ETM_Unit 3
ETM_Unit 3
ETM_Unit 3
Qx d x Qx ( Qx )dx
Net Heat
x
Heat
x x x x directions.
T T T
kx k y kz dx dy dz ….…(7)
k x T dxdydz
Q Q …..…(4) x x y y z Z
x (x dx) x x
Similarly….. Heat Stored in the element; We know that…
Qy Q( y dy ) ky dx dy dz ….…(5)
y y Heat stored
Mass of
Specific
Rise in
Qz Q( z dz ) k z dx dy dz ….…(6) in the the heat of the temperatur e
z z element of
element element
Adding (4)+(5)+(6); element
Net heat conducted = T
mCp
t
T
dxdydz C p
t
[ Mass Density volume ]
T
Heat stored in the element C dx dy dz ..…(8)
t
General Heat Conduction Equation In Cartesian Coordinates System:
Heat Stored within the element Divided by k,
Heat generated within the element is given by
2T 2T 2T q C
Q q dx dy dz …..…(9)
x 2 y 2 z 2 k k t
0.
t
• So, the general conduction equation (10) reduces to
2 1
x 2 t .…(18)
2T 1 1 2 2 q 1 k
r 2 r r 2
r 2 z 2 k C
Steady versus Unsteady (Transient) Heat Transfer
Steady implies no change with time at any point
within the medium
Q L 0 kA T 2 T 1
The thermal conductivity of a material is a measure of the Q L kA T 1 T 2
ability of the material to conduct heat. kA
Q T 1 T 2
L
A high value for thermal conductivity indicates that the T T2
Q 1
material is a good heat conductor, and a low value indicates L
that the material is a poor heat conductor or insulator. kA
T
Q Where, R- Thermal resistance (K/W)
R
Conduction Heat Transfer in electronic components like Chassis panel, Fins, Cold Plates…etc.
Concept of Thermal Resistance: Conduction through Composite Panel:
Analogy between thermal and electrical resistance: Heat transfer by conduction at slab 3
Q dr k 2 rLdT 2 kL T1 T 2
Q
r2 T2 r
dr ln 2
Q 2 kL dT r1
r1
r T1 T1 T 2
Q
Q ln r r1 2 kL T 2 T1
r2
1 r
ln 2
2 kL r1
Q ln r 2 ln r1 2 kL T1 T 2
T
Q
r2
Q ln 2 kL T1 T 2 R
r1
Where, R- Thermal resistance (K/W)
Conduction Heat Transfer – Simple Problems 1
PROBLEMS ON SLABS: Solution:
Determine the heat transfer through the plane Chassis panel fitted in the We know that, heat transfer through plane wall is
electronic system of length 6m, height 4 m and thickness 0.30 m. The
temperature of inner and outer surfaces are 100°C and 40°C. Thermal T overall
conductivity of wall is 0.55 W/mK. Q
R
Given: Where, T1 T2
1. Inner surface Temperature , T1 = 100°C + 273 =373 K T = T1 –T2 Q
L / kA
2. Outer surface Temperature, T2 = 40°C + 273 = 313K
3. Thickness, L = 0.30 m R = L/kA 373 313
2640 watts
4. Area, A = 64 = 24m2 0.30
5. Thermal conductivity, k = 0.55 W/mK 0.55 24
Q 2640 watts
Heater
Nuclear reactor
Boiler
Conduction Heat Transfer – Simple Problems 4&5
4.An electric current is passed through a plane wall of thickness 5.An electrical transmission line made of a 25 mm dia annealed
150 mm which generates heat at the rate of 50,000 W/m3. The copper wire carries 200 A and has a resistance of 0.4 10-4 /cm
conv. Heat transfer co efficient b/w wall and ambient air is 65 length. If the surface temperature is 200ºC and the ambient air
W/m2K, ambient air temperature is 280C and thermal temperature is 10ºC, determine the heat transfer coefficient
conductivity of wall= 22W/mK between the wire surface and the ambient air and the maximum
Find 1)Surface temp, 2)Max. temp temperature in the wire. Assume k = 150 W/mK
Given
Thickness L= 0.15m Solution. The heat loss in the conductor
Heat generation q=50,000 W/m3 Q = I2R = (200)2 (0.4 10-4)
h= 65W/m2K Note: Refer HMT Data Book = 1.6 W/cm = 160W/m
T∞=280C=301K for formulae and materials 160
k=22W/mK property q Q / V 325. 95 kW / m 3
0.0125 1
2
Q I 2 R 10 kW
10 4
I 204 A
0 . 24
Thermal Contact Resistance
Thermal Contact Resistance
Thermal Contact Resistance
Transient Heat Conduction - Lumped Systems
Transient Heat Conduction - Lumped Systems
Transient Heat Conduction - Lumped Systems - Problems
A liquid cooled Lenovo Neptune server configured with dual AMD Genoa
CPUs and four Nvidia H100 GPUs.
Transient Heat Conduction - Lumped Systems
Transient Heat Conduction - Lumped Systems