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Donner Company.: Yan Anantakusumo Yudistiawan Septima Nurlailia Rizki Setyo P

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Donner Company.

Yan Anantakusumo Yudistiawan Septima Nurlailia Rizki Setyo P

Company History

Donner Company, started in 1985, manufactures printed circuit boards, technically called as soldermask overbare copper boards It faces a competition from around 750 manufacturers in United States. The firm has developed new processes and application and holds patents for these.

Process Order

Whenever an order was received, price was quoted based on estimations of labor and material costs. Based on acceptance by the client, delivery time of 3 weeks was quoted for orders below 1000 boards and 5 weeks for rest. Meanwhile some rush orders were accepted which needed to be served in four days

Manufacturing Process Flow

Preparation Stage Master Artwork, Punching Location holes Image Transfer Stage Drilling Of Holes, Electroplating, Chemicals Fabrication Stage Solder Mask, Testing, Profilling

Contd

Order Processing

Problem
Productivity Quality Delivery

Problem

Clients often found the necessity to change the product specifications because of some error and this required worked to be stopped on that product. Internal factors like improper management and procurement policies for raw material requirements also introduced delays in the manufacturing process. The problem is majorly because most of the shipments are dispatched towards the end of the month.

Recommendation

Hold an inventory of raw material to reduce the time an orders spends waiting for the purchase to happen. Change the policy of shipping more in second fortnight of the month, make it more equally distributed. It may not be possible to stock all raw materials, but key items should be stocked. Especially those related to the start of the manufacturing process Changing Information Transmission

Recommendation

Keep the small and special order in cell layout, outside of regular production.

THANK YOU

Operator pins a panel to drill

Drilling of 500 holes CNC (Automatic) Manual Drilling

Metallization (Copper immersion bath)

DFPR (panels are washed, scrubbed, and coated with dry film photo resist) Placement of customer artwork on panels Passed through DFPR developing machine Electroplatation of bare panels Flash plantation of Tin over copper plating The DFPR that is not exposed to UV light is chemically exposed (At the end of the step, the circuit pattern would be created on both sides of board)

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