Freescale Semiconductor Inc

PART INFORMATION
Mfg Item Number MKV30F64VLF10
Mfg Item Name LQFP 48 7*7*1.4P0.5

SUPPLIER
Company Name Freescale Semiconductor Inc
Company Unique ID 14-141-7928
Response Date 2018-05-28
Response Document ID 6089K11060D066A1.7
Contact Name Freescale Semiconductor Inc
Contact Title Product Technical Support
Contact Phone 1-800-521-6274
Contact Email support@freescale.com
Authorized Representative Daniel Binyon
Representative Title EPP Customer Response
Representative Phone 512-895-3406
Representative Email eppanlst@freescale.com
URL for Additional Information www.freescale.com

DECLARATION
EU RoHS Yes
Pb Free Yes
HalogenFree Yes
Plating Indicator e3
EU RoHS Exemption(s)

MANUFACTURING
Mfg Item Number MKV30F64VLF10
Mfg Item Name LQFP 48 7*7*1.4P0.5
Version ALL
Weight 0.178250
UoM g
Unit Volume EACH
J-STD-020 MSL Rating 3
Peak Processing Temperature 260 C
Max Time at Peak Temperature 40 seconds
Number of Processing Cycles 3
RoHS
RoHS Directive 2011/65/EU
RoHS Definition RoHS Definition: Quantity limit of 0.1% by mass (1000 PPM) of homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB),
Polybrominated Diphenyl Ethers (PBDE) and quantity limit of 0.01% by mass (100 PPM) of homogeneous material of Cadmium
RoHS Legal Definition Please indicate whether any homogeneous material (as defined by the RoHS Directive, EU 2011/65/EU and implemented by the laws of the European Union member states)
of the part(s) identified on this form contains lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls and/or polybrominated diphenyl ethers (each a RoHS
restricted substance) in excess of the applicable quantity limit identified below. If a homogeneous material within the part(s) contains a RoHS restricted substance in excess
of an applicable quantity limit, please indicate below which, if any, RoHS exemption you believe may apply. If the part is an assembly with lower level components, the
declaration shall encompass all such components. Supplier certifies that it gathered the information it provides in this form using appropriate methods to ensure its accuracy
and that such information is true and correct to the best of its knowledge and belief, as of the date that Supplier completes this form. Supplier acknowledges that Company
will rely on this certification in determining the compliance of its products with European Union member state laws that implement the RoHS Directive. Company
acknowledges that Supplier may have relied on information provided by others in completing this form, and that Supplier may not have independently verified such
information. However, in situations where Supplier has not independently verified information provided by others, Supplier agrees that, at a minimum, its suppliers have
provided certifications regarding their contributions to the part(s), and those certifications are at least as comprehensive as the certification in this paragraph. If the Company
and the Supplier enter into a written agreement with respect to the identified part(s),the terms and conditions of that agreement, including any warranty rights and/or
remedies provided as part of that agreement, will be the sole and exclusive source of the Suppliers liability and the Companys remedies for issues that arise regarding
information the Supplier provides in this form. In the absence of such written agreement, the warranty rights and/or remedies of Suppliers Standard Terms and Conditions of
Sale applicable to such part(s) shall apply.
RoHS Declaration 1 - Item(s) do not contain RoHS restricted substances per the definition above
Supplier Acceptance Accepted
Signature Daniel Binyon
Exemption List Version 2012/51/EU

List of Freescale Accepted 6(a) : Lead as an alloying element in steel for machining purposes and in galvanized steel containing up to 0.35% lead by weight
Exemptions
6(b) : Lead as an alloying element in aluminium containing up to 0.4% lead by weight
6(c) : Copper alloy containing up to 4% lead by weight
7(a) : Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead)
7(b) : Lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signaling, transmission, and network management for
telecommunications
7(c)-I : Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or
ceramic matrix compound
7(c)-II : Lead in dielectric ceramic in capacitors for a rated voltage of 125 V AC or 250 V DC or higher
7(c)-III : Lead in dielectric ceramic in capacitors for a rated voltage of less than 125 V AC or 250 V DC
7(c)-IV : Lead in PZT based dielectric ceramic materials for capacitors being part of integrated circuits or discrete semiconductors
15 : Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages
MATERIAL COMPOSITION

Homogeneous Material Weight SubstanceClass Substance CAS Exemption SubstanceWeight UoM SubPart SubPart% ARTICLEPPM ARTICLE%
PPM
Lead Frame Plating 0.0035 g
Lead Frame Plating Lead/Lead Compounds Lead 7439-92-1 0.0000007 g 200 0.02 3 0.0003
Lead Frame Plating Metals Tin, metal 7440-31-5 0.0034993 g 999800 99.98 19631 1.9631
Bonding Wire, Copper 0.0006 g
Bonding Wire, Copper Metals Copper, metal 7440-50-8 0.000582 g 970000 97 3265 0.3265
Bonding Wire, Copper Solvents, additives, and other materials Other miscellaneous substances (less than 5%). - 0.000018 g 30000 3 100 0.01
Epoxy Die Attach 0.0041 g
Epoxy Die Attach Plastics/polymers Epikote 862 28064-14-4 0.000697 g 170000 17 3910 0.391
Epoxy Die Attach Metals Silver, metal 7440-22-4 0.003075 g 750000 75 17251 1.7251
Epoxy Die Attach Solvents, additives, and other materials 2-ethylhexyl glycidyl ether 2461-15-6 0.000328 g 80000 8 1840 0.184
Silicon Semiconductor Die 0.0194 g
Silicon Semiconductor Die Solvents, additives, and other materials Other miscellaneous substances (less than 5%). - 0.000388 g 20000 2 2176 0.2176
Silicon Semiconductor Die Glass Silicon, doped - 0.019012 g 980000 98 106659 10.6659
Die Encapsulant 0.11245 g
Die Encapsulant Solvents, additives, and other materials Carbon Black 1333-86-4 0.00016845 g 1498 0.1498 945 0.0945
Die Encapsulant Plastics/polymers Proprietary Material-Other phenolic resins - 0.00618475 g 55000 5.5 34697 3.4697
Die Encapsulant Glass Silica, crystalline - quartz (SiO2) 14808-60-7 0.00281125 g 25000 2.5 15771 1.5771
Die Encapsulant Glass Silica, vitreous 60676-86-0 0.09968715 g 886502 88.6502 559264 55.9264
Die Encapsulant Plastics/polymers Other Non-halogenated Epoxy resins - 0.0035984 g 32000 3.2 20187 2.0187
Copper Lead Frame 0.0382 g
Copper Lead Frame Metals Copper, metal 7440-50-8 0.03592946 g 940562 94.0562 201567 20.1567
Copper Lead Frame Solvents, additives, and other materials Silicon 7440-21-3 0.00027695 g 7250 0.725 1553 0.1553
Copper Lead Frame Metals Iron, metal 7439-89-6 0.00004775 g 1250 0.125 267 0.0267
Copper Lead Frame Lead/Lead Compounds Lead 7439-92-1 0.00001196 g 313 0.0313 67 0.0067
Copper Lead Frame Metals Magnesium, metal 7439-95-4 0.00006685 g 1750 0.175 375 0.0375
Copper Lead Frame Metals Manganese, metal 7439-96-5 0.00002388 g 625 0.0625 133 0.0133
Copper Lead Frame Nickel (external applications only) Nickel 7440-02-0 0.0012224 g 32000 3.2 6857 0.6857
Copper Lead Frame Metals Silver, metal 7440-22-4 0.000382 g 10000 1 2143 0.2143
Copper Lead Frame Metals Zinc, metal 7440-66-6 0.00023875 g 6250 0.625 1339 0.1339
LINKS
MCD LINK
NXP website http://www.nxp.com
GENERAL ENVIRONMENTAL
COMPLIANCE LINKS
RoHS signed letter http://www.nxp.com/files/corporate/doc/support_info/NXP-ROHS-DECLARATION.pdf
China RoHS http://www.nxp.com/about/corporate-responsibility/environmental-compliance-organization/china-rohs:ENV_CHINA_ROHS_STRATEGY
REACH signed letter http://www.nxp.com/files/corporate/doc/support_info/NXP-REACH-STATEMENT.pdf
ELV signed letter http://www.nxp.com/files/corporate/doc/support_info/NXP-ELV-STATEMENT.pdf
Conflict Minerals statement http://www.nxp.com/files/corporate/doc/support_info/NXP-STATEMENT-CONFLICT-MINERALS.pdf
NXP ENVIRONMENTAL
INFORMATION
Environmental Compliance http://www.nxp.com/about/corporate-responsibility/environmental-compliance-organization:ABUENVPRFPRDX
website
FAQ http://www.nxp.com/about/corporate-responsibility/environmental-compliance-organization/eco-product-faqs:ENVIRON_FAQ
Technical Service Request http://www.nxp.com/support/sales-and-support:SUPPORTHOME
LINKS TO BLANK IPC1752
FORMS
Blank IPC1752 v1.1 Form http://www.NXP.com/files/abstract/corporate/ehs_epp/IPC-1752-2_v1.1_MCD_Template.pdf
IPC1752 XML LINKS

http://www.freescale.com/mcds/MKV30F64VLF10_IPC1752_v11.xml

http://www.freescale.com/mcds/MKV30F64VLF10_IPC1752A.xml