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Ch3 PowerBasics

The document discusses power and energy basics related to CMOS circuits. It covers where power is dissipated, including dynamic power during charging/discharging of capacitors and static leakage power. Dynamic power is proportional to switching frequency and the switched capacitance. The energy to charge a capacitor depends on the capacitance and the voltage change. Logic functions impact switching activity and thus dynamic power. Reconvergent fanout can increase switching activity due to spatial correlation effects. Glitches from timing violations are another source of dynamic power not included in typical analyses.
Copyright
© © All Rights Reserved
Available Formats
Download as PPTX, PDF, TXT or read online on Scribd
0% found this document useful (0 votes)
16 views

Ch3 PowerBasics

The document discusses power and energy basics related to CMOS circuits. It covers where power is dissipated, including dynamic power during charging/discharging of capacitors and static leakage power. Dynamic power is proportional to switching frequency and the switched capacitance. The energy to charge a capacitor depends on the capacitance and the voltage change. Logic functions impact switching activity and thus dynamic power. Reconvergent fanout can increase switching activity due to spatial correlation effects. Glitches from timing violations are another source of dynamic power not included in typical analyses.
Copyright
© © All Rights Reserved
Available Formats
Download as PPTX, PDF, TXT or read online on Scribd
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Power and Energy Basics

Progettazione Low Power A.A. 2020-2021


Outline

 Metrics
 Dynamic power
 Static power
 Energy-delay trade-off’s

Progettazione Low Power A.A. 2020-2021 3


Where is Power Dissipated in CMOS?

 Active (Dynamic) power


– (Dis)charging capacitors
– Short-circuit power
 Both pull-up and pull-down on during transition
 Static (leakage) power
– Transistors are imperfect switches
 Static currents
– Biasing currents

Progettazione Low Power A.A. 2020-2021 3


Active (or Dynamic) Power

Key property of active power:

Pdyn  f
with f the switching frequency

Sources:
 Charging and discharging capacitors
 Temporary glitches (dynamic hazards)
 Short-circuit currents

Progettazione Low Power A.A. 2020-2021 3


Charging Capacitors
Applying a voltage step
1
E R  CV 2
2
E01  CV 2 R
1
EC  CV 2
2
V C

Value of R does not impact energy!


Progettazione Low Power A.A. 2020-2021 3
Applied to Complementary CMOS Gate

Vdd 2
E 01  CLVDD

1 2
PMOS iL ER  CLVDD
2
A1 NETWORK
Vout
AN 1 2
CL EC  CLVDD
NMOS 2
NETWORK

 One half of the power from the supply is consumed in the


pull-up network and one half is stored on CL
 Charge from CL is dumped during the 10 transition
 Independent of resistance of charging/discharging network

Progettazione Low Power A.A. 2020-2021 3


Circuits with Reduced Swing

0→V

0→V - VTH
More in general…
V C
C
V2 V1
-


dV
E01   VC C dt  CV
V VT
V2
0
dt  dVC  CV (V  VTH )
0

E = C*V2*(V2-V1)
Energy consumed is
proportional to output swing (V2>V1)
Progettazione Low Power A.A. 2020-2021 3
Dynamic Power Consumption

Power = Energy/transition • Transition rate

= CLVDD2•f01

= CLVDD2•f• P01

= CswitchedVDD2•f

 Power dissipation is data dependent – depends


on the switching probability
 Switched capacitance Cswitched= P01CL= aCL
(a is called the switching activity)
Progettazione Low Power A.A. 2020-2021 3
Impact of Logic Function

Example: Static 2-input NOR gate

Assume signal probabilities


A B Out pA=1 = 1/2
0 0 1 pB=1 = 1/2
0 1 0
Then transition probability
1 0 0 p01 = pOut=0 x pOut=1
1 1 0
= 3/4 x 1/4 = 3/16
If inputs switch every cycle
aNOR= 3/16

NAND gate yields similar result


Progettazione Low Power A.A. 2020-2021 3
Impact of Logic Function

Example: Static 2-input XOR Gate

Assume signal probabilities


A B Out pA=1 = 1/2
0 0 0 pB=1 = 1/2
0 1 1
Then transition probability
1 0 1 p01 = pOut=0 x pOut=1
1 1 0
= 1/2 x 1/2 = 1/4
If inputs switch in every cycle
P01 = 1/4

Progettazione Low Power A.A. 2020-2021 3.


Transition Probabilities for Basic Gates

As a function of the input probabilities

p01
AND (1 - pApB)pApB
OR (1 - pA)(1 - pB)(1 - (1 - pA)(1 - pB))
XOR (1 - (pA +pB – 2pApB))(pA + pB – 2pApB)

Activity for static CMOS gates


a = p0p1

Progettazione Low Power A.A. 2020-2021 3


Activity as a Function of Topology
XOR versus NAND/NOR

XOR

NAND/NOR

aNOR,NAND = (2N-1)/22N aXOR = 1/4

Progettazione Low Power A.A. 2020-2021 3.


Exercise 1

Progettazione Low Power A.A. 2020-2021 3.


Exercise 1

Progettazione Low Power A.A. 2020-2021 3.


Exercise 1

Progettazione Low Power A.A. 2020-2021 3.


Exercise 2

Progettazione Low Power A.A. 2020-2021 3.


Excercise 3

Progettazione Low Power A.A. 2020-2021 3.


Algebraic Transformations
Idea: Modify network to reduce capacitance
F= a·b + a·c = a·(b+c)
p1=0.051
a p3=0.076 a
b f
f
a b
c c
p4=0.375

pa = 0.1; pb = 0.5; pc = 0.5

Progettazione Low Power A.A. 2020-2021 3.


Algebraic Transformations
Idea: Modify network to reduce capacitance
F= a·b + a·c = a·(b+c)
p1=0.051
If you calculate af with
a a this procedure, you’ll
b f get two different
f
a b values…
p0=0.95 c p0=0.25 How is it possible???
c
p1=0.05 p1=0.75
p0-1=0.0475 p0-1=0.1875
pa = 0.1; pb = 0.5; pc = 0.5

Caveat: This may increase activity!

Progettazione Low Power A.A. 2020-2021 3.


Reconvergent Fanout (Spatial Correlation)

Inputs to gate can be interdependent (correlated)

A X
Z A X
reconvergence
Z

no reconvergence reconvergent
PZ = 1-(1-PA)PB PZ = 1-(1-PA)PA ?
NO!
PZ: probability that Z=1 PZ = 1
Must use conditional probabilities
PZ = 1- PA . P(X|A) = 1
probability that X=1 given that A=1
Becomes complex and intractable real fast

Progettazione Low Power A.A. 2020-2021 3.


Glitching in Static CMOS
Analysis so far did not include timing effects
A
X
B Z
C

ABC 101 000

Z
Glitch

Gate Delay

Also known as dynamic hazards:


The result is correct, “A single input change causing
but extra power is dissipated multiple changes in the output”

Progettazione Low Power A.A. 2020-2021 3.


What Causes Glitches?
A
A
X B
B X
Z
Y Y
C
C
Z
D D

A,B A,B

C,D C,D

X X

Y Y

Z Z

Uneven arrival times of input signals of gate due to


unbalanced delay paths
Solution: balancing delay paths!
Progettazione Low Power A.A. 2020-2021 3.
Short-Circuit Currents

(also called crowbar currents)

VDD
VDD -VT

vin
VT
Vin I sc Vout
I peak t
CL ishort

PMOS and NMOS simultaneously on during transition

Progettazione Low Power A.A. 2020-2021 3.


Transistors Leak

 Drain leakage
– Diffusion currents
– Drain-induced barrier lowering (DIBL)
 Junction leakages
– Gate-induced drain leakage (GIDL)
 Gate leakage
– Tunneling currents through thin oxide

Progettazione Low Power A.A. 2020-2021 3.


Sub-Threshold Leakage

Leakage current increases with drain voltage


(mostly due to DIBL)
VTH  d VDS
W S
I leak  I0 10 (for VDS> 3 kT/q)
W0
Hence
VTH d VDD
W
Pleak  (I 0 10 S )(VDD 10 S )
W0

Leakage Power strong function of supply voltage

Progettazione Low Power A.A. 2020-2021 3.


Stack Effect

Assume that body effect in short


channel transistor is small
NAND gate: VM VTH  d (VDD VM )
I leak, M 1  I 0 10 S
VDD
Neglecting
VTH  d VM the Body

I leak, M 2  I 0 10 S
Biasing…

d
VM  VDD
1 2d
d VDD 1 d
I stack 
S
( )
1 2 d (instead of the
 10 expected factor of 2)
I inv

Progettazione Low Power A.A. 2020-2021 3.


Summary of Power Dissipation Sources

P ~   C L  CCS Vswing VDD  f  I DC  I Leak VDD

 a– switching activity
 CL – load capacitance  IDC – static current
 CCS – short-circuit  Ileak – leakage current
capacitance
 Vswing – voltage swing
 f – frequency

energy
P  rate  static power
operation
Progettazione Low Power A.A. 2020-2021 3.
The Traditional Design Philosophy

 Maximum performance is primary goal


– Minimum delay at circuit level
 Architecture implements the required function
with target throughput, latency
 Performance achieved through optimum sizing,
logic mapping, architectural transformations.
 Supplies, thresholds set to achieve maximum
performance, subject to reliability constraints

Progettazione Low Power A.A. 2020-2021 3.


The New Design Philosophy

 Maximum performance (in terms of


propagation delay) is too power-hungry,
and/or not even practically achievable
 Many (if not most) applications either can
tolerate larger latency, or can live with lower
than maximum clock-speeds
 Excess performance (as offered by
technology) to be used for energy/power
reduction
Trading off speed for power
Progettazione Low Power A.A. 2020-2021 3.
Exploring the Energy-Delay Space
Energy Unoptimized
design

Emax Pareto-optimal
designs

Emin
Dmin Dmax Delay

In energy-constrained world, design is trade-off process


♦ Minimize energy for a given performance requirement
♦ Maximize performance for given energy budget

Progettazione Low Power A.A. 2020-2021 [Ref: D. Markovic, JSSC’04] 3.


Summary

 Power and energy are now primary design


constraints
 Active power still dominating for most
applications
– Supply voltage, activity and capacitance the key
parameters
 Leakage becomes major factor in sub-100nm
technology nodes
– Mostly impacted by supply and threshold voltages
 Design has become energy-delay trade-off
exercise!

Progettazione Low Power A.A. 2020-2021 3.

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