How Lin
Binghamton University, Eece, Adjunct
The medical industry is clearly and urgently in need of development of advanced packaging that can meet the growing demand for miniaturization, high-speed performance, and flexibility for handheld, portable, in vivo, and implantable... more
The medical industry is clearly and urgently in need of development of advanced packaging that can meet the growing demand for miniaturization, high-speed performance, and flexibility for handheld, portable, in vivo, and implantable devices. To accomplish this, new packaging structures need to be able to integrate more dies with greater function, higher I/O counts, smaller die pad pitches, and high reliability, while being pushed into smaller and smaller footprints. As a result, the microelectronics industry is moving toward alternative, innovative approaches as solutions for squeezing more function into smaller packages. This paper discusses the development of advanced packaging that can meet the growing demand for miniaturization, high-speed performance, and flexibility for miniaturized electronic devices. In particular, recent developments in high density interconnect (HDI) substrate technology are highlighted. System-in-Package (SiP), embedded passives, stacked packages, and fle...
Research Interests:
Power demand in the high end computing and data server segments are driving higher power delivery requirements at all packaging levels in a typical system. At the compute device level, compute node cards are now requiring core power... more
Power demand in the high end computing and data server segments are driving higher power delivery requirements at all packaging levels in a typical system. At the compute device level, compute node cards are now requiring core power supplies with current levels well above 100 amps at 1 volt or less. This imposes severe power delivery challenges in both power supply power conversion efficiency improvement and power delivery path loss minimization. Due to substantial aggregate I2R losses introduced by the current carrying structures in the power delivery paths, depending on the current level used, up to 10% and more of power loss could result. The focus of this paper is in the discussion of novel interconnect structures developed for reduction of current delivery path power loss. i3Electronics Research & Development addresses these extremes with packaging constructs capable of efficient handling in excess of 200 amps at the device level. Through the course of this study, methods were ...
Research Interests:
Variability analysis is important in successfully deploying multi-gigabit backplane printed wiring boards (PWBs) with growing numbers of high-speed SerDes links. We discuss the need for large sample sizes to obtain accurate variability... more
Variability analysis is important in successfully deploying multi-gigabit backplane printed wiring boards (PWBs) with growing numbers of high-speed SerDes links. We discuss the need for large sample sizes to obtain accurate variability estimates of SI metrics (eye height, phase skew, etc). Using a dataset of 11,961 S-parameters, we demonstrate statistical techniques to extract accurate estimates of PWB SI performance variations. We cite numerical examples illustrating how these variations may contribute to underestimated or overestimated design criteria, causing unnecessary design expense. Tabular summaries of performance variation and key findings of broad interest to the general SI community are highlighted.
