ M1A_128M_AVS+
IC101-*1 IC101-*2 IC101-*3
K4B1G1646G-BCK0 LGE2134(256M) LGE2133(128M) LGE2136(256M) LGE2135(128M)

EAN61836301 E11 E11 E11


B_DDR3_A[0] B_DDR3_A[0] B_DDR3_A[0]
M8 N3 E11 F12 F12 F12
A-MVREFCA VREFCA A0 A-MA0 A-MA0 B_DDR3_A[0] D10
B_DDR3_A[1]
D10
B_DDR3_A[1]
D10
B_DDR3_A[1]
DDR_1600_1G_NAN DDR_1600_2G_SS DDR_1600_2G_SK P7 F12 B_DDR3_A[2] B_DDR3_A[2] B_DDR3_A[2]
A1 A-MA1 A-MA1 B_DDR3_A[1] B10 B10 B10
IC1201-*1 IC1201-*2 IC1201-*3 P3 D10 E15
B_DDR3_A[3]
E15
B_DDR3_A[3]
E15
B_DDR3_A[3]
A2 A-MA2 A-MA2 B_DDR3_A[2] B_DDR3_A[4] B_DDR3_A[4] B_DDR3_A[4]
NT5CB64M16FP-DH K4B2G1646Q-BCK0 H5TQ2G63FFR-PBC H1 N2 B10 B11
B_DDR3_A[5]
B11
B_DDR3_A[5]
B11
B_DDR3_A[5]
EAN61859502 EAN61848803 EAN61829204
A-MVREFDQ VREFDQ A3 A-MA3 A-MA3 B_DDR3_A[3] F14 F14 F14
DDR_EXT P8 E15 C11
B_DDR3_A[6]
C11
B_DDR3_A[6]
C11
B_DDR3_A[6]
N3
A0 VREFCA
M8 N3
A0 VREFCA
M8 N3
A0 VREFCA
M8
A4 A-MA4 A-MA4 B_DDR3_A[4] B_DDR3_A[7] B_DDR3_A[7] B_DDR3_A[7]
P7
A1
P7
A1
P7
A1 R1203 P2 B11 D14 D14 D14
A-MA5 A-MA5 B_DDR3_A[8] B_DDR3_A[8] B_DDR3_A[8]
P3
A2
P3
A2
P3
A2 240 1% A5 B_DDR3_A[5] A12 A12 A12
N2
A3 VREFDQ
H1 N2
A3 VREFDQ
H1 N2
A3 VREFDQ
H1
+1.5V_DDR L8 R8 F14 F16
B_DDR3_A[9]
F16
B_DDR3_A[9]
F16
B_DDR3_A[9]
P8
A4
P8
A4
P8
A4 ZQ A6 A-MA6 A-MA6 B_DDR3_A[6] B_DDR3_A[10] B_DDR3_A[10] B_DDR3_A[10]
P2
A5
P2
A5
P2
A5 R2 C11 D13 D13 D13
R8
A6 ZQ
L8 R8
A6 ZQ
L8 R8
A6 ZQ
L8
A7 A-MA7 A-MA7 B_DDR3_A[7] D15
B_DDR3_A[11]
D15
B_DDR3_A[11]
D15
B_DDR3_A[11]
R2
A7
R2
A7
R2
A7 T8 D14 B_DDR3_A[12] B_DDR3_A[12] B_DDR3_A[12]
T8
A8
T8
A8
T8
A8 A8 A-MA8 A-MA8 B_DDR3_A[8] C12 C12 C12
R3 B2 R3 B2 R3 B2 B2 R3 A12 B_DDR3_A[13] B_DDR3_A[13] B_DDR3_A[13]
A9 VDD_1 A9 VDD_1 A9 VDD_1 E13 E13 E13
L7
A10/AP VDD_2
D9 L7
A10/AP VDD_2
D9 L7
A10/AP VDD_2
D9
VDD_1 A9 A-MA9 A-MA9 B_DDR3_A[9] B_DDR3_A[14] B_DDR3_A[14] B_DDR3_A[14]
R7
A11 VDD_3
G7 R7
A11 VDD_3
G7 R7
A11 VDD_3
G7
DDR_EXT C1203 10uF 10V D9 L7 F16
N7
A12 VDD_4
K2 N7
A12/BC VDD_4
K2 N7
A12/BC VDD_4
K2
VDD_2 A10/AP A-MA10 A-MA10 B_DDR3_A[10] A9 A9 A9
T3
NC_6 VDD_5
K8 T3
A13 VDD_5
K8 T3
A13 VDD_5
K8
DDR_EXT C1204 0.1uF G7 R7 D13 D16
B_DDR3_BA[0]
D16
B_DDR3_BA[0]
D16
B_DDR3_BA[0]
VDD_6
N1
VDD_6
N1
VDD_6
N1
VDD_3 A11 A-MA11 A-MA11 B_DDR3_A[11] B_DDR3_BA[1] B_DDR3_BA[1] B_DDR3_BA[1]
M7
NC_5 VDD_7
N9 M7
NC_5 VDD_7
N9 M7
NC_5 VDD_7
N9
DDR_EXT C1205 0.1uF K2 N7 D15 A10 A10 A10
A-MA12 A-MA12 B_DDR3_BA[2] B_DDR3_BA[2] B_DDR3_BA[2]
VDD_8
R1
VDD_8
R1
VDD_8
R1
VDD_4 A12/BC B_DDR3_A[12]
M2
BA0 VDD_9
R9 M2
BA0 VDD_9
R9 M2
BA0 VDD_9
R9
DDR_EXT C1206 0.1uF K8 T3 C12 C13 C13 C13
N8
BA1
N8
BA1
N8
BA1 VDD_5 A13 A-MA13 A-MA13 B_DDR3_A[13] B_DDR3_MCLK B_DDR3_MCLK B_DDR3_MCLK
M3
BA2
M3
BA2
M3
BA2 DDR_EXT C1207 0.1uF N1 E13 B13 B13 B13
VDDQ_1
A1
VDDQ_1
A1
VDDQ_1
A1
VDD_6 A-MA14 B_DDR3_A[14] E17
B_DDR3_MCLKZ
E17
B_DDR3_MCLKZ
E17
B_DDR3_MCLKZ
J7 A8 J7 A8 J7 A8
C1208 0.1uF N9 M7 B_DDR3_MCLKE B_DDR3_MCLKE B_DDR3_MCLKE
K7
CK VDDQ_2
C1 K7
CK VDDQ_2
C1 K7
CK VDDQ_2
C1 DDR_EXT VDD_7 NC_5
CK VDDQ_3 CK VDDQ_3 CK VDDQ_3
K9
CKE VDDQ_4
C9 K9
CKE VDDQ_4
C9 K9
CKE VDDQ_4
C9
DDR_EXT C1209 0.1uF R1 A9 B8 B8 B8
VDDQ_5
D2
VDDQ_5
D2
VDDQ_5
D2
VDD_8 A-MBA0 B_DDR3_BA[0] B_DDR3_ODT B_DDR3_ODT B_DDR3_ODT
L2 E9 L2 E9 L2 E9 R9 M2 D16 C8 C8 C8
CS VDDQ_6 CS VDDQ_6 CS VDDQ_6
DDR_EXT C1210 0.1uF A-MBA0 A-MBA1 B_DDR3_RASZ B_DDR3_RASZ B_DDR3_RASZ
K1
ODT VDDQ_7
F1 K1
ODT VDDQ_7
F1 K1
ODT VDDQ_7
F1
VDD_9 BA0 A-MCK B_DDR3_BA[1] B9 B9 B9
J3
RAS VDDQ_8
H2 J3
RAS VDDQ_8
H2 J3
RAS VDDQ_8
H2
DDR_EXT C1211 0.1uF N8 DDR_EXT A10 D11
B_DDR3_CASZ
D11
B_DDR3_CASZ
D11
B_DDR3_CASZ
K3
CAS VDDQ_9
H9 K3
CAS VDDQ_9
H9 K3
CAS VDDQ_9
H9
BA1 A-MBA1 DDR_EXT A-MBA2 B_DDR3_BA[2] B_DDR3_WEZ B_DDR3_WEZ B_DDR3_WEZ
L3
WE
L3
WE
L3
WE
DDR_EXT C1212 0.1uF M3 R1207 C1215
NC_1
J1
NC_1
J1
NC_1
J1
BA2 A-MBA2 0.01uF F10 F10 F10
T2
RESET NC_2
J9 T2
RESET NC_2
J9 T2
RESET NC_2
J9 A1 56 C13 B_RESET B_RESET B_RESET
NC_3
L1
NC_3
L1
NC_3
L1
VDDQ_1 1% 50V A-MCK B_DDR3_MCLK
NC_4
L9
NC_4
L9
NC_4
L9 A8 J7 B13 D12 D12 D12
F3
DQSL NC_7
T7 F3
DQSL NC_6
T7 F3
DQSL NC_6
T7
VDDQ_2 CK A-MCKB B_DDR3_MCLKZ B_DDR3_CS0 B_DDR3_CS0 B_DDR3_CS0
G3
DQSL
G3
DQSL
G3
DQSL C1 K7 DDR_EXT E17
VDDQ_3 CK R1208 A-MCKE B_DDR3_MCLKE A19 A19 A19
C7 A9 C7 A9 C7 A9 C9 K9 B_DDR3_DQSL B_DDR3_DQSL B_DDR3_DQSL
DQSU VSS_1 DQSU VSS_1 DQSU VSS_1 B18 B18 B18
B7
DQSU VSS_2
B3 B7
DQSU VSS_2
B3 B7
DQSU VSS_2
B3
VDDQ_4 CKE A-MCKE 56 B_DDR3_DQSU B_DDR3_DQSU B_DDR3_DQSU
VSS_3
E1
VSS_3
E1
VSS_3
E1 D2 1% B8
E7
DML VSS_4
G8 E7
DML VSS_4
G8 E7
DML VSS_4
G8
VDDQ_5 A-MCKB A-MODT B_DDR3_ODT C16 C16 C16
D3
DMU VSS_5
J2 D3
DMU VSS_5
J2 D3
DMU VSS_5
J2 E9 L2 C8 D21
B_DDR3_DQML
D21
B_DDR3_DQML
D21
B_DDR3_DQML
VSS_6
J8
VSS_6
J8
VSS_6
J8
VDDQ_6 CS A/B_DDR3_CS A-MRASB B_DDR3_RASZ B_DDR3_DQMU B_DDR3_DQMU B_DDR3_DQMU
E3
DQL0 VSS_7
M1 E3
DQL0 VSS_7
M1 E3
DQL0 VSS_7
M1 F1 K1 B9
F7
DQL1 VSS_8
M9 F7
DQL1 VSS_8
M9 F7
DQL1 VSS_8
M9
VDDQ_7 ODT A-MODT +1.5V_DDR A-MCASB B_DDR3_CASZ C18 C18 C18
F2
DQL2 VSS_9
P1 F2
DQL2 VSS_9
P1 F2
DQL2 VSS_9
P1 H2 J3 D11 B_DDR3_DQSBL B_DDR3_DQSBL B_DDR3_DQSBL
A-MRASB A-MWEB C17 C17 C17
F8
DQL3 VSS_10
P9 F8
DQL3 VSS_10
P9 F8
DQL3 VSS_10
P9
VDDQ_8 RAS B_DDR3_WEZ B_DDR3_DQSBU B_DDR3_DQSBU B_DDR3_DQSBU
H3 T1 H3 T1 H3 T1 H9 K3
H8
DQL4 VSS_11
T9 H8
DQL4 VSS_11
T9 H8
DQL4 VSS_11
T9
VDDQ_9 CAS A-MCASB DDR_EXT
DQL5 VSS_12 DQL5 VSS_12 DQL5 VSS_12 A20 A20 A20
G2
DQL6
G2
DQL6
G2
DQL6
L3 R1206 F10 B_DDR3_DQL[0] B_DDR3_DQL[0] B_DDR3_DQL[0]
H7
DQL7
H7
DQL7
H7
DQL7 WE A-MWEB 10K A-MRESETB B_RESET A16 A16 A16
B1 B1 B1 J1 B_DDR3_DQL[1] B_DDR3_DQL[1] B_DDR3_DQL[1]
VSSQ_1 VSSQ_1 VSSQ_1 C19 C19 C19
D7 B9 D7 B9 D7 B9
DQU0 VSSQ_2 DQU0 VSSQ_2 DQU0 VSSQ_2 NC_1 C15
B_DDR3_DQL[2]
C15
B_DDR3_DQL[2]
C15
B_DDR3_DQL[2]
C3
DQU1 VSSQ_3
D1 C3
DQU1 VSSQ_3
D1 C3
DQU1 VSSQ_3
D1 J9 T2 D12 B_DDR3_DQL[3] B_DDR3_DQL[3] B_DDR3_DQL[3]
C8
DQU2 VSSQ_4
D8 C8
DQU2 VSSQ_4
D8 C8
DQU2 VSSQ_4
D8
NC_2 RESET A-MRESETB A/B_DDR3_CS B_DDR3_CS0 C20 C20 C20
C2
DQU3 VSSQ_5
E2 C2
DQU3 VSSQ_5
E2 C2
DQU3 VSSQ_5
E2 L1 C14
B_DDR3_DQL[4]
C14
B_DDR3_DQL[4]
C14
B_DDR3_DQL[4]
A7 E8 A7 E8 A7 E8
DQU4 VSSQ_6 DQU4 VSSQ_6 DQU4 VSSQ_6 NC_3 B_DDR3_DQL[5] B_DDR3_DQL[5] B_DDR3_DQL[5]
A2
DQU5 VSSQ_7
F9 A2
DQU5 VSSQ_7
F9 A2
DQU5 VSSQ_7
F9 L9 A19 B21 B21 B21
A-MDQSL B_DDR3_DQL[6] B_DDR3_DQL[6] B_DDR3_DQL[6]
B8
DQU6 VSSQ_8
G1 B8
DQU6 VSSQ_8
G1 B8
DQU6 VSSQ_8
G1
NC_4 B_DDR3_DQSL B15 B15 B15
A3
DQU7 VSSQ_9
G9 A3
DQU7 VSSQ_9
G9 A3
DQU7 VSSQ_9
G9 T7 F3 B18 B_DDR3_DQL[7] B_DDR3_DQL[7] B_DDR3_DQL[7]
A-MA14 A-MDQSL A-MDQSU F18 F18 F18
NC_6 DQSL B_DDR3_DQSU B_DDR3_DQU[0] B_DDR3_DQU[0] B_DDR3_DQU[0]
G3 D19 D19 D19
DQSL A-MDQSLB D17
B_DDR3_DQU[1]
D17
B_DDR3_DQU[1]
D17
B_DDR3_DQU[1]
C16 B_DDR3_DQU[2] B_DDR3_DQU[2] B_DDR3_DQU[2]
A-MDML B_DDR3_DQML E21 E21 E21
A9 C7 D21 B_DDR3_DQU[3] B_DDR3_DQU[3] B_DDR3_DQU[3]
E19 E19 E19
VSS_1 DQSU A-MDQSU A-MDMU B_DDR3_DQMU B_DDR3_DQU[4] B_DDR3_DQU[4] B_DDR3_DQU[4]
B3 B7 D20 D20 D20
B_DDR3_DQU[5] B_DDR3_DQU[5] B_DDR3_DQU[5]
VSS_2 DQSU A-MDQSUB D18 D18 D18
E1 C18 F20
B_DDR3_DQU[6]
F20
B_DDR3_DQU[6]
F20
B_DDR3_DQU[6]
VSS_3 A-MDQSLB B_DDR3_DQSBL B_DDR3_DQU[7] B_DDR3_DQU[7] B_DDR3_DQU[7]
G8 E7 C17
VSS_4 DML A-MDML A-MDQSUB B_DDR3_DQSBU E9 E9 E9
J2 D3 ZQ ZQ ZQ
VSS_5 DMU A-MDMU
J8 A20
VSS_6 A-MDQL0 B_DDR3_DQL[0]
M1 E3 A16
VSS_7 DQL0 A-MDQL0 A-MDQL1 B_DDR3_DQL[1]
M9 F7 C19
VSS_8 DQL1 A-MDQL1 A-MDQL2 B_DDR3_DQL[2]
P1 F2 C15
VSS_9 DQL2 A-MDQL2 A-MDQL3 B_DDR3_DQL[3]
P9 F8 C20
VSS_10 DQL3 A-MDQL3 A-MDQL4 B_DDR3_DQL[4]
T1 H3 C14
VSS_11 DQL4 A-MDQL4 A-MDQL5 B_DDR3_DQL[5]
T9 H8 B21
VSS_12 DQL5 A-MDQL5 A-MDQL6 B_DDR3_DQL[6]
G2 B15
DQL6 A-MDQL6 A-MDQL7 B_DDR3_DQL[7]
H7 F18
DQL7 A-MDQL7 A-MDQU0 B_DDR3_DQU[0]
B1 D19
VSSQ_1 A-MDQU1 B_DDR3_DQU[1]
B9 D7 D17
VSSQ_2 DQU0 A-MDQU0 A-MDQU2 B_DDR3_DQU[2]
D1 C3 E21
VSSQ_3 DQU1 A-MDQU1 A-MDQU3 B_DDR3_DQU[3]
D8 C8 E19
VSSQ_4 DQU2 A-MDQU2 A-MDQU4 B_DDR3_DQU[4]
E2 C2 D20
VSSQ_5 DQU3 A-MDQU3 A-MDQU5 B_DDR3_DQU[5]
E8 A7 D18
VSSQ_6 DQU4 A-MDQU4 A-MDQU6 B_DDR3_DQU[6]
F9 A2 F20
VSSQ_7 DQU5 A-MDQU5 A-MDQU7 B_DDR3_DQU[7]
G1 B8
VSSQ_8 DQU6 A-MDQU6
G9 A3 E9
VSSQ_9 DQU7 A-MDQU7 ZQ
R1209
240
1%

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES


SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS L14_CA_M1A 2014/06/13
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. DDR 12
Serial Flash for SPI boot

+3.5V_ST +3.5V_ST

SPI_FLASH_MACRONIX
OPT IC1300
R1301 MX25L8035EM2I-10G
4.7K C1300
+3.5V_ST 0.1uF
CS# VCC 16V
/SPI_CS 1 8

OPT SO/SIO1 NC/SIO3


R1300 SPI_SDO 2 7
10K

WP#/SIO2 SCLK
/FLASH_WP 3 6 SPI_SCK
R1302
GND SI/SIO0 33
4 5 SPI_SDI

SPI_FLASH_WINBOND
IC1300-*1
W25Q80DVSSIG

CS VCC
1 8

DO[IO1] HOLD[IO3]
2 7

WP[IO2] CLK
3 6

GND DI[IO0]
4 5

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES


SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS L14_CA_M1A 140721
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. S_FLASH 13
SCA , USA , KOREA LITE MODEL TUNER

TU9101 TU9100
TDJH-H301F TDJK-T301F TU_3.3V_NON_FILTER
L9101-*1
0 +3.3V_TU
TU_ATSC NON_DVB_T2 1/8W
5%
+3.3V +3.3V TU_3.3V_FILTER
L9101
1 1 UBW2012-121F

C9111
NC_1 NC
C9108
100pF 0.1uF
+3.3V_TU
2 2 50V 16V
TU_IIC_ATSC_1.8K TU_IIC_ATSC_1.8K
R9114-*1 R9116-*1
DIF_AGC DIF_AGC
HALF_NIM/EU_NON_T2
R9110
should be guarded by ground 1.8K 1.8K
3 3 100
R9114 R9116
C9107 IF_AGC_MAIN 1K 1K
0.1uF
SCL_RF SCL_RF 16V
R9111
TU_IIC_NON_ATSC_1K TU_IIC_NON_ATSC_1K
4 4
HALF_NIM/EU_NON_T2 33
TU_SCL
SDA_RF SDA_RF
5 5
Close to Tuner R9112
33
TU_SDA
DIF[P] DIF[P]
HALF_NIM/EU_NON_T2
R9104 C9112 C9113
OPT OPT
6 6 10 18pF 18pF C9114
20pF
C9115
20pF
IF_P_MSTAR 50V 50V
50V 50V
DIF[N] DIF[N]
7 7
HALF_NIM/EU_NON_T2
IF_N_MSTAR
R9105 OPT Close to Tuner
SIF SIF 10 R9108
C9106 OPT
8 8 Close to the tuner 0
R9117
0
0.1uF 16V
CVBS CVBS
TU_BUFFER
R9109 TU_BUFFER
9 9 0
+3.3V_TU

TU_BUFFER
R9115 TU_BUFFER
HALF_NIM/IF_NON_FILTER_KR 470 R9118
A1 B1 A1 B1 R9104-*1
82
A1 B1 A1 B1 0
TU_SIF

OPT OPT E
47 47 HALF_NIM/IF_NON_FILTER_KR C9109 C9110 Q9100
5pF 5pF MMBT3906(NXP)
R9105-*1 B
50V 50V R9113 TU_BUFFER
0
C
4.7K
SHIELD SHIELD
TU_BUFFER
TU_GND_A
TU_GND_B

TU_GND_B
TU_GND_A

+3.3V_TU

TU_BUFFER TU_BUFFER
R9903 R9904
220 220

OPT
R9900
0
TU_CVBS
TU_BUFFER
R9901 E
TU9101-*1 0 Q9900
TDJH-G301D B
MMBT3906(NXP)
OPT TU_BUFFER
TU_AJ_T/C R9902 C
+3.3V 1K
1
NC_1
2
IF_AGC
3
SCL_RF
4
SDA_RF
5
IF[P]
6
IF[N] +3.3V_TU +3.3V_Normal
7 GND seperation
SIF TU_GND_A
8
TU_GNA_A

TU_GNA_A

TU_GNA_A

TU_GNA_A

TU_GNA_A

TU_GNA_A
R9100

R9101

R9102

R9103

R9106

R9107

CVBS C9101
9 TU_GND_B 1000pF
0

C9100 630V L9100


1000pF UBW2012-121F
OPT
630V
A1 B1 TU_GND_B C9102 C9104 C9105
A1 B1 C9103
22uF 0.1uF 22uF 0.1uF
47 10V 16V 10V 16V

SHIELD

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES


SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS L14_S7LR(M1A) 2014.07.22
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. TUNER_CSA_US 14
LVDS

FOR FHD REVERSE(10bit)


[51Pin LVDS Connector] [30Pin LVDS Connector]
(For FHD 60Hz) Change in S7LR
(For HD 60Hz_Normal)
MO_FHD MIRROR Pol-change
P1800
SP14-11592-01-51Pin RXA4+ RXA0+ RXA0- MO_HD
RXA4- RXA0- RXA0+ P1801
10031HR-30
RXA3+ RXA1+ RXA1-
1
RXA3- RXA1- RXA1+
2
LVDS_SEL 1
RXACK+ RXA2+ RXA2-
3
2
+3.3V_Normal RXACK- RXA2- RXA2+
4 VCOM_SDA 3 VCOM_SDA
RXA2+ RXACK+ RXACK-
5 VCOM_SCL Cell_CSOT_55inch 4 VCOM_SCL
R1806 RXA2- RXACK- RXACK+
6
1K 5
RXA1+ RXA3+ RXA3-
7
6 RXA3+
OPT RXA1- RXA3- RXA3+
8 R1807 7 RXA3-
10K RXA0+ RXA4+ RXA4-
9
8
RXA0- RXA4- RXA4+
10
9 RXACK+
11
10 RXACK-
12 RXA4+ RXB4+ RXB0+ RXB0-
11
13 RXA4- RXB4- RXB0- RXB0+
12 RXA2+
14 RXA3+ RXB3+ RXB1+ RXB1-
13 RXA2-
15 RXA3- RXB3- RXB1- RXB1+
14
16 RXACK+ RXBCK+ RXB2+ RXB2-
15 RXA1+
17 RXACK- RXBCK- RXB2- RXB2+
16 RXA1-
18 RXB2+ RXBCK+ RXBCK-
17
19 RXA2+ RXB2- RXBCK- RXBCK+ LVDS_SEL
18 RXA0+
20 RXA2- RXB1+ RXB3+ RXB3- +3.3V_Normal
19 RXA0-
21 RXB1- RXB3- RXB3+
20
OPT
22 RXA1+ RXB0+ RXB4+ RXB4- R1808
21 3.3K
23 RXA1- RXB0- RXB4- RXB4+
22
24 RXA0+ OPT
23 R1809
MO_FHD_non_55CSOT
25 RXA0- R1801 10K
24
0
26
25
0 PANEL_VCC
27

28 RXB4+
R1812 FOR FHD REVERSE(8bit) 26

Cell_INX_FHD 27
29 RXB4- Change in S7LR 28
30 RXB3+ 29
31 RXB3-
MIRROR Pol-change Shift
30
RXA4+ RXA4+ RXA4- RXA0-
32 RXBCK+
RXA4- RXA4- RXA4+ RXA0+ 31
33 RXBCK-
RXA3+ RXA0+ RXA0- RXA1-
34
RXA3- RXA0- RXA0+ RXA1+
35 RXB2+
RXACK+ RXA1+ RXA1- RXA2-
36 RXB2-
RXACK- RXA1- RXA1+ RXA2+
37
RXA2+ RXA2+ RXA2- RXACK-
38 RXB1+
RXA2- RXA2- RXA2+ RXACK+
39 RXB1-
RXA1+ RXACK+ RXACK- RXA3-
40 RXB0+
MO_FHD_non_55CSOT RXA1- RXACK- RXACK+ RXA3+
41 RXB0- AR1800
0
1/16W RXA0+ RXA3+ RXA3- RXA4-
EU pin assign is different from NON EU.
42
RXA0- RXA3- RXA3+ RXA4+
Because of position of HD wafer.
43

44

45 RXB4+ RXB4+ RXB4- RXB0-


V-COM I2C
46 PANEL_VCC RXB4- RXB4- RXB4+ RXB0+
URSA/VCOM_SCL +3.3V_Normal
47 RXB3+ RXB0+ RXB0- RXB1-

48 RXB3- RXB0- RXB0+ RXB1+ URSA/VCOM_SDA

49 RXBCK+ RXB1+ RXB1- RXB2-


VCOM_I2C_PULL_UP VCOM_I2C_PULL_UP
50 RXBCK- RXB1- RXB1+ RXB2+ R1810 R1811
2K 2K
51 RXB2+ RXB2+ RXB2- RXBCK-
MO_FHD_VCC_CAP VCOM_I2C
C1800 C1801 RXB2- RXB2- RXB2+ RXBCK+ R1804
52 0.1uF 10uF 0
25V 25V RXB1+ RXBCK+ RXBCK- RXB3- VCOM_SCL URSA/VCOM_SCL

RXB1- RXBCK- RXBCK+ RXB3+ VCOM_I2C


R1805
0
RXB0+ RXB3+ RXB3- RXB4- VCOM_SDA URSA/VCOM_SDA

RXB0- RXB3- RXB3+ RXB4+

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES


SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS L14_CA_M1A 140613
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. LVDS 18
USB_2

USB_2 for Wireless Dongle


+5V_USB
USB2_HDD_CAP1_10UF USB2_HDD_CAP2_10UF
C3101-*1 C3103-*2
10uF 10uF
10V 10V

L3100
CB2012PK501T
USB2

USB2_HDD_CAP1_22UF USB2_HDD_CAP2_22UF

ZD3100
C3100 C3101 C3103 USB2
22uF 22uF 22uF SD05
10V 10V 10V 3AU04S-305-ZC-(LG)
5V
OPT JK3100
OPT

1
USB DOWN STREAM
R3103
USB2 2.2

2
WIFI_DM
* USB2_DM
USB2 R3104
2.2

3
WIFI_DP
* USB2_DP
OPT OPT
C3102 C3104
5pF 5pF

4
50V 50V
OPT

5
D3100
RCLAMP0502BA

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES


SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
RS232C

EXT_5V EXT_12V
EXT_5V EXT_12V

RS232C
10
5

IR_OUT 4

R3200 8
100
3
7
R3201
+3.5V_ST 100
2

D3200 6
CDS3C30GTH D3201
30V CDS3C30GTH 1
OPT 30V
OPT

C3200 0.33uF SPG09-DB-009


IC3200 P3200
C3205
MAX3232CDR 0.1uF
+3.5V_ST
SIGN2147483647

C1+ VCC
1 16 D3202
+3.5V_ST BAP70-02 R3202
C3201 1K
0.1uF V+ GND
2 15 50V
C3202
0.1uF C1- DOUT1
3 14
R3203 R3204
4.7K 4.7K
C2+ RIN1
4 13 EU_INT EU_INT
C3203
0.1uF NON_NEC_MICOM
C2- ROUT1 R3205 0
5 12
PM_RXD
NON_NEC_MICOM
V- DIN1 R3206 0
6 11
PM_TXD
C3204
0.1uF NEC_MICOM
DOUT2 DIN2 R3207 0
7 10
UART_RX
NEC_MICOM
RIN2 ROUT2 R3208 0
8 9
UART_TX

EAN41348201

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES


SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
RGB PC
+5V_Normal
D3300
MMBD6100
A2
C
A1

C3307
R3306 0.1uF
R3305 16V
2.2K
2.2K

RGB_DDC_SCL

RGB_DDC_SDA

C3305 C3306
18pF 18pF
50V 50V

DSUB/SC1_VSYNC
* DSUB_VSYNC

DSUB/SC1_HSYNC
OPT OPT
* DSUB_HSYNC OPT OPT OPT VA3305
C3303 C3304
R3300 R3301 VA3300 68pF VA3304 5.6V
68pF 20V 20V
2.4K 10K 50V 50V
ADUC 20S 02 010L ADUC 20S 02 010L
OPT
VA3306
L3301-*1 5.6V
0
NON_EMI_RGB
L3301
SC1_B+/COMP1_Pb+ EMI_RGB
* DSUB_B+ ADUC 20S 02 010L BLM15BD121SN1
OPT RGB_VARISTOR
C3300R3302 VA3301
75 20V
47pF
50V

L3302-*1
0
NON_EMI_RGB
L3302
SC1_G+/COMP1_Y+ EMI_RGB
* DSUB_G+ ADUC 20S 02 010L
OPT BLM15BD121SN1
C3302 RGB_VARISTOR +3.3V_Normal
47pFR3303
75
VA3302
50V 20V

R3307
10K
R3308
L3300-*1 1K
0 DSUB_DET
NON_EMI_RGB
L3300
SC1_R+/COMP1_Pr+ EMI_RGB OPT
VA3307
* DSUB_R+ ADUC 20S 02 010L 5.6V
BLM15BD121SN1
RGB_VARISTOR ADMC 5M 02 200L
C3301
VA3303
47pF R3304 20V
50V 75
OPT
GREEN_GND

DDC_CLOCK
DDC_DATA

BLUE_GND

SYNC_GND
RED_GND

DDC_GND
H_SYNC

V_SYNC
GND_2

GREEN

GND_1
BLUE
RED

NC

SHILED
11

12

13

14

15

16
10
6

9
1

P3300
SPG09-DB-010

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES


SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
External Speaker
EXT_AMP_15Y_CI
IC3400-*1
PAM8124

PVCCL_1 PGNDL_2
1 24

SD PGNDL_1
2 23

EXT SPK AMP PVCCL_2

MUTE
3

4
22

21
LOUT

BSL

LIN AVCC_2
5 20

RIN AVCC_1
6 19
A13.2V
BYPASS GAIN0
+3.5V_ST 7 18

AGND_1 GAIN1
8 17
EXT_SPK
AGND_2 BSR
EXT_SPK L3400 9 16

R3402
47K UBW2012-121F PVCCR_1
10 15
ROUT

VCLAMP PGNDR_2
11 14

EXT_SPK_DET PVCCR_2 PGNDR_1


12 13

EXT_SPK EXT_SPK
HEAD_PHONE C EXT_SPK C3408 C3410
R3400 C3405
Q3400 0.1uF 0.1uF 10uF
47K B 50V
HP_DET P MMBT3904(NXP) 50V 35V
HEAD_PHONE Close to Pin1
E Close to Pin3

EXT_AMP_14Y
IC3400
TPA3124D2PWPR

PVCCL_1 PGNDL_2
1 24
EXT_SPK Close to AMP IC C3415
R3401 SD PGNDL_1 47uF
1K 2 23 25V
AMP_RESET EXT_SPK EXT_SPK EXT_OUT_L
L3401 EXT_SPK OPT
C3411 EXT_SPK
22.0uH R3408 C3413 10K
PVCCL_2 LOUT 4.7K 0.47uF
3 22 50V 0.47uF R3410
EXT_SPK 50V
EXT_SPK C3407
R3403 0.22uF
MUTE BSL 50V
10K EXT_SPK EXT_SPK OPT
SIDE_HP_MUTE 4 21 C3412 C3414
R3409
22.0uH 4.7K 0.47uF 0.47uF
EXT_SPK 50V C3416
LIN AVCC_2 L3402 50V 47uF
EXT_SPK C3401 5 20 EXT_SPK 25V
HP_EXT_SPK_LOUT 1uF EXT_SPK EXT_OUT_R
10V
EXT_SPK
EXT_SPK C3402 RIN AVCC_1 10K
HP_EXT_SPK_ROUT 6 19 R3411
1uF
10V R3404
Close to AMP IC BYPASS GAIN0 10K R3406
7 18 OPT 10K GAIN1 GAIN0 AMP GAIN
EXT_SPK
0 0 20dB
AGND_1 GAIN1
8 17 0 1 26dB
1 0 32dB
AGND_2 BSR R3413
9 16 10K R3407
10K 1 1 36dB
C3406 EXT_SPK
0.22uF OPT
PVCCR_1 ROUT 50V
10 15 EXT_SPK

VCLAMP PGNDR_2
11 14
C3409
0.1uF
50V
PVCCR_2 PGNDR_1 EXT_SPK
12 13
Close to Pin19,20

C3400
1uF
50V
C3403
1uF
50V
C3404
0.1uF
50V
EXT SPK Jack
EXT_SPK EXT_SPK EXT_SPK Close to Pin10 EXT_SPK
JK3400
PEJ034-01
3 E_SPRING

4 R_SPRING
EXT_OUT_R

5 T_SPRING
EXT_OUT_L

7B B_TERMINAL2

6B T_TERMINAL2
EXT_SPK_DET
OPT

VA3400
5.6V

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES


SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
IR + LED + Digital Eye + Control Key
(With IR OUT)

+3.5V_ST

R4603 R4604

SIGN5600026922222
10K 10K
1% 1% IR_10p
R4601 IR_8p
100 P4600
KEY1 12507WR-10L P4601
12507WR-08L
C4602
0.1uF
R4602 16V 1
100 1
KEY2
+3.5V_ST 2
C4603
0.1uF 2
16V
L4600 For EMI 3
BLM18PG121SN1D 3
SIGN5600026822222
4
IR OUT TO RS232C C4600
C4601
1000pF
4

0.1uF 50V 5
5
R4606
1.8K
+3.5V_ST LED_R/BUZZ 6
6
+3.5V_ST OPT
IR_OUT_EU +3.5V_ST VA4600 7
R3501 5.6V 7
1K IR_OUT R4600
3.3K 8
IR_OUT R3503
IR_OUT_EU R4610 8
1K
IR_OUT_EU C R3502
22
10K IR SIGN56000271222222
Q3500 B 9 9
2SC3052 IR_OUT_EU C4604 VA4601
C 100pF
IR_OUT R3504 50V 20V
E 33K
Q3501 B 10
2SC3052

E IR_OUT_US 11
+3.3V_Normal
R3504-*1
10K
IR_OUT_US
R3505
0
IR_Eye_Sensor IR_Eye_Sensor
R4605 R4607 IR_Eye_Sensor
1K 1K R4608
100 IR_Eye_Sensor
SENSOR_SCL C4605
18pF
IR_Eye_Sensor
R4609 50V
100
SENSOR_SDA

IR_Eye_Sensor
C4606
18pF
50V

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES


SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS L15_COMM 2014.07.11
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR IE EYE SENSOR / IR OUT 35
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
COMPONENT & AV

JK4400
PPJ245N2-01

6E [RD2]E-LUG R4408
10K
COMP2_R_IN

VA4400
5.6V C4400 R4411
COMP_LR_ZENER R4400 330pF

5E [RD2]O-SPRING 470K 50V


ATV_330pF
12K

R4409
10K
COMP2_L_IN

4E [RD2]CONTACT VA4401
5.6V C4401 R4412
COMP_LR_ZENER R4401 330pF
470K 50V 12K
ATV_330pF
+3.3V_Normal

5D [WH]O-SPRING R4402
10K

SC1/COMP1_DET

4C [RD1]CONTACT VA4402
R4405
1K
COMP2_DET --> SC1/COMP1_DET
5.6V
ESD_COMP

COMPONENT 5C [RD1]O-SPRING
COMP2_Pr+
& ZD4400
COMP_Pr_ZENER_ROHM
ZD4400-*1
COMP_Pr_ZENER_KEC
AV 7C [RD1]E-LUG-S ZD4401
COMP_Pr_ZENER_ROHM
R4403
75 ZD4401-*1
COMP_Pr_ZENER_KEC

5B [BL]O-SPRING
COMP2_Pb+
ZD4402 ZD4402-*1
COMP_Pb_ZENER_ROHM COMP_Pb_ZENER_KEC
R4404

4A [GN/YL]CONTACT ZD4403
COMP_Pb_ZENER_ROHM
75 ZD4403-*1
COMP_Pb_ZENER_KEC
+3.3V_Normal

R4406

5A [GN/YL]O-SPRING 10K

AV_CVBS_DET
R4410
1K
VA4403
5.6V

6A [GN/YL]E-LUG ESD_COMP

COMP2_Y+/AV_CVBS_IN
ZD4404 ZD4404-*1
R4407
COMP_Y_ZENER_ROHM 75 COMP_Y_ZENER_KEC
ZD4405 3216 ZD4405-*1
1%
COMP_Y_ZENER_ROHM 1/4W COMP_Y_ZENER_KEC

CVBS_OUT_TEST
R4414
0
DTV/MNT_VOUT

CVBS_OUT_TEST
R4413
75

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES


SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS @Entit 14/06/26
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. COMPONENT @pageL
IC102
H27U1G8F2CTR-BC
NAND FLASH MEMORY +3.3V_Normal +3.3V_Normal <CHIP Config>
NC_1 NC_29
(SPI_SDI, PM_LED, PWM_PM) M1A_256M
1 48 LG-NonOS SB51_ExtSPI 3’b000 51boot from SPI IC101
NAND_FLASH_1G_HYNIX
NC_2 NC_28 LG-OS HEMCU_ExtSPI 3’b001 MIPS boot from SPI
2 EAN35669103 47 LGE2134(256M)
NC_3 NC_27 PCM_A[0-7]
3 46 EEPROM CI_TS_CLK
22 +3.5V_ST (IC104)
NC_4 NC_26 CI_TS_DATA[0-7]
4 45 AR101 Y1 V10
TUNER_RESET GPIO78 TS0CLK/GPIO92 CI_TS_DATA[0]
R106 R110 NC_5 I/O7 PCM_A[7] R123 W4 T14 CI_TS_SYNC
1K 3.9K 5 44 AUD_MASTER_CLK 56 5V_DET_HDMI_4 GPIO79 TS0DATA[0]/GPIO82 CI_TS_DATA[1] CI_TS_VAL
T13
NC_6 I/O6 PCM_A[6] AUD_MASTER_CLK_0 TS0DATA[1]/GPIO83 CI_TS_DATA[2]
AR103 6 43 R129 22 K17 U13
22
OPT
I2C_SCL I2C_SCKM3/I2C_DDCR_CK/GPIO77 TS0DATA[2]/GPIO84 CI_TS_DATA[3] from CI SLOT
R/B I/O5 PCM_A[5] R128 22 J15 V15
7 42 C112 I2C_SDA I2C_SDAM3/I2C_DDCR_DA/GPIO76 TS0DATA[3]/GPIO85 CI_TS_DATA[4]
OPT OPT U8 U12
RE I/O4 PCM_A[4] R115 R117 R121 100pF URSA/VCOM_SDA SDAM2/GPIO55
/F_RB TS0DATA[4]/GPIO86 CI_TS_DATA[5]
8 41 4.7K 4.7K 2.7K 50V T7 V13
/PF_OE URSA/VCOM_SCL SCKM2/GPIO56 TS0DATA[5]/GPIO87 CI_TS_DATA[6]
CE NC_25 U7 U14
9 40 DEMOD_SCL SENSOR_SCL SENSOR_SCL SCKM0/GPIO58 TS0DATA[6]/GPIO88
/PF_CE0 V7 T11 CI_TS_DATA[7]
NC_7 NC_24 DEMOD_SDA SENSOR_SDA
C102 SENSOR_SDA SDAM0/GPIO59 TS0DATA[7]/GPIO89
10 39 R126 22 DVB_T2 F6 T12
OPT 10uF DEMOD_SCL I2S_IN_BCK/GPIO159 TS0SYNC/GPIO91 FE_TS_CLK
NC_8 NC_23 10V R127 22 DVB_T2 G6 V12
+3.3V_Normal R107 C101 11 38 DEMOD_SDA I2S_IN_SD/GPIO160 TS0VALID/GPIO90 FE_TS_DATA[0-7]
1K LED_R/BUZZ AA4 Y14
0.1uF VCC_1 VCC_2 AMP_SCL TU_SCL I2C_SCKM1/GPIO80 TS1CLK/GPIO103 FE_TS_SYNC
12 37 Y4 Y16 FE_TS_DATA[0]
OPT FE_TS_VAL_ERR
C103 PM_LED AMP_SDA TU_SDA I2C_SDAM1/GPIO81 TS1DATA[0]/GPIO93 FE_TS_DATA[1]
R104 VSS_1 VSS_2 AA15
13 36 0.1uF
1K
SPI_SDI J6
TS1DATA[1]/GPIO94
Y13 FE_TS_DATA[2] Internal demod out
NC_9 NC_22 AV_CVBS_DET ET_TXD[0]/GPIO62 TS1DATA[2]/GPIO95 FE_TS_DATA[3]
14 35 K6 AA16
AV2_CVBS_DET AV2_CVBS_DET EXT_TX_CLK/GPIO64 TS1DATA[3]/GPIO96 FE_TS_DATA[4] FE_TS_DATA[0]
NC_10 NC_21 OPT W12
15 34 R116 R118 R122 TS1DATA[4]/GPIO97 FE_TS_DATA[0]
G7 AA13 FE_TS_DATA[5]
CLE NC_20 4.7K 4.7K 2.7K COMP2_DET I2S_IN_WS/GPIO158 TS1DATA[5]/GPIO98
16 33 W14 FE_TS_DATA[6]
AR102 TS1DATA[6]/GPIO99 FE_TS_DATA[7]
/PF_CE1 ALE I/O3 PCM_A[3] J4 W13
17 32 DEMOD_RESET DEMOD_RESET ET_COL/GPIO60 TS1DATA[7]/GPIO100
PF_ALE J5 Y15
WE I/O2 PCM_A[2] MODEL_OPT_0 ET_TXD[1]/GPIO61 TS1SYNC/GPIO102
/PF_WE 18 31 W15
MODEL_OPT_1 TS1VALID/GPIO101
/PF_WP WP I/O1 PCM_A[1] H19
19 30
MODEL_OPT_2 LCK/GPIO194
G20 B3 R133 33
AR104 NC_11 I/O0 PCM_A[0] LDE/GPIO195 PM_SPI_SCZ1/GPIO_PM[6]/GPIO13 /SPI_CS
22 R105 20 29 /MHL_OCP_DET G19 A3R134 33
R101 1K LHSYNC/GPIO196 PM_SPI_SCK/GPIO1 SPI_SCK
NC_12 NC_19 22 G21 A4
3.3K 21 28 FRC_RESET FRC_RESET LVSYNC/GPIO197 PM_SPI_SCZ0/GPIO0 SIDE_HP_MUTE
33 R125 C3
NC_13 NC_18 PM_SPI_SDI/GPIO2 SPI_SDI
22 27 J17 A2 R135 33
HP_DET UART2_RX/GPIO69 PM_SPI_SDO/GPIO3 SPI_SDO
NC_14 NC_17 J16
23 26 SC1/COMP1_DET UART2_TX/GPIO70 for SERIAL FLASH
E8 B1
NC_15 NC_16 MHL_OCP_EN UART3_TX/GPIO52 RP EPHY_RP EPHY_RP
24 25 D7 C2
AMP_RESET UART3_RX/GPIO53 TN EPHY_TN EPHY_TN
U6 C1
MODEL_OPT_4 GPIO46[CTS] TP EPHY_TP EPHY_TP
V6 B2
RF_SWITCH_CTL GPIO47[RTS] RN EPHY_RN EPHY_RN
/CI_CD1 33 R124 K15
/CI_CD1 UART1_TX/GPIO48
L16 D2
/CI_CD2 /CI_CD2 UART1_RX/GPIO49 SPDIF_IN/GPIO161 5V_DET_HDMI_2
D1
R132 100 SPDIF_OUT
SPDIF_OUT/GPIO162 SPDIF_OUT
H5 SPDIF_OPTIC
USB1_CTL ET_TX_EN/GPIO63
K5 D8 5V_DET_HDMI_2
MODEL_OPT_5 ET_RXD[0]/GPIO65 HWRESET SOC_RESET
NAND_FLASH_1G_TOSHIBA NAND_FLASH_2G_TOSHIBA NAND_FLASH_1G_SS NAND_FLASH_4G_HYNIX K4 E5
MODEL_OPT_6 ET_MDC/GPIO66 IRIN/GPIO5 IR
EAN61508002 EAN60991002 EAN61857001 EAN61950603 H6 G4
USB1_OCD ET_MDIO/GPIO67 DDCA_CK/UART0_RX RGB_DDC_SCL
IC102-*3 IC102-*4 IC102-*5 IC102-*6 L5 G5
NAND_FLASH_2G_HYNIX_OLD
EAN60708702 TC58NVG0S3HTA00 TC58NVG1S3HTA00 K9F1G08U0D-SCB0 H27U4G8F2ETR-BC /CI_DET ET_RXD[1]/GPIO68 DDCA_DA/UART0_TX RGB_DDC_SDA
IC102-*1 PCM_A[0-14]
H27U2G8F2CTR
PCM_A[0] U17 J18
NC_1
1 48
NC_29
PCM_A[1] PCMADR[0]/NF_AD[0]/GPIO130 PWM0/GPIO71 PWM0
NC_2 NC_28
R18 K18
NC_3
2 47
NC_27
NC_1 NC_29 NC_1 NC_29 NC_1 NC_29 NC_1 NC_29 PCM_A[2] PCMADR[1]/NF_AD[1]/GPIO129 PWM1/GPIO72 PWM1
3 46 1 48 1 48 1 48 1 48 V17 K16
NC_4
4 45
NC_26
PCM_A[3] PCMADR[2]/NF_AD[2]/GPIO127 PWM2/GPIO73 PWM2
NC_5
5 44
I/O7 NC_2 NC_28 NC_2 NC_28 NC_2 NC_28 NC_2 NC_28 R16 L18
NC_6
6 43
I/O6 2 47 2 47 2 47 2 47 PCM_A[4] PCMADR[3]/NF_AD[3]/GPIO126 PWM3/GPIO74 PWM3
R/B I/O5
U16 L17
RE
7 42
I/O4
NC_3 NC_27 NC_3 NC_27 NC_3 NC_27 NC_3 NC_27 PCM_A[5] PCMADR[4]/NF_AD[4]/GPIO104 PWM4/GPIO75 PCM_5V_CTL
8 41 3 46 3 46 3 46 3 46 T17
CE
9 40
NC_25
PCM_A[6] PCMADR[5]/NF_AD[5]/GPIO106
NC_7 NC_24 NC_4 NC_26 NC_4 NC_26 NC_4 NC_26 NC_4 NC_26 W18 T8
10 39
4 45 4 45 4 45 4 45 PCMADR[6]/NF_AD[6]/GPIO107 NF_ALE/GPIO146 PF_ALE +3.3V_Normal
NC_8
11 38
NC_23
PCM_A[7] U20 T9
VCC_1 VCC_2

VSS_1
12 37
VSS_2
NC_5 I/O8 NC_5 I/O8 NC_5 I/O7 NC_5 I/O7 PCM_A[8] PCMADR[7]/NF_AD[7]/GPIO108 NF_CEZ/GPIO142 /PF_CE0 L101
13 36 5 44 5 44 5 44 5 44 Y19 U9 BLM18PG121SN1D
NC_9
14 35
NC_22
PCM_A[9] PCMADR[8]/GPIO113 NF_CLE/GPIO141 /PF_CE1 HALF_NIM/EU_NON_T2
NC_10
15 34
NC_21 NC_6 I/O7 NC_6 I/O7 NC_6 I/O6 NC_6 I/O6 AA19 U11
CLE
16 33
NC_20 6 43 6 43 6 43 6 43 PCM_A[10] PCMADR[9]/GPIO115 NF_RBZ/GPIO147 /F_RB
ALE I/O3
AA20 V9
WE
17 32
I/O2
RY/BY I/O6 RY/BY I/O6 R/B I/O5 R/B I/O5 PCM_A[11] PCMADR[10]/GPIO119 NF_REZ/GPIO144 /PF_OE HALF_NIM/EU_NON_T2 HALF_NIM/EU_NON_T2
18 31 7 42 7 42 7 42 7 42 W21 U10 C119
WP
19 30
I/O1
PCM_A[12] PCMADR[11]/GPIO117 NF_WEZ/GPIO145 /PF_WE R137 0.1uF
NC_11
20 29
I/O0 RE I/O5 RE I/O5 RE I/O4 RE I/O4 V20 T10 10K
NC_12
21 28
NC_19 8 41 8 41 8 41 8 41 PCM_A[13] PCMADR[12]/GPIO109 NF_WPZ/GPIO199 /PF_WP
NC_13 NC_18
Y17 HALF_NIM/EU_NON_T2
NC_14
22 27
NC_17
CE NC_25 CE NC_25 CE NC_25 CE NC_25 PCM_A[14] PCMADR[13]/GPIO112 R140
23 26 9 40 9 40 9 40 9 40 /PCM_CD V18 W2
NC_15
24 25
NC_16
/PCM_CE PCMADR[14]/GPIO111 IF_AGC IF_AGC_MAIN
NC_7 NC_24 NC_7 NC_24 NC_7 NC_24 NC_7 NC_24 V19 W1 0
10 39 10 39 10 39 10 39 PCM_D[0-7] PCMCD_N/GPIO135 SIFM
W19 W3 C120
NC_8 NC_23 NC_8 NC_23 NC_8 NC_23 NC_8 NC_23 PCMCE_N/GPIO120 SIFP 0.047uF
11 38 11 38 11 38 11 38 PCM_D[0] U18 V2
PCMDATA[0]/GPIO131 IM 25V Analog SIF
VCC_1 VCC_2 VCC_1 VCC_2 VCC_1 VCC_2 VCC_1 VCC_2 PCM_D[1] V16 V1 HALF_NIM/EU_NON_T2
12 37 12 37 12 37 12 37 PCMDATA[1]/GPIO132 IP Close to MSTAR
PCM_D[2] W17
VSS_1 VSS_2 VSS_1 VSS_2 VSS_1 VSS_2 VSS_1 VSS_2 PCMDATA[2]/GPIO133 TU_BUFFER
13 36 13 36 13 36 13 36 PCM_D[3] Y20 AA2
PCMDATA[3]/GPIO125 XIN TU_BUFFER C125 R144
NC_9 NC_22 NC_9 NC_22 NC_9 NC_22 NC_9 NC_22 PCM_D[4] R15 Y2 TUNER_IF_100_ohm
14 35 14 35 14 35 14 35 PCMDATA[4]/GPIO124 XOUT R138-*1 0.1uF 47 OPT
PCM_D[5] AA18 C127
NAND_FLASH_2G_HYNIX_NEW
EAN60708703 NC_10 NC_21 NC_10 NC_21 NC_10 NC_21 NC_10 NC_21 PCMDATA[5]/GPIO123 100 TU_BUFFER
IC102-*2
H27U2G8F2DTR-BD 15 34 15 34 15 34 15 34 T15 TU_BUFFER R145 1000pF
PCM_D[6]
PCMDATA[6]/GPIO122 TU_SIF
NC_1 NC_29 CLE NC_20 CLE NC_20 CLE NC_20 CLE NC_20 PCM_D[7] Y21 C126 47
1 48
16 33 16 33 16 33 16 33 PCMDATA[7]/GPIO121 TUNER_IF_100_ohm
NC_2
2 47
NC_28
W20 R139-*1 0.1uF
NC_3 NC_27
3 46 ALE I/O4 ALE I/O4 ALE I/O3 ALE I/O3 /PCM_IORD PCMIORD_N/GPIO116 100
NC_4
4 45
NC_26
17 32 17 32 17 32 17 32 V21
NC_5
5 44
I/O7 /PCM_IOWR PCMIOWR_N/GPIO114
NC_6
6 43
I/O6 WE I/O3 WE I/O3 WE I/O2 WE I/O2 Y18
R/B I/O5
18 31 18 31 18 31 18 31 /PCM_IRQA PCMIRQA_N/GPIO110 Close to MSTAR
RE
7 42
I/O4
T16
8 41 WP I/O2 WP I/O2 WP I/O1 WP I/O1 /PCM_OE PCMOE_N/GPIO118 TUNER_IF_0_ohm HALF_NIM/EU_NON_T2
CE
9 40
NC_25
19 30 19 30 19 30 19 30 R17 IF_N_MSTAR
NC_7
10 39
NC_24 /PCM_REG PCMREG_N/GPIO128 0 0.1uF C121
NC_8 NC_23 NC_11 I/O1 NC_11 I/O1 NC_11 I/O0 NC_11 I/O0 T18 R138 C117
11 38
20 29 20 29 20 29 20 29 OPT
VCC_1
12 37
VCC_2 PCM_RST
W16
PCM_RESET/GPIO134
100pF DTV_IF
VSS_1 VSS_2
13 36 NC_12 NC_19 NC_12 NC_19 NC_12 NC_19 NC_12 NC_19 /PCM_WAIT PCMWAIT_N/GPIO105
NC_9
14 35
NC_22
21 28 21 28 21 28 21 28 U15 TUNER_IF_0_ohm HALF_NIM/EU_NON_T2
NC_10
15 34
NC_21 /PCM_WE PCMWE_N/GPIO198 IF_P_MSTAR
CLE
16 33
NC_20 NC_13 NC_18 NC_13 NC_18 NC_13 NC_18 NC_13 NC_18 0 0.1uF IF_FILTER_AJ/CSA
ALE I/O3
22 27 22 27 22 27 22 27 R139 C118 C122
WE
17 32
I/O2 33pF IF_FILTER_AJ/CSA
18 31 NC_14 NC_17 NC_14 NC_17 NC_14 NC_17 NC_14 NC_17 C124
WP
19 30
I/O1
23 26 23 26 23 26 23 26 33pF
NC_11 I/O0
20 29
NC_12
21 28
NC_19 NC_15 NC_16 NC_15 NC_16 NC_15 NC_16 NC_15 NC_16
NC_13 NC_18
24 25 24 25 24 25 24 25 XTAL_LOAD_15pF
22 27
NC_14
23 26
NC_17 C113 15pF
NC_15 NC_16
24 25

R136
X101

1M
24MHz C114 15pF

XTAL_LOAD_15pF

I2C XTAL_LOAD_18pF XTAL_LOAD_22pF XTAL_LOAD_24pF XTAL_LOAD_27pFXTAL_LOAD_30pF


PM MODEL OPTION PM_MODEL_OPT_0 C113-*1 18pF C113-*2 22pF C113-*5 24pF C113-*3 27pF C113-*4 30pF
DIMMING - HIGH : LCD
+3.5V_ST
+3.3V_Normal - LOW :: PDP XTAL_LOAD_18pF XTAL_LOAD_22pF XTAL_LOAD_24pF XTAL_LOAD_27pF XTAL_LOAD_30pF
M1A_256M C114-*1 18pF C114-*2 22pF C114-*5 24pF C114-*3 27pF C114-*4 30pF

R103
IC101
100 LGE2134(256M)
PWM_DIM PWM2
R102
LCD M1A_128M
R119 IC101-*1
10K 10K
PWM0 R111 R112 R113 R114 U19 D5 LGE2133(128M)
1K 1K 2.2K 2.2K RXA4+
PM_MODEL_OPT_0 LVA4P/TTL_B[0]/HCONV/GPIO170 SAR0/GPIO35 KEY1
R143 T20 F8
10K RXA4- LVA4M/TTL_B[1]/E_O/GPIO171 SAR1/GPIO36 KEY2 U19 D5
PWM3 T21 E7 T20
LVA4P/TTL_B[0]/HCONV/GPIO170 SAR0/GPIO35
F8
RXA3+ LVA3P/TTL_B[2]/FB/GPIO172 SAR2/GPIO37 PM_MODEL_OPT_0 T21
LVA4M/TTL_B[1]/E_O/GPIO171 SAR1/GPIO36
E7
AMP_SDA T19 E6 T19
LVA3P/TTL_B[2]/FB/GPIO172 SAR2/GPIO37
E6
RXA3- LVA3M/TTL_B[3]/OPT_P/GPIO173 SAR3/GPIO38 PANEL_CTL R21
LVA3M/TTL_B[3]/OPT_P/GPIO173 SAR3/GPIO38
D6
AMP_SCL PDP R21 D6 R20
LVACKP/TTL_B[4]/MCLK/GPIO174 SAR4/GPIO39
R120 RXACK+ LVACKP/TTL_B[4]/MCLK/GPIO174 SAR4/GPIO39 SCART1_MUTE R19
LVACKM/TTL_B[5]/GCLK/GPIO175
W10
10K R20 P20
LVA2P/TTL_B[6]/GST/GPIO176 GPIO_PM[13]/GPIO20
Y10
I2C_SDA RXACK- LVACKM/TTL_B[5]/GCLK/GPIO175 LVA2M/TTL_B[7]/POL/GPIO177 GPIO_PM[14]/GPIO21
P3
R19 W10 P19
PM_LED/GPIO4
Y3
I2C_SCL RXA2+ LVA2P/TTL_B[6]/GST/GPIO176 GPIO_PM[13]/GPIO20 MHL_CD_SENSE N20
LVA1P/TTL_G[0]/EPI0+/GPIO178 GPIO_PM[0]/GPIO7
Y5
P20 Y10 N21
LVA1M/TTL_G[1]/EPI0-/GPIO179 PM_SPI_SCZ2/GPIO_PM[10]/GPIO17
W11
RXA2- LVA2M/TTL_B[7]/POL/GPIO177 GPIO_PM[14]/GPIO21 /VBUS_EN N19
LVA0P/TTL_G[2]/EPI1+/GPIO180 GPIO_PM[15]/GPIO22
D3
P3 M21
LVA0M/TTL_G[3]/EPI1-/GPIO181 GPIO_PM[4]/GPIO11
AA3
PM_LED/GPIO4 PM_LED M20
LVB4P/TTL_G[4]/EPI2+/GPIO182 GPIO_PM[7]/GPIO14
W5
P19 Y3 M19
LVB4M/TTL_G[5]/EPI2-/GPIO183 GPIO_PM[8]/GPIO15
D4
RXA1+ LVA1P/TTL_G[0]/EPI0+/GPIO178 GPIO_PM[0]/GPIO7 POWER_DET L20
LVB3P/TTL_G[6]/EPI3+/GPIO184 PWM_PM/GPIO200
L15
N20 Y5 LVB3M/TTL_G[7]/EPI3-/GPIO185 PM_UART_TX/GPIO_PM[1]/GPIO8
Y11
RXA1- LVA1M/TTL_G[1]/EPI0-/GPIO179 PM_SPI_SCZ2/GPIO_PM[10]/GPIO17 AMP_MUTE L19
PM_UART_RX/GPIO_PM[5]/GPIO12
N21 W11 K20
LVBCKP/TTL_R[0]/EPI4+/GPIO186
RXA0+ LVA0P/TTL_G[2]/EPI1+/GPIO180 GPIO_PM[15]/GPIO22 INV_CTL K21
LVBCKM/TTL_R[1]/EPI4-/GPIO187
N19 D3 K19
LVB2P/TTL_R[2]/EPI5+/GPIO188
RXA0- LVA0M/TTL_G[3]/EPI1-/GPIO181 GPIO_PM[4]/GPIO11 POWER_ON/OFF_1 J21
LVB2M/TTL_R[3]/EPI5-/GPIO189

EEPROM M21 AA3 J20


LVB1P/TTL_R[4]/EPI6+/GPIO190

+3.3V_Normal RXB4+ LVB4P/TTL_G[4]/EPI2+/GPIO182 GPIO_PM[7]/GPIO14 RL_ON J19


LVB1M/TTL_R[5]/EPI6-/GPIO191
M20 W5 H20
LVB0P/TTL_R[6]/EPI7+/GPIO192
RXB4- LVB4M/TTL_G[5]/EPI2-/GPIO183 GPIO_PM[8]/GPIO15 /FLASH_WP LVB0M/TTL_R[7]/EPI7-/GPIO193
M19 D4
RXB3+ LVB3P/TTL_G[6]/EPI3+/GPIO184 PWM_PM/GPIO200 LED_R/BUZZ
L20 L15
RXB3- LVB3M/TTL_G[7]/EPI3-/GPIO185 PM_UART_TX/GPIO_PM[1]/GPIO8 PM_TXD
Y11
NVRAM_ST NVRAM_RENESAS NVRAM_ATMEL NVRAM_ROHM L19
PM_UART_RX/GPIO_PM[5]/GPIO12 PM_RXD
C105
IC104 IC104-*1 RXBCK+ LVBCKP/TTL_R[0]/EPI4+/GPIO186
0.1uF IC104-*2 IC104-*3 K20 UO7_128M UO7_256M
M24256-BRMN6TP RXBCK- LVBCKM/TTL_R[1]/EPI4-/GPIO187
R1EX24256BSAS0A AT24C256C-SSHL-T BR24G256FJ-3 K21 IC101-*2 IC101-*3
RXB2+ LVB2P/TTL_R[2]/EPI5+/GPIO188 LGE2135(128M) LGE2136(256M)
K19
E0 VCC RXB2- LVB2M/TTL_R[3]/EPI5-/GPIO189
1 8 A0 VCC A0 VCC A0 VCC J21
1 8 1 8 1 8 U19 D5 U19 D5
RXB1+ LVB1P/TTL_R[4]/EPI6+/GPIO190 T20
LVA4P/TTL_B[0]/HCONV/GPIO170 SAR0/GPIO35
F8 T20
LVA4P/TTL_B[0]/HCONV/GPIO170 SAR0/GPIO35
F8
J20 T21
LVA4M/TTL_B[1]/E_O/GPIO171 SAR1/GPIO36
E7 T21
LVA4M/TTL_B[1]/E_O/GPIO171 SAR1/GPIO36
E7
E1 WC RXB1- LVB1M/TTL_R[5]/EPI6-/GPIO191 LVA3P/TTL_B[2]/FB/GPIO172 SAR2/GPIO37 LVA3P/TTL_B[2]/FB/GPIO172 SAR2/GPIO37
2 7 T19 E6 T19 E6
A1 WP A1 WP A1 WP J19 LVA3M/TTL_B[3]/OPT_P/GPIO173 SAR3/GPIO38 LVA3M/TTL_B[3]/OPT_P/GPIO173 SAR3/GPIO38
2 7 2 7 2 7 R21 D6 R21 D6
A0’h RXB0+ LVB0P/TTL_R[6]/EPI7+/GPIO192 R20
LVACKP/TTL_B[4]/MCLK/GPIO174 SAR4/GPIO39
R20
LVACKP/TTL_B[4]/MCLK/GPIO174 SAR4/GPIO39
H20 R19
LVACKM/TTL_B[5]/GCLK/GPIO175
W10 R19
LVACKM/TTL_B[5]/GCLK/GPIO175
W10
E2 SCL RXB0- LVB0M/TTL_R[7]/EPI7-/GPIO193 LVA2P/TTL_B[6]/GST/GPIO176 GPIO_PM[13]/GPIO20 LVA2P/TTL_B[6]/GST/GPIO176 GPIO_PM[13]/GPIO20
3 6 R108 22 I2C_SCL A2 SCL A2 SCL A2 SCL P20
LVA2M/TTL_B[7]/POL/GPIO177 GPIO_PM[14]/GPIO21
Y10 P20
LVA2M/TTL_B[7]/POL/GPIO177 GPIO_PM[14]/GPIO21
Y10
3 6 3 6 3 6 P3 P3
PM_LED/GPIO4 PM_LED/GPIO4
P19 Y3 P19 Y3
LVA1P/TTL_G[0]/EPI0+/GPIO178 GPIO_PM[0]/GPIO7 LVA1P/TTL_G[0]/EPI0+/GPIO178 GPIO_PM[0]/GPIO7
N20 Y5 N20 Y5
VSS SDA LVA1M/TTL_G[1]/EPI0-/GPIO179 PM_SPI_SCZ2/GPIO_PM[10]/GPIO17 LVA1M/TTL_G[1]/EPI0-/GPIO179 PM_SPI_SCZ2/GPIO_PM[10]/GPIO17
4 5 R109 22 VSS SDA GND SDA GND SDA N21 W11 N21 W11
I2C_SDA 4 5 4 5 4 5 N19
LVA0P/TTL_G[2]/EPI1+/GPIO180 GPIO_PM[15]/GPIO22
D3 N19
LVA0P/TTL_G[2]/EPI1+/GPIO180 GPIO_PM[15]/GPIO22
D3
LVA0M/TTL_G[3]/EPI1-/GPIO181 GPIO_PM[4]/GPIO11 LVA0M/TTL_G[3]/EPI1-/GPIO181 GPIO_PM[4]/GPIO11
M21 AA3 M21 AA3
C104 C106 M20
LVB4P/TTL_G[4]/EPI2+/GPIO182 GPIO_PM[7]/GPIO14
W5 M20
LVB4P/TTL_G[4]/EPI2+/GPIO182 GPIO_PM[7]/GPIO14
W5
LVB4M/TTL_G[5]/EPI2-/GPIO183 GPIO_PM[8]/GPIO15 LVB4M/TTL_G[5]/EPI2-/GPIO183 GPIO_PM[8]/GPIO15
8pF 8pF M19
LVB3P/TTL_G[6]/EPI3+/GPIO184 PWM_PM/GPIO200
D4 M19
LVB3P/TTL_G[6]/EPI3+/GPIO184 PWM_PM/GPIO200
D4
L20 L15 L20 L15
EAN61548301 OPT OPT LVB3M/TTL_G[7]/EPI3-/GPIO185 PM_UART_TX/GPIO_PM[1]/GPIO8
Y11
LVB3M/TTL_G[7]/EPI3-/GPIO185 PM_UART_TX/GPIO_PM[1]/GPIO8
Y11
EAN62389501 EAN61133501 EAN62389502 L19
LVBCKP/TTL_R[0]/EPI4+/GPIO186
PM_UART_RX/GPIO_PM[5]/GPIO12
L19
LVBCKP/TTL_R[0]/EPI4+/GPIO186
PM_UART_RX/GPIO_PM[5]/GPIO12

K20 K20
LVBCKM/TTL_R[1]/EPI4-/GPIO187 LVBCKM/TTL_R[1]/EPI4-/GPIO187
K21 K21
LVB2P/TTL_R[2]/EPI5+/GPIO188 LVB2P/TTL_R[2]/EPI5+/GPIO188
K19 K19
LVB2M/TTL_R[3]/EPI5-/GPIO189 LVB2M/TTL_R[3]/EPI5-/GPIO189
J21 J21
LVB1P/TTL_R[4]/EPI6+/GPIO190 LVB1P/TTL_R[4]/EPI6+/GPIO190
J20 J20
LVB1M/TTL_R[5]/EPI6-/GPIO191 LVB1M/TTL_R[5]/EPI6-/GPIO191
J19 J19
LVB0P/TTL_R[6]/EPI7+/GPIO192 LVB0P/TTL_R[6]/EPI7+/GPIO192
H20 H20
LVB0M/TTL_R[7]/EPI7-/GPIO193 LVB0M/TTL_R[7]/EPI7-/GPIO193

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES


SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS L14_CA_M1A 150116
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. MAIN1_NON_EU 51
MODEL OPTION ("MO")
+3.3V_Normal PIN NAME PIN NO. LOW HIGH +1.10V_VDDC
MODEL OPTION
VDDC 1.05V +1.10V_VDDC
MO_DVB_T2/C/S2
MODEL_OPT_0 J5 MO_FHD MO_HD Normal 2.5V VDDC : 2026mA
MO_DUALSTREAM

MO_S/W_EU/AJ
DDR_EXT:256

DDR_EXT:128
1K

1K

1K

1K

1K

1K

1K
1K

MO_S/W_AJ MODEL_OPT_1 H19 MO_S/W_AJ

0.1uF
MO_S/W_NON_AJ
MO_M120


MO_HD

10V

10V
M1A 2.5V embedded

1uF

1uF
MODEL_OPT_2 G20 MO_DVB_T/C MO_DVB_T2/C/S2

C237
R212

R214

R216

R218

R219

R221

R224

C235
R210

G19

10uF

10uF
MODEL_OPT_3 MO_M120_NON MO_M120

C240

C244

C247
IF_AGC_SEL
R205 OPT 100
MODEL_OPT_0
MODEL_OPT_4 U6 DDR_EXT:256 or NON DDR_EXT : 128
R206 OPT100
MODEL_OPT_1
R207 OPT100 MODEL_OPT_5 K5 MO_S/W_TW MO_S/W_EU/AJ
MODEL_OPT_2
AUD_LRCH MODEL_OPT_6 K4 DDR_EXT:128 or NON
R201 OPT 100 DDR_EXT : 256
MODEL_OPT_4
R202 OPT 100 MODEL_OPT_5 MODEL_OPT_7 L5 MO_DUALSTREAM_NON MO_DUALSTREAM
R203 OPT 100 MODEL_OPT_6
Normal Power 3.3V
DDR_EXT:128 or NON

DDR_EXT:256 or NON

AUD_LRCK * Dual Stream is only Korea 3D spec


M1A_256M
MO_DUALSTREAM_NON

+3.3V_Normal VDD33
MO_S/W_NON_AJ

IC101
1K
MO_M120_NON
1K
1K

1K

1K

1K

1K

1K
MO_DVB_T/C

Memory OPTION
MO_S/W_TW

L204
LGE2134(256M)
MO_FHD

BLM18PG121SN1D
R222

0.1uF
0.1uF

0.1uF
Memory

0.1uF
Auto

0.1uF
R211
R209

R213

R215

R217

R220

10uF
R223

MODEL_OPT_4 MODEL_OPT_6

C236 10uF
R4 U3

10V

10V
INT+EXT Det AVDD_AU33 AVDD_AU33 AUVRM AUVRM
L11 A6
AVDD_DDR0_CLK GND_1
L13 A13

C233
128M Only 0 0 0

C241
C238

C245
AVDD_DDR1_CLK GND_2

C231

C232
M11 A15
AVDD_DDR0_CMD GND_3
K13 A18
AVDD_DDR1_CMD GND_4
256M Only 1 0 0 +1.5V_DDR C5 B12
AVDD_DDR0_D_1 GND_5
K12 B14
AVDD_DDR0_D_2 GND_6
0 1 L12 B16
128M+128M 0 AVDD_DDR0_D_3 GND_7
C6 B17
AVDD_DDR1_D_1 GND_8
K14 B19
128M+256M 0 0 1
DDR3 1.5V L14
AVDD_DDR1_D_2
AVDD_DDR1_D_3
GND_9
GND_10
B20
B5 C9
256M+256M 1 0 1 AVDD_DRAM_1 GND_11
B6 C10
AVDD_DRAM_2 GND_12
R8 C21
AVDD_NODIE AVDD_DVI_USB_MPLL_1 GND_13
R9 D9
AVDD_DVI_USB_MPLL_2 GND_14
AVDD_DDR0:55mA L7 E20
+1.5V_DDR VDD33 AVDD_MOD_1 GND_15
L8 F9
AVDD_MOD_2 GND_16
P8 F11
AVDD_NODIE AVDD_NODIE GND_17
K9 F13
VDD33 AVDD_PLL GND_18
R5 F15
AVDD_DMPLL AVDD3P3_DMPLL GND_19
+1.10V_VDDC P11 F17
AVDDL_MOD GND_20

0.1uF

0.1uF
C7 F19

10uF 10V

C239

C242

C246
0.1uF

1uF
+1.10V_VDDC DVDD_DDR_1 GND_21

C230
M13 F21
GND_22

C234
1uFC250 DVDD_DDR_2
R6 G8
DVDD_NODIE GND_23
A7 G9
DVDD_RX_1_1 GND_24
M12 G10
DVDD_RX_1_2 GND_25
AVDD_DDR1:55mA B7 G11
DVDD_RX_2_1 GND_26
M14 G12
DVDD_RX_2_2 GND_27
N11 G13
+1.10V_VDDC VDDC_1 GND_28
N12 G14
VDDC_2 GND_29
N13 G15
VDDC_3 GND_30
N14 G16
VDDC_4 GND_31
N15 G17
VDDC_5 GND_32
P12 G18
VDDC_6 GND_33
P13 H7
VDDC_7 GND_34
P14 H8
VDDC_8 GND_35
L9 H9
VDD33 VDDP GND_36
H10
GND_37
AA10 H11
AVDD5V_MHL AVDD5V_MHL GND_38
H12
GND_39
H13
GND_40
H14
IC101-*1 GND_41
LGE2133(128M) H15
GND_42
H16
M1A_128M GND_43
IC101-*1 U3
AUVRM AVDD_AU33
R4 H17
A6 L11
GND_1 AVDD_DDR0_CLK GND_44
LGE2133(128M) A13
GND_2 AVDD_DDR1_CLK
L13 H18
A15 M11
GND_3 AVDD_DDR0_CMD GND_45
A18
GND_4 AVDD_DDR1_CMD
K13 J7
B12 C5
GND_5 AVDD_DDR0_D_1 GND_46
B14
GND_6 AVDD_DDR0_D_2
K12 J8
M1A_128M B16
B17
GND_7
GND_8
AVDD_DDR0_D_3
AVDD_DDR1_D_1
L12
C6
GND_47
J9
M4 T6 B19
GND_9 AVDD_DDR1_D_2
K14
GND_48
ARC0 CVBSOUT1 B20
GND_10 AVDD_DDR1_D_3
L14 J10
W7 V5 C9
GND_11 AVDD_DRAM_1
B5
GND_49
RXC0N CVBS0 C10
GND_12 AVDD_DRAM_2
B6 J11
Y8 U5 C21
GND_13 AVDD_DVI_USB_MPLL_1
R8
GND_50
RXC0P CVBS1 D9
GND_14 AVDD_DVI_USB_MPLL_2
R9 J12
W8 T5 E20
GND_15 AVDD_MOD_1
L7
GND_51
RXC1N CVBS2 F9
GND_16 AVDD_MOD_2
L8 J13
Y9 V4 F11
GND_17 AVDD_NODIE
P8
GND_52
RXC1P VCOM F13
GND_18 AVDD_PLL
K9 J14
AA9 F15
GND_19 AVDD3P3_DMPLL
R5
GND_53
RXC2N F17
GND_20 AVDDL_MOD
P11 K8
W9 E4 F19
GND_21 DVDD_DDR_1
C7
GND_54
RXC2P I2S_OUT_BCK/GPIO165 F21
GND_22 DVDD_DDR_2
M13 K10
AA7 F4 G8
GND_23 DVDD_NODIE
R6
GND_55
RXCCKN I2S_OUT_MCK/GPIO163 G9
GND_24 DVDD_RX_1_1
A7 K11
Y7 F7 G10
GND_25 DVDD_RX_1_2
M12
GND_56
RXCCKP I2S_OUT_SD/GPIO166 G11
GND_26 DVDD_RX_2_1
B7 L10
N2 F5 G12 M14
GND_57
M1A_256M E3
CEC/GPIO6 I2S_OUT_WS/GPIO164 G13
G14
GND_27
GND_28
GND_29
DVDD_RX_2_2
VDDC_1
VDDC_2
N11
N12
GND_58
M5
DDCDA_CK/GPIO27 G15
GND_30 VDDC_3
N13 M7
IC101 E2
W6
DDCDA_DA/GPIO28 USB0_DM
C4
Y12
G16
G17
G18
GND_31
GND_32
GND_33
VDDC_4
VDDC_5
VDDC_6
N14
N15
P12
GND_59
GND_60
M8

LGE2134(256M) AA6
DDCDC_CK/GPIO31
DDCDC_DA/GPIO32
USB1_DM
USB0_DP
B4
H7
H8
H9
GND_34
GND_35
GND_36
VDDC_7
VDDC_8
VDDP
P13
P14
L9
GND_61
M9
M10
L4 AA12 H10
GND_62
HDMI HOTPLUGA/GPIO23 USB1_DP H11
GND_37
GND_38 AVDD5V_MHL
AA10 N4
Y6 H12
GND_39 GND_63
C205 HOTPLUGC/GPIO25 H13
GND_40 N5
HDMI1_ARC HDMI1_ARC M4 T6 F1 J2 H14
GND_64
TU_BUFFER TU_BUFFER RXA0N BIN0M H15
GND_41
N6
HDMI_ARC ARC0 CVBSOUT1 DTV/MNT_VOUT G3 J3 H16
GND_42

1uF 0 R227 W7 V50.047uF C262 33 R251 GND_43 GND_65


RXC0N CVBS0 AV2_OR_SCART TU_CVBS RXA0P BIN0P H17
GND_44 N7
D0-_HDMI4 G1 K3 H18
GND_66
10 R225 Y8 U50.047uF C226 33 R241 AV2_OR_SCART GND_45
N8
D0+_HDMI4 RXC0P CVBS1 SC1/AV2_CVBS_IN RXA1N GIN0M J7
GND_46
10 R226 W8 T50.047uF C227 33 R242 G2 J1 J8
GND_47 GND_67
RXC1N CVBS2 COMP2_Y+/AV_CVBS_IN RXA1P GIN0P J9
GND_48 N9
D1-_HDMI4 Y9 V4 0.047uF C228 R243 +3.3V_Normal H3 K2 J10
GND_49 GND_68
RXC1P VCOM RXA2N RIN0M J11
GND_50 N10
D1+_HDMI4 AA9 Close to MSTAR H2 K1 J12
GND_51 GND_69
68 RXA2P RIN0P J13 P4
D2-_HDMI4
W9
RXC2N
E4 I2S_I/F F3 M6 J14
GND_52
GND_53 GND_70
RXC2P I2S_OUT_BCK/GPIO165 RXACKN HSYNC0 K8
GND_54 P5
D2+_HDMI4
R244

R246

F2 L6 K10
GND_71
10K

AA7 F4
10K

GND_55
P6
OPT

OPT

CK-_HDMI4 RXCCKN I2S_OUT_MCK/GPIO163 RXACKP VSYNC0 K11


L10
GND_56
Y7 F7 GND_57 GND_72
RXCCKP I2S_OUT_SD/GPIO166
M5
GND_58 P7
CK+_HDMI4 AUD_SCK U4 L2 M7
GND_73
N2 F5 GND_59
P9
CEC_REMOTE_S7 CEC/GPIO6 I2S_OUT_WS/GPIO164 EAR_OUTL BIN1M M8
GND_60
E3 AUD_MASTER_CLK_0 T4 L3 M9
GND_61 GND_74
DDC_SCL_2 DDCDA_CK/GPIO27 EAR_OUTR BIN1P M10
GND_62 P10
E2 C4 AUD_LRCH P2 M1 N4
GND_63 GND_75
DDC_SDA_2 DDCDA_DA/GPIO28 USB0_DM AUL1 GIN1M N5
GND_64 P15
AUD_LRCK R2 M2 N6
GND_76
W6 Y12 GND_65
P16
DDC_SCL_4 DDCDC_CK/GPIO31 USB1_DM AUL2 GIN1P N7
GND_66
WIFI_DM T1 N1 N8
GND_77
R247

AA6 B4 GND_67
R245

AUL3 RIN1M N9 P17


10K

10K

DDC_SDA_4 DDCDC_DA/GPIO32 USB0_DP R3 N3


GND_68
OPT

OPT

L4 AA12 SIDE_USB1_DM N10


GND_69 GND_78
HOTPLUGA/GPIO23 USB1_DP AUR1 RIN1P P4
GND_70 P18
HPD2 WIFI_DP R1 M3 P5
GND_79
Y6 GND_71
R10
HPD4 HOTPLUGC/GPIO25 AUR2 SOGIN1 P6
GND_72
F1 J2 SIDE_USB1_DP T3 P7
GND_73 GND_80
RXA0N BIN0M AUR3 P9
GND_74 R11
D0-_HDMI2 C212 0.047uF R228 68 U2 P10
GND_81
G3 J3 GND_75
R12
D0+_HDMI2 RXA0P BIN0P SC1_B+/COMP1_Pb+ AUOUTL0 P15
GND_76
G1 K3 C213 0.047uF R229 33 V3 P16
GND_77 GND_82
RXA1N GIN0M WIFI_DM AUOUTR0 P17
GND_78 R13
D1-_HDMI2 G2 J1 C214 0.047uF R230 68 T2 P18
GND_79 GND_83
RXA1P GIN0P SC1_G+/COMP1_Y+ AUVAG R10
GND_80 R14
D1+_HDMI2 H3 K2 C215 0.047uF R231 33 WIFI_DP R11
GND_81 GND_84
RXA2N RIN0M
R12
GND_82 K7
D2-_HDMI2 C216 0.047uF R232 68 R13
GND_EFUSE
H2 K1 R14
GND_83

D2+_HDMI2 RXA2P RIN0P C217 0.047uF R233 33 SC1_R+/COMP1_Pr+ K7


GND_84
F3 M6 GND_EFUSE

CK-_HDMI2 RXACKN HSYNC0 Scart_EU_or_COMM_RGB SC1_ID


F2 L6
CK+_HDMI2 RXACKP VSYNC0 SC1_FB
SCART Option 12ea
H/P OUT U4 L2
HP_LOUT EAR_OUTL BIN1M C218 0.047uF R234 68
T4 L3
HP_ROUT EAR_OUTR BIN1P C219 0.047uF R235 33 COMP2_Pb+
P2 M1
SC1/COMP1_L_IN AUL1 GIN1M C220 0.047uF R236 68
R2 M2
AV2_L_IN
2.2uF C206 AV2 T1
AUL2 GIN1P
N1 C221 0.047uF R237 33 COMP2_Y+/AV_CVBS_IN STby 3.5V
COMP2_L_IN 2.2uF C209 R3
AUL3 RIN1M
N3 C222 0.047uF R238 68 SOC_RESET +3.5V_ST
AVDD_NODIE
SC1/COMP1_R_IN AUR1 RIN1P C223 0.047uF R239 33 COMP2_Pr+ L206
R1 M3
AV2_R_IN 2.2uF C207 AV2 AUR2 SOGIN1 C224 1000pF BLM18PG121SN1D
AUDIO OUT T3 POWER_DET_RESET
COMP2_R_IN AUR3 +3.5V_ST C257
2.2uF C211 U2 AVDD_DMPLL C253 C255
SCART1_Lout 0.1uF
AUOUTL0 10uF 0.1uF
V3
SCART1_Rout AUOUTR0
T2 OPT L207
AUVAG R248 BLM18PG121SN1D
1uF 4.7uF 470 +1.10V_VDDC +1.10V_VDDC
C203 C204 C251 C252
AUVRM OPT 10uF 0.1uF
C243 C248
BLM18PG121SN1D 4.7uF 4.7uF
L201 10V 10V
AVDD_AU33
SOC_RESET C259 C260 C261
L205 0.1uF 0.1uF
10uF
BLM18PG121SN1D 10V
R249 C249 C258
470K 0.1uF C256 0.1uF
C254
10uF 0.1uF

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES


SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS L14_CA_M1A 140903
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. MAIN2_NON_EU 52
AUDIO AMP(TI) AMP_COIL_GET
L5603-*1
10.0uH
AMP_COIL_GET
L5604-*1
10.0uH
AMP_COIL_GET
L5605-*1
10.0uH
AMP_COIL_GET
L5606-*1
10.0uH

AMP_COIL_TAIYO AMP_COIL_TAIYO AMP_COIL_TAIYOAMP_COIL_TAIYO


L5603-*2 L5604-*2 L5605-*2 L5606-*2
10.0uH 10.0uH 10.0uH 10.0uH

This parts are Located


A13.2V +13.2V_AMP on AVSS area.

L5600 R5610
A13.2V

UBW2012-121F 470

C5611 C5612 C5616 AMP_COIL_ABCO Close to Speaker


OPT 4700pF 0.047uF 0.033uF L5605
C5600 C5601 25V 50V 10uH
0.1uF 0.1uF C5609 SPK_L+

50V
50V 50V 4700pF
50V +13.2V_AMP R5611
18
1% OPT

2200pF
C5608 R5609 C5632

C5613
C5636
0.047uF 470 C5626 0.1uF 2200pF
25V 50V
OPT 330pF 50V
C5640 50V
C5618 C5620

PVDD_AB_2
PVDD_AB_1
0.1uF 10uF 4.7uF

PLL_FLTP
PLL_FLTM
50V 25V 50V

SSTIMER
C5630

VR_ANA
3216

BST_A

OUT_A
0.33uF

AVSS
PBTL
NC_2

NC_1
C5627 50V SPEAKER_L
330pF OPT
+3.3V_Normal C5633 C5637
50V
[EP] 0.1uF 2200pF

12
11
10
9
8
7
6
5
4
3
2
1
50V 50V
AVDD 13 48 PGND_AB_2 R5612 AMP_COIL_ABCO
+3.5V_ST R5608 2K 18
A_SEL_FAULT PGND_AB_1 L5606

THERMAL
14 47 1%
MCLK OUT_B 10uH
46

49
AUD_MASTER_CLK 15 SPK_L-
C5604 R5607 18K 1% OSC_RES 45 NC_6
R5601 16 C5624
0.1uF 0.033uF
10K DVSSO 17 44 NC_5
16V 50V
R5603 VR_DIG 18 43 BST_B
100 TAS5733
PDN 19 42 BST_C
OPT C C5602 C5607 LRCLK 20 IC5600 41 NC_4
C5625
AMP_COIL_ABCO
R5600 OPT 0.1uF SCLK NC_3 L5604
10K 1000pF 21 40 0.033uF
B Q5600 16V 50V 10uH
AMP_MUTE 50V SDIN 22 39 OUT_C
MMBT3904(NXP) SPK_R+
SDA 23 38 PGND_CD_2
E OPT
SCL 24 37 PGND_CD_1 R5613 C5634 C5638
18 0.1uF 2200pF
25
26
27
28
29
30
31
32
33
34
35
36
AUD_LRCK 1% 50V 50V
OPT AUD_SCK C5628
RESET
STEST
DVDD
DVSS
GND
AGND
VREG
GVDD_OUT
BST_D
PVDD_CD_1
PVDD_CD_2
OUT_D
R3405 AUD_LRCH 330pF
0 50V
POWER_DET AMP_SDA
+13.2V_AMP C5631
AMP_SCL 0.33uF
50V
OPT
SPEAKER_R
C5629
C5614 C5615 OPT 330pF C5635 C5639
AMP_RESET 0.1uF 1uF C5619 C5621 C5641 50V 0.1uF 2200pF
16V 25V 0.1uF 10uF 4.7uF 50V 50V
C5606 +3.3V_Normal 50V 25V 50V
0.1uF 3216 R5614
18 AMP_COIL_ABCO
16V 1% L5603
10uH
OPT SPK_R-
C5610
ZD5600 C5617
0.1uF 0.033uF
5V
16V 50V

250A1-WR-H04M
WAFER-ANGLE

SPK_L+
4

SPK_L-
3

SPK_R+
2

SPK_R-
1

P5600

Box Type SPK Wafer

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES


SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS L14_CA_AMP 140818
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR 56
1AMP_TAS
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
MHL SW AND GATE

MHL_AND_GATE_TOSHIBA
+3.3V_Normal MHL OCP MHL_ONSEMI
IC5801
TC7SZ08FU_TOSHIBA D5801-*1 MHL_OCP
MBR230LSFT1G
AVDD5V_MHL 5V_HDMI_4 30V IC5802
MHL_SUZHOU BD82020FVJ
IN_B VCC +5V_Normal
1 5 D5801
MHL_CD_SENSE 40V
R5802 SS2040LL-LG
10 OUT_3 GND
IN_A 8 1
2
MHL_OCP_EN MHL_OCP OPT
C5801 R5805
100K OUT_2 IN_1
GND OUT_Y 10uF 7 2
3 4 MHL_OCP
MHL_5V_EN 10V
OPT C5802
R5801 OUT_1 IN_2 0.1uF
10K 6 3

OC EN
5 4
+3.3V_Normal MHL_5V_EN
MHL_AND_GATE_NXP
IC5801-*1 MHL_OCP
74LVC1G08GW MHL_OCP R5806
MHL_OCP R5804 10K
R5803 10K
/MHL_OCP_DET 0
1 5

3 4

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES


SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS L14_CA_M1A 140815
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. MHL_SW_AND 58
TP For US Commercial Model

FE_TS_VAL_ERR UART_RX

AV2_L_IN
RF_SWITCH_CTL UART_TX

AV2_R_IN FE_TS_CLK

FE_TS_SYNC

SC1/AV2_CVBS_IN IF_AGC_SEL

TUNER_RESET

TU_CVBS

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES


SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS L15_US_COMM 2014.08.19
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
TP_US_COMM 190
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
NET_COMMERCIAL_NON_EU

LC Filter for EXT SPK & HP Scart(EU only)

SCART1_MUTE
L2900
5.6uH
HP_ROUT HP_EXT_SPK_ROUT

C2900 MODEL OPTION 9


4.7uF
10V
COMP2_DET (B2B ONLY)
L2901
5.6uH +3.3V_Normal
HP_LOUT HP_EXT_SPK_LOUT

C2901
4.7uF
10V READY
R2904
10K

Close to the Main IC AUD_SCK

RGB DSUB(Non EU)


R2905
10K
SC1_ID

DSUB/SC1_HSYNC
R2901 33 DSUB/SC1_HSYNC
NON_EU_RGB
DSUB/SC1_VSYNC
SC1_FB

DSUB_DET
R2902 33 DSUB/SC1_VSYNC
NON_EU_RGB

AV2_CVBS_DET

15Y_HYNIX_2G 15Y_HYNIX_4G R2903 0


DSUB_DET
IC102-*10 IC102-*11 NON_EU_RGB
H27U2G8F2DTR-BD H27U4G8F2ETR-BC

NC_1 NC_29 NC_1 NC_29


1 48 1 48
NC_2 NC_28 NC_2 NC_28
2 47 2 47
NC_3 NC_27 NC_3 NC_27
3 46 3 46
NC_4 NC_26 NC_4 NC_26
4 45 4 45
NC_5 I/O7 NC_5 I/O7
5 44 5 44
NC_6 I/O6 NC_6 I/O6
6 43 6 43
R/B I/O5 R/B I/O5
7 42 7 42
RE I/O4 RE I/O4
8 41 8 41
CE NC_25 CE NC_25
9 40 9 40
NC_7 NC_24 NC_7 NC_24
10 39 10 39
NC_8 NC_23 NC_8 NC_23
11 38 11 38
VCC_1 VCC_2 VCC_1 VCC_2
12 37 12 37
VSS_1 VSS_2 VSS_1 VSS_2
13 36 13 36
NC_9 NC_22 NC_9 NC_22
14 35 14 35
NC_10 NC_21 NC_10 NC_21
15 34 15 34
CLE NC_20 CLE NC_20
16 33 16 33
ALE I/O3 ALE I/O3
17 32 17 32
WE I/O2 WE I/O2
18 31 18 31
WP I/O1 WP I/O1
19 30 19 30
NC_11 I/O0 NC_11 I/O0
20 29 20 29
NC_12 NC_19 NC_12 NC_19
21 28 21 28
NC_13 NC_18 NC_13 NC_18
22 27 22 27
NC_14 NC_17 NC_14 NC_17
23 26 23 26
NC_15 NC_16 NC_15 NC_16
24 25 24 25

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES


SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
Commercial NET
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
NET_CONN_NON_EU
189

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