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First demonstration of in-beam performance of bent Monolithic Active Pixel Sensors
Authors:
ALICE ITS project,
:,
G. Aglieri Rinella,
M. Agnello,
B. Alessandro,
F. Agnese,
R. S. Akram,
J. Alme,
E. Anderssen,
D. Andreou,
F. Antinori,
N. Apadula,
P. Atkinson,
R. Baccomi,
A. Badalà,
A. Balbino,
C. Bartels,
R. Barthel,
F. Baruffaldi,
I. Belikov,
S. Beole,
P. Becht,
A. Bhatti,
M. Bhopal,
N. Bianchi
, et al. (230 additional authors not shown)
Abstract:
A novel approach for designing the next generation of vertex detectors foresees to employ wafer-scale sensors that can be bent to truly cylindrical geometries after thinning them to thicknesses of 20-40$μ$m. To solidify this concept, the feasibility of operating bent MAPS was demonstrated using 1.5$\times$3cm ALPIDE chips. Already with their thickness of 50$μ$m, they can be successfully bent to ra…
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A novel approach for designing the next generation of vertex detectors foresees to employ wafer-scale sensors that can be bent to truly cylindrical geometries after thinning them to thicknesses of 20-40$μ$m. To solidify this concept, the feasibility of operating bent MAPS was demonstrated using 1.5$\times$3cm ALPIDE chips. Already with their thickness of 50$μ$m, they can be successfully bent to radii of about 2cm without any signs of mechanical or electrical damage. During a subsequent characterisation using a 5.4GeV electron beam, it was further confirmed that they preserve their full electrical functionality as well as particle detection performance.
In this article, the bending procedure and the setup used for characterisation are detailed. Furthermore, the analysis of the beam test, including the measurement of the detection efficiency as a function of beam position and local inclination angle, is discussed. The results show that the sensors maintain their excellent performance after bending to radii of 2cm, with detection efficiencies above 99.9% at typical operating conditions, paving the way towards a new class of detectors with unprecedented low material budget and ideal geometrical properties.
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Submitted 17 August, 2021; v1 submitted 27 May, 2021;
originally announced May 2021.
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Charge collection properties of TowerJazz 180 nm CMOS Pixel Sensors in dependence of pixel geometries and bias parameters, studied using a dedicated test-vehicle: the Investigator chip
Authors:
G. Aglieri Rinella,
G. Chaosong,
A. di Mauro,
J. Eum,
H. Hillemanns,
A. Junique,
M. Keil,
D. Kim,
H. Kim,
T. Kugathasan,
S. Lee,
M. Mager,
V. Manzari,
C. A. Marin Tobon,
P. Martinengo,
H. Mugnier,
L. Musa,
F. Reidt,
J. Rousset,
K. Sielewicz,
W. Snoeys,
M. Šuljić,
J. W. van Hoorne,
Q. M. Waheed,
P. Yang
, et al. (1 additional authors not shown)
Abstract:
This paper contains a compilation of parameters influencing the charge collection process extracted from a comprehensive study of partially depleted Monolithic Active Pixel Sensors with small (<25 um$^2$) collection electrodes fabricated in the TowerJazz 180 nm CMOS process. These results gave guidance for the optimisation of the diode implemented in ALPIDE, the chip used in the second generation…
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This paper contains a compilation of parameters influencing the charge collection process extracted from a comprehensive study of partially depleted Monolithic Active Pixel Sensors with small (<25 um$^2$) collection electrodes fabricated in the TowerJazz 180 nm CMOS process. These results gave guidance for the optimisation of the diode implemented in ALPIDE, the chip used in the second generation Inner Tracking System of ALICE, and serve as reference for future simulation studies of similar devices. The studied parameters include: reverse substrate bias, epitaxial layer thickness, charge collection electrode size and the spacing of the electrode to surrounding in-pixel electronics. The results from pixels of 28 um pitch confirm that even in partially depleted circuits, charge collection can be fast (<10 ns), and quantify the influence of the parameters onto the signal sharing and amplitudes, highlighting the importance of a correct spacing between wells and of the impact of the reverse substrate bias.
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Submitted 23 September, 2020; v1 submitted 22 September, 2020;
originally announced September 2020.
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A next-generation LHC heavy-ion experiment
Authors:
D. Adamová,
G. Aglieri Rinella,
M. Agnello,
Z. Ahammed,
D. Aleksandrov,
A. Alici,
A. Alkin,
T. Alt,
I. Altsybeev,
D. Andreou,
A. Andronic,
F. Antinori,
P. Antonioli,
H. Appelshäuser,
R. Arnaldi,
I. C. Arsene,
M. Arslandok,
R. Averbeck,
M. D. Azmi,
X. Bai,
R. Bailhache,
R. Bala,
L. Barioglio,
G. G. Barnaföldi,
L. S. Barnby
, et al. (374 additional authors not shown)
Abstract:
The present document discusses plans for a compact, next-generation multi-purpose detector at the LHC as a follow-up to the present ALICE experiment. The aim is to build a nearly massless barrel detector consisting of truly cylindrical layers based on curved wafer-scale ultra-thin silicon sensors with MAPS technology, featuring an unprecedented low material budget of 0.05% X$_0$ per layer, with th…
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The present document discusses plans for a compact, next-generation multi-purpose detector at the LHC as a follow-up to the present ALICE experiment. The aim is to build a nearly massless barrel detector consisting of truly cylindrical layers based on curved wafer-scale ultra-thin silicon sensors with MAPS technology, featuring an unprecedented low material budget of 0.05% X$_0$ per layer, with the innermost layers possibly positioned inside the beam pipe. In addition to superior tracking and vertexing capabilities over a wide momentum range down to a few tens of MeV/$c$, the detector will provide particle identification via time-of-flight determination with about 20~ps resolution. In addition, electron and photon identification will be performed in a separate shower detector. The proposed detector is conceived for studies of pp, pA and AA collisions at luminosities a factor of 20 to 50 times higher than possible with the upgraded ALICE detector, enabling a rich physics program ranging from measurements with electromagnetic probes at ultra-low transverse momenta to precision physics in the charm and beauty sector.
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Submitted 2 May, 2019; v1 submitted 31 January, 2019;
originally announced February 2019.
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SuperB Technical Design Report
Authors:
SuperB Collaboration,
M. Baszczyk,
P. Dorosz,
J. Kolodziej,
W. Kucewicz,
M. Sapor,
A. Jeremie,
E. Grauges Pous,
G. E. Bruno,
G. De Robertis,
D. Diacono,
G. Donvito,
P. Fusco,
F. Gargano,
F. Giordano,
F. Loddo,
F. Loparco,
G. P. Maggi,
V. Manzari,
M. N. Mazziotta,
E. Nappi,
A. Palano,
B. Santeramo,
I. Sgura,
L. Silvestris
, et al. (384 additional authors not shown)
Abstract:
In this Technical Design Report (TDR) we describe the SuperB detector that was to be installed on the SuperB e+e- high luminosity collider. The SuperB asymmetric collider, which was to be constructed on the Tor Vergata campus near the INFN Frascati National Laboratory, was designed to operate both at the Upsilon(4S) center-of-mass energy with a luminosity of 10^{36} cm^{-2}s^{-1} and at the tau/ch…
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In this Technical Design Report (TDR) we describe the SuperB detector that was to be installed on the SuperB e+e- high luminosity collider. The SuperB asymmetric collider, which was to be constructed on the Tor Vergata campus near the INFN Frascati National Laboratory, was designed to operate both at the Upsilon(4S) center-of-mass energy with a luminosity of 10^{36} cm^{-2}s^{-1} and at the tau/charm production threshold with a luminosity of 10^{35} cm^{-2}s^{-1}. This high luminosity, producing a data sample about a factor 100 larger than present B Factories, would allow investigation of new physics effects in rare decays, CP Violation and Lepton Flavour Violation. This document details the detector design presented in the Conceptual Design Report (CDR) in 2007. The R&D and engineering studies performed to arrive at the full detector design are described, and an updated cost estimate is presented.
A combination of a more realistic cost estimates and the unavailability of funds due of the global economic climate led to a formal cancelation of the project on Nov 27, 2012.
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Submitted 24 June, 2013;
originally announced June 2013.
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R&D Paths of Pixel Detectors for Vertex Tracking and Radiation Imaging
Authors:
M. Battaglia,
C. Da Via,
D. Bortoletto,
R. Brenner,
M. Campbell,
P. Collins,
G. F. Dalla Betta,
P. Denes,
H. Graafsma,
I. M. Gregor,
A. Kluge,
V. Manzari,
C. Parkes,
V. Re,
P. Riedler,
G. Rizzo,
W. Snoeys,
M. Winter
Abstract:
This report reviews current trends in the R&D of semiconductor pixellated sensors for vertex tracking and radiation imaging. It identifies requirements of future HEP experiments at colliders, needed technological breakthroughs and highlights the relation to radiation detection and imaging applications in other fields of science.
This report reviews current trends in the R&D of semiconductor pixellated sensors for vertex tracking and radiation imaging. It identifies requirements of future HEP experiments at colliders, needed technological breakthroughs and highlights the relation to radiation detection and imaging applications in other fields of science.
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Submitted 1 August, 2012;
originally announced August 2012.
