| dbo:abstract
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- Reliability of semiconductor devices can be summarized as follows: 1.
* Semiconductor devices are very sensitive to impurities and particles. Therefore, to manufacture these devices it is necessary to manage many processes while accurately controlling the level of impurities and particles. The finished product quality depends upon the many layered relationship of each interacting substance in the semiconductor, including metallization, chip material (list of semiconductor materials) and package. 2.
* The problems of micro-processes, and thin films and must be fully understood as they apply to metallization and wire bonding. It is also necessary to analyze surface phenomena from the aspect of thin films. 3.
* Due to the rapid advances in technology, many new devices are developed using new materials and processes, and design calendar time is limited due to non-recurring engineering constraints, plus time to market concerns. Consequently, it is not possible to base new designs on the reliability of existing devices. 4.
* To achieve economy of scale, semiconductor products are manufactured in high volume. Furthermore, repair of finished semiconductor products is impractical. Therefore, incorporation of reliability at the design stage and reduction of variation in the production stage have become essential. 5.
* Reliability of semiconductor devices may depend on assembly, use, environmental, and cooling conditions. Stress factors affecting device reliability include gas, dust, contamination, voltage, current density, temperature, humidity, mechanical stress, vibration, shock, radiation, pressure, and intensity of magnetic and electrical fields. Design factors affecting semiconductor reliability include: voltage, power, and current derating; metastability; logic timing margins (logic simulation); timing analysis; temperature derating; and process control. (en)
- 半导体器件可靠性可以归纳为以下几点： 1.
* 半导体器件对杂质和灰尘很敏感。所以在繁复的生产工艺中，精确控制杂质和灰尘的等级是非常必要的。最终产品的质量很大程度上依靠生产中的各个相对独立而又相互影响的生产阶段，例如(metallization),(chip material), 封装等。 2.
* 由于技术飞速进步，新材料和新工艺不断被用于新研发的器件中，设计时间表根据(non-recurring engineering)限定，再加上市场对设计时间不断提出苛刻要求，所以可靠性设计基本不可能按照已有的产品进行。 3.
* 为达到一定的经济指标，半导体产品总是大批量生产的；并且修理半导体产成品也是不实际的。所以半导体产品在设计阶段加入可靠性的概念和在生产阶段减少变量就成为十分必要的要求。 4.
* 半导体器件可靠性取决于装配，使用，环境状况。影响因素包括气体，灰尘，，电压，电流密度，温度，湿度，应力，往复振动，剧烈，压强和电磁场的强度。 设计方面影响半导体器件可靠性的因素包括：电压衰退，功率衰退，电流衰退，稳定性，(logic simulation)，(timing analysis),温度衰退和。 (zh)
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| rdfs:comment
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- 半导体器件可靠性可以归纳为以下几点： 1.
* 半导体器件对杂质和灰尘很敏感。所以在繁复的生产工艺中，精确控制杂质和灰尘的等级是非常必要的。最终产品的质量很大程度上依靠生产中的各个相对独立而又相互影响的生产阶段，例如(metallization),(chip material), 封装等。 2.
* 由于技术飞速进步，新材料和新工艺不断被用于新研发的器件中，设计时间表根据(non-recurring engineering)限定，再加上市场对设计时间不断提出苛刻要求，所以可靠性设计基本不可能按照已有的产品进行。 3.
* 为达到一定的经济指标，半导体产品总是大批量生产的；并且修理半导体产成品也是不实际的。所以半导体产品在设计阶段加入可靠性的概念和在生产阶段减少变量就成为十分必要的要求。 4.
* 半导体器件可靠性取决于装配，使用，环境状况。影响因素包括气体，灰尘，，电压，电流密度，温度，湿度，应力，往复振动，剧烈，压强和电磁场的强度。 设计方面影响半导体器件可靠性的因素包括：电压衰退，功率衰退，电流衰退，稳定性，(logic simulation)，(timing analysis),温度衰退和。 (zh)
- Reliability of semiconductor devices can be summarized as follows: 1.
* Semiconductor devices are very sensitive to impurities and particles. Therefore, to manufacture these devices it is necessary to manage many processes while accurately controlling the level of impurities and particles. The finished product quality depends upon the many layered relationship of each interacting substance in the semiconductor, including metallization, chip material (list of semiconductor materials) and package. 2.
* The problems of micro-processes, and thin films and must be fully understood as they apply to metallization and wire bonding. It is also necessary to analyze surface phenomena from the aspect of thin films. 3.
* Due to the rapid advances in technology, many new devices are developed usin (en)
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