Core-shell structured copper-boron nitride (Cu@BN) spherical fillers were synthesized to fabricate thermally conductive composites. To enhance the interaction between the fillers and the matrix, polysilazane (PSZ) was coated on the surface of the filler. The resultant composite exhibited remarkable characteristics, including a substantial tensile strength of 32.36 MPa, excellent electrical insulation properties, and impressive thermal conductivity of 3.47 W/mK. When applied in a light-emitting diode (LED) application, the composite effectively managed heat, reducing the operating temperature by 34 °C. The epoxy/PSZ-Cu@BN composites hold great promise for improving thermal management in electronic devices.

中文翻译：

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铜氮化硼核壳结构填料的开发及导热复合材料的表面处理


合成核壳结构铜氮化硼（Cu@BN）球形填料来制备导热复合材料。为了增强填料和基体之间的相互作用，在填料表面涂覆聚硅氮烷（PSZ）。所得复合材料表现出显着的特性，包括 32.36MPa 的高拉伸强度、优异的电绝缘性能以及 3.47W/mK 的令人印象深刻的导热率。当应用于发光二极管 (LED) 应用时，该复合材料可有效控制热量，将工作温度降低 34 °C。环氧树脂/PSZ-Cu@BN复合材料在改善电子设备的热管理方面具有广阔的前景。