Ch3 PowerBasics
Ch3 PowerBasics
Ch3 PowerBasics
Metrics
Dynamic power
Static power
Energy-delay trade-off’s
Pdyn f
with f the switching frequency
Sources:
Charging and discharging capacitors
Temporary glitches (dynamic hazards)
Short-circuit currents
Vdd 2
E 01 CLVDD
1 2
PMOS iL ER CLVDD
2
A1 NETWORK
Vout
AN 1 2
CL EC CLVDD
NMOS 2
NETWORK
0→V
0→V - VTH
More in general…
V C
C
V2 V1
-
dV
E01 VC C dt CV
V VT
V2
0
dt dVC CV (V VTH )
0
E = C*V2*(V2-V1)
Energy consumed is
proportional to output swing (V2>V1)
Progettazione Low Power A.A. 2020-2021 3
Dynamic Power Consumption
= CLVDD2•f01
= CLVDD2•f• P01
= CswitchedVDD2•f
p01
AND (1 - pApB)pApB
OR (1 - pA)(1 - pB)(1 - (1 - pA)(1 - pB))
XOR (1 - (pA +pB – 2pApB))(pA + pB – 2pApB)
XOR
NAND/NOR
A X
Z A X
reconvergence
Z
no reconvergence reconvergent
PZ = 1-(1-PA)PB PZ = 1-(1-PA)PA ?
NO!
PZ: probability that Z=1 PZ = 1
Must use conditional probabilities
PZ = 1- PA . P(X|A) = 1
probability that X=1 given that A=1
Becomes complex and intractable real fast
Z
Glitch
Gate Delay
A,B A,B
C,D C,D
X X
Y Y
Z Z
VDD
VDD -VT
vin
VT
Vin I sc Vout
I peak t
CL ishort
Drain leakage
– Diffusion currents
– Drain-induced barrier lowering (DIBL)
Junction leakages
– Gate-induced drain leakage (GIDL)
Gate leakage
– Tunneling currents through thin oxide
I leak, M 2 I 0 10 S
Biasing…
d
VM VDD
1 2d
d VDD 1 d
I stack
S
( )
1 2 d (instead of the
10 expected factor of 2)
I inv
a– switching activity
CL – load capacitance IDC – static current
CCS – short-circuit Ileak – leakage current
capacitance
Vswing – voltage swing
f – frequency
energy
P rate static power
operation
Progettazione Low Power A.A. 2020-2021 3.
The Traditional Design Philosophy
Emax Pareto-optimal
designs
Emin
Dmin Dmax Delay