Pilot Run Report 0702

Surface Mount Technology Limited
12345
Customer Name:
Customer Model: SMT Model: Production Qty.: Ship out Qty.: Production Date: Production Line:
PIC Signature Prepared: Checked: Approved:
Date Engineering: QA: Production:
PIC Signature
Date
12345 PP Report
Contents 1. Process Flow 2. Materials & sub-materials 3. Yield results 4. PNP QA summary 5. Production Problem Analysis & Actions Follow 6. Assembly QA summary 7. Conclusion & Recommendation Appendix A - Reflow Soldering Temperature Profile
1.Process Flow Chart

Symbol PP Production Process Flow
No 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 Operation Transportation Inspection Storage
Incoming material Incoming material inspection Store in warehouse Receive material on production line Classing the material for different station Paste the solder screen IPQC selective inspection Loading the material IPQC selective inspection PNP placement IPQC first article approve Visual inspection after reflow soldering Reflow oven temperature detect Convey to reflow oven for soldering AOI inspection Visual inspection after reflow soldering IPQC selective inspection QA inspection Return to warehouse for casing assembly IPQC selective inspection Apply the screw IPQC selective inspection Inspection SMD component Insert component() IPQC selective inspection Inspection and wavesoldering Inspecion after wavesoldering
IPQC selective inspection PCB separation Overall insepction Visula inspecion and casing assembly Apply the screw A Apply the screw B FCT TEST Apperance and packing Finish good to warehouse
2. Materials Issues
Scrap Materials (Major parts)
NO.
1
P/N
Description
Qty. (pcs)
Problems
Reasons
Actions
Affected Area
PIC
Due date
Remarks
Incoming Materials Failure Analysis

NO. SMT P/N Description Qty. (pcs) Problems Reasons Actions Affected Area PIC Due date Remarks
Sub-materials
No. 1 2 3 4 5 Sub-materials Lead-free solder Wire Lead-free solder bar Flux Solvent solder paste SMT P/N SUBBING006 SUBAINTG007 MS02-0021-03 MS02-0023-02 SUBAINT61 Specification SENJU M705 1.0MM SENJU M705 AOKI EC-19S-8 CLEANING SOLVENT TF-2000-6 M705-GRN360-K2-V(Lead free)
3. Results
PNP Production Qty. (pcs) 72 Assembly Production Qty. (pcs) 72 OK Qty. (pcs) 72 NG Qty. (pcs) 72 Ship Out Qty. (pcs) 72 Remarks
Process Input Qty 1 Pass Output Qty 1 Pass Yield Final Pass Output Final Pass Yield
st st
PNP Section 1 1 100.00% 1 100.00%
Casing Assembly 1 1 100.00% 1 100.00%
Testing Result - (Production Line)

Testing Item: Tested Qty.: 1st Pass Yield: Final Pass Yield: FCT 1pcs 100.00% 100.00% Defect Rate: Final Defect Rate: 0 0 0
4. PNP QA Results(MAIN BOARD)

Solder Paste Model: SUBAINT61 Viscosity SPEC:200+50 pa.s IPQC measured results: 200 pa.s SMT adhesive model: Na IPQC measured results on adhesive tension Test Position No.1 No.2 No.3 No.4 X1 X2 X3 X4 Total x R Process Capability Analysis - Solder Paste Thickness Solder Paste Height SPEC:130--210um (stencil thickness: 150um) IPQC measured results:(AVG: 202.4 um) QA full inspection results No.5 Checked Lot:1 Passed Lot: 1 LAR%:100% QA PASS Q'ty:72pcs PPM:0
12345 Solder Paste Thickness
B H7 8 M I J - 5 2 AN
L L S
20 1 .0 * 10 3 .0 11 7 .2 1 0 8 72 .4 1 4 7 67 .9 0 5
P c s D ta ro e s a UL S T rg t a e LL S Ma en S mleN a p S e (S ) tD v T S e (L ) tD v T
UL S
S T L T
P te tia (S ) C p b o n l T a a ility C p CU P CL P Ck p Cm p 1 7 .5 1 3 .5 1 2 .6 1 3 .5 * 15 4 15 5 15 6 15 7 15 8 15 9 Ep c dL P rfo a c x e te T e rmn e P M<L L P S 0 1 .1 P M>U L P S 0 5 .5 P MT ta P o l 0 6 .6
Oe ll (L ) C p b v ra T a a ility P p 1 7 .6 PU P 1 2 .6 PL P Pk p 1 3 .7 1 2 .6
O s rv dP rfo a c b e e e rmn e P M<L L P S 0 0 .0 P M>U L P S 0 0 .0 P MT ta P o l 0 0 .0
Ep c dS P rfo a c x e te T e rmn e P M<L L P S 0 8 .5 P M>U L P S 2 2 .3 P MT ta P o l 2 0 .9
4. PNP QA Results(SUB-BOARD)
Solder Paste Model: SUBAINT61 Viscosity SPEC:200+50 pa.s IPQC measured results: 210 pa.s SMT adhesive model: Na IPQC measured results on adhesive tension Test Position No.1 No.2 No.3 No.4 X1 X2 X3 X4 Total x R Process Capability Analysis - Solder Paste Thickness Solder Paste Height SPEC:130--210um (stencil thickness: 150um) IPQC measured results:(AVG: 171.2 um) QA full inspection results No.5 Checked Lot:1 Passed Lot: 1 LAR%:100% QA PASS Q'ty:72pcs PPM:0
12345 Solder Paste Thickness
Po e s C p b r cs a a ility A a s f r C n ly is o 1
L L S
2 00 1. * 1 00 3. 1 12 7. 1 0 91 0 6 . 67 79 0 5 . 67
P c s Dt ro e s aa UL S T rg t a e LL S Ma en S mleN a p SD v(S ) t e T SD v(L ) t e T
UL S
S T L T
P t nia (S ) C p b y oe t l T a a ilit C p CU P CL P Ck p Cm p 14 .6 14 .1 15 .0 14 .1 * 15 4 15 5 15 6 15 7 15 8 15 9 Ep ce L P rf rmn e xe t d T e o a c P M<L L P S 01 .1 P M>U L P S 05 .5 P MT t l P oa 06 .6
Oe ll (L ) C p b y v ra T a a ilit P p 16 .7 PU P 16 .2 PL P Pk p 17 .3 16 .2
O s rv dP rf rmn e be e e o ac P M<L L P S 00 .0 P M>U L P S 00 .0 P MT t l P oa 00 .0
Ep ce S P rf rmn e xe t d T e o a c P M<L L P S 34 .4 P M>U L P S 1. 0 14 P MT t l P oa 1. 4 48
6. Assembly QA Summary
DATE 26.Jun.2006 CUSTOMER CUSTOMER Model NAME SMT Model SMT NAME LOT QTY
Libra
/ AQL
577582
72pcs
QUALITY CLASS /PLAN MIN: ITEM INSPECTION ITEM

1.WRONG COMPONENT 2.MISSING COMPONENT 3.BROKEN COMPONENT
ACC: 3.00% 0.40% ACC: MAJ:
PCS PCS
REJ: REJ: OK 10 pcs 11 pcs 12 pcs 13 pcs 14 pcs 15 pcs 16 pcs 17 pcs 18 pcs 19 pcs 20 pcs 21 pcs NG
0 0 0 0 0 0 0 0 0 0 0 0
PCS PCS REMARK
STANDARD
NO ACCEPT NO ACCEPT IPC-A-610C-II NO ACCEPT IPC-A-610C-II IPC-A-610C-II IPC-A-610C-II NO ACCEPT IPC-A-610C-II IPC-A-610C-II IPC-A-610C-II IPC-A-610C-II
SAMPLE Q'TY 10pcs 10pcs 10pcs 10pcs 10pcs 10pcs 10pcs 10pcs 10pcs 10pcs 10pcs 10pcs
COMPONENT
4.REVERSE 5.COMPONENT FLOAT UP 6.COMPONENT APPEARANCE 1.POOR SOLDER 2.SHORT(OPEN) CIRCUIT
SOLDER
3.SOLDER TIP 4.SOLDER HOLE/BALL 1.CIRCUIT BROKEN
PCB
2.MISSING SOLDER MASK
ACCOUNT: VISUAL DEFECT:
0 PCS PCS
MINOR DEFECT: 0 MAJOR DEFECT: REJ QTY: ALL CHECK OTHERS 0 PCS 0
PCS PCS
FUNCTION DEFECT: 0 ACC QTY: RESULT : REMARK: ACC 1 PCS0 PCS REJ
U.A.I
CHECKED:
Weimingxiong
QA PIC:
WeimingXiong
PE PIC: YilinChen
Assembly Section Station Phenomena NG Qty. (pcs) Reasons Actions Location PIC Due Date
REMARK
No protuberant feet
on the buttom side for proper soldering
Wave soldering
7. Conclusion
There were total 10 pcs built in this phase ,the first pass yield 88.9%,last pass yield 100% ,the pending issues was mainly existed on the incoming materials problem.
8.suggestion a.fabricate the fixture for screw fixing b.fabricate the fixture for label appling
Appendix A
Reflow Soldering Temperature Profile(MAIN BOARD)
Reflow Soldering Temperature Profile(SUB-BOARD)

Pilot Run Report 0702

Uploaded by

Copyright:

Available Formats

Pilot Run Report 0702

Uploaded by

Document Information

Original Description:

Copyright

Available Formats

Share this document

Share or Embed Document

Sharing Options

Did you find this document useful?

Is this content inappropriate?

Copyright:

Available Formats

Pilot Run Report 0702

Uploaded by

Copyright:

Available Formats

Surface Mount Technology Limited

PIC Signature Prepared: Checked: Approved:

Date Engineering: QA: Production:

1.Process Flow Chart

Incoming Materials Failure Analysis

PNP Section 1 1 100.00% 1 100.00%

Casing Assembly 1 1 100.00% 1 100.00%

Testing Result - (Production Line)

4. PNP QA Results(MAIN BOARD)

12345 Solder Paste Thickness

P te tia (S ) C p b o n l T a a ility C p CU P CL P Ck p Cm p 1 7 .5 1 3 .5 1 2 .6 1 3 .5 * 15 4 15 5 15 6 15 7 15 8 15 9 Ep c dL P rfo a c x e te T e rmn e P M<L L P S 0 1 .1 P M>U L P S 0 5 .5 P MT ta P o l 0 6 .6

O s rv dP rfo a c b e e e rmn e P M<L L P S 0 0 .0 P M>U L P S 0 0 .0 P MT ta P o l 0 0 .0

Ep c dS P rfo a c x e te T e rmn e P M<L L P S 0 8 .5 P M>U L P S 2 2 .3 P MT ta P o l 2 0 .9

12345 Solder Paste Thickness

P c s Dt ro e s aa UL S T rg t a e LL S Ma en S mleN a p SD v(S ) t e T SD v(L ) t e T

P t nia (S ) C p b y oe t l T a a ilit C p CU P CL P Ck p Cm p 14 .6 14 .1 15 .0 14 .1 * 15 4 15 5 15 6 15 7 15 8 15 9 Ep ce L P rf rmn e xe t d T e o a c P M<L L P S 01 .1 P M>U L P S 05 .5 P MT t l P oa 06 .6

O s rv dP rf rmn e be e e o ac P M<L L P S 00 .0 P M>U L P S 00 .0 P MT t l P oa 00 .0

Ep ce S P rf rmn e xe t d T e o a c P M<L L P S 34 .4 P M>U L P S 1. 0 14 P MT t l P oa 1. 4 48

QUALITY CLASS /PLAN MIN: ITEM INSPECTION ITEM

ACC: 3.00% 0.40% ACC: MAJ:

PCS PCS REMARK

ACCOUNT: VISUAL DEFECT:

on the buttom side for proper soldering

Reflow Soldering Temperature Profile(SUB-BOARD)

You might also like