Computer Science > Hardware Architecture
[Submitted on 30 Oct 2016 (this version), latest version 15 May 2017 (v2)]
Title:Reducing DRAM Latency by Exploiting Design-Induced Latency Variation in Modern DRAM Chips
View PDFAbstract:Variation has been shown to exist across the cells within a modern DRAM chip. Prior work has studied and exploited several prior forms of this variation, such as manufacturing-process- or temperature-induced variation. We empirically observe a new form of variation that exists within a DRAM chip, induced by the design and placement of different components in the DRAM chip, where different regions in DRAM, based on their relative distance from the peripheral structures, require different minimum access latencies for reliable operation. In particular, cells closer to the peripheral structures can be accessed much faster than cells that are farther. We call this phenomenon design-induced variation in DRAM. Our goal, in this work, is to understand and exploit design-induced variation to develop low-cost mechanisms to dynamically find and use the lowest latency a DRAM chip can reliably operate at and thus improve overall system performance while ensuring reliable system operation.
To this end, we first experimentally demonstrate and analyze designed-induced variation in modern DRAM devices by testing and characterizing 96 DIMMs (768 DRAM chips). Our characterization identifies DRAM regions that are vulnerable to errors, if operated at lower latency, and finds consistency in their locations across a given DRAM chip generation, due to design-induced variation. Based on our experimental analysis, we develop two mechanisms that reliably reduce DRAM latency.
Submission history
From: Donghyuk Lee [view email][v1] Sun, 30 Oct 2016 05:21:07 UTC (1,731 KB)
[v2] Mon, 15 May 2017 20:37:29 UTC (1,904 KB)
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