default search action
Google
Google Scholar
Semantic Scholar
Internet Archive Scholar
CiteSeerX
ORCIDInternational Conference on Tangible, Embedded, and Embodied Interaction (TEI)
International Conference on Tangible and Embedded Interaction (TEI)
18th TEI 2024: Cork, Ireland
- Luigina Ciolfi, Trevor Hogan, Tanja Döring, Tom Jenkins, Jelle van Dijk, Samuel Huron, Zhuying Li, David Coyle, Beat Signer:
Proceedings of the Eighteenth International Conference on Tangible, Embedded, and Embodied Interaction, TEI 2024, Cork, Ireland, February 11-14, 2024. ACM 2024 [contents]
17th TEI 2023: Warsaw, Poland
- Proceedings of the Seventeenth International Conference on Tangible, Embedded, and Embodied Interaction, TEI 2023, Warsaw, Poland, 26 February 2023- 1 March 2023. ACM 2023, ISBN 978-1-4503-9977-7 [contents]
16th TEI 2022: Daejeon, Korea
- TEI '22: Sixteenth International Conference on Tangible, Embedded, and Embodied Interaction, Daejeon, Republic of Korea, February 13 - 16, 2022. ACM 2022, ISBN 978-1-4503-9147-4 [contents]
15th TEI 2021: Online Event / Salzburg, Austria
- Raphael Wimmer, Martin Kaltenbrunner
, Martin Murer, Katrin Wolf, Ian Oakley:
TEI '21: Fifteenth International Conference on Tangible, Embedded, and Embodied Interaction, Online Event / Salzburg, Austria, February 14-19, 2021. ACM 2021, ISBN 978-1-4503-8213-7 [contents]
14th TEI 2020: Sydney, NSW, Australia
- Elise van den Hoven, Lian Loke, Orit Shaer, Jelle van Dijk, Andrew L. Kun:
TEI '20: Fourteenth International Conference on Tangible, Embedded, and Embodied Interaction, Sydney, NSW, Australia, February 9-12, 2020. ACM 2020, ISBN 978-1-4503-6107-1 [contents]
13th TEI 2019: Tempe, AZ, USA
- Stacey Kuznetsov, Daniel Saakes, Ron Wakkary, Luc Geurts, Lauren Hayes, Manfred Lau:
Proceedings of the Thirteenth International Conference on Tangible, Embedded, and Embodied Interaction, TEI 2019, Tempe, AZ, USA, March 17-20, 2019. ACM 2019, ISBN 978-1-4503-6196-5 [contents]
12th TEI 2018: Stockholm, Sweden
- Ylva Fernaeus, Donald McMillan, Martin Jonsson, Audrey Girouard, Jakob Tholander:
Proceedings of the Twelfth International Conference on Tangible, Embedded, and Embodied Interaction, TEI 2018, Stockholm, Sweden, March 18-21, 2018. ACM 2018 [contents]
11th TEI 2017: Yokohama, Japan
- Masa Inakage, Hiroshi Ishii, Ellen Yi-Luen Do, Jürgen Steimle, Orit Shaer, Kai Kunze, Roshan Lalintha Peiris:
Proceedings of the Tenth International Conference on Tangible, Embedded, and Embodied Interaction, TEI 2017, Yokohama, Japan, March 20-23, 2017. ACM 2017, ISBN 978-1-4503-4676-4 [contents]
10th TEI 2016: Eindhoven, The Netherlands
- Saskia Bakker, Caroline Hummels, Brygg Ullmer, Luc Geurts, Bart Hengeveld, Daniel Saakes, Mendel Broekhuijsen:
Proceedings of the TEI '16: Tenth International Conference on Tangible, Embedded, and Embodied Interaction, Eindhoven, The Netherlands, February 14-17, 2016. ACM 2016, ISBN 978-1-4503-3582-9 [contents]
9th TEI 2015: Stanford, California, USA
- Bill Verplank, Wendy Ju, Alissa Nicole Antle, Ali Mazalek, Florian 'Floyd' Mueller:
Proceedings of the Ninth International Conference on Tangible, Embedded, and Embodied Interaction, TEI '15, Stanford, California, USA, January 15-19, 2015. ACM 2015, ISBN 978-1-4503-3305-4 [contents]
8th TEI 2014: Munich, Germany
- Andreas Butz, Saul Greenberg, Saskia Bakker, Lian Loke, Alexander De Luca:
Eighth International Conference on Tangible, Embedded, and Embodied Interaction, TEI'14, Munich, Germany, February 16-19, 2014. ACM 2014, ISBN 978-1-4503-2635-3 [contents]
7th TEI 2013: Barcelona, Spain
- Sergi Jordà, Narcís Parés:
Seventh International Conference on Tangible, Embedded, and Embodied Interaction, TEI'13, Barcelona, Spain, February 10-13, 2013. ACM 2013, ISBN 978-1-4503-1898-3 [contents]
6th TEI 2012: Kingston, Ontario, Canada
- Roel Vertegaal, Stephen N. Spencer, Ylva Fernaeus, Audrey Girouard, Sergi Jordà:
Proceedings of the 6th International Conference on Tangible and Embedded Interaction 2012, Kingston, Ontario, Canada, February 19-22, 2012. ACM 2012, ISBN 978-1-4503-1174-8 [contents]
5th TEI 2011: Funchal, Madeira, Portugal
- Mark D. Gross, Nuno Jardim Nunes, Ellen Yi-Luen Do, Stephen A. Brewster, Ian Oakley:
Proceedings of the 5th International Conference on Tangible and Embedded Interaction 2011, Funchal, Madeira, Portugal, January 22-26, 2011. ACM 2011, ISBN 978-1-4503-0478-8 [contents]
4th TEI 2010: Cambridge, MA, USA
- Marcelo Coelho, Jamie Zigelbaum, Hiroshi Ishii, Robert J. K. Jacob, Pattie Maes, Thomas Pederson, Orit Shaer, Ron Wakkary:
Proceedings of the 4th International Conference on Tangible and Embedded Interaction 2010, Cambridge, MA, USA, January 24-27, 2010. ACM 2010, ISBN 978-1-60558-841-4 [contents]
3rd TEI 2009: Cambridge, UK
- Nicolas Villar, Shahram Izadi, Mike Fraser, Steve Benford:
Proceedings of the 3rd International Conference on Tangible and Embedded Interaction 2009, Cambridge, UK, February 16-18, 2009. ACM 2009, ISBN 978-1-60558-493-5 [contents]
2nd TEI 2008: Bonn, Germany
- Albrecht Schmidt, Hans Gellersen, Elise van den Hoven, Ali Mazalek, Paul Holleis, Nicolas Villar:
Proceedings of the 2nd International Conference on Tangible and Embedded Interaction 2008, Bonn, Germany, February 18-20, 2008. ACM 2008, ISBN 978-1-60558-004-3 [contents]
1st TEI 2007: Baton Rouge, Louisiana, USA
- Brygg Ullmer, Albrecht Schmidt:
Proceedings of the 1st International Conference on Tangible and Embedded Interaction 2007, Baton Rouge, Louisiana, USA, February 15-17, 2007. ACM 2007, ISBN 978-1-59593-619-6 [contents]
manage site settings
To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.
last updated on 2024-10-01 20:33 CEST by the dblp team
all metadata released as open data under CC0 1.0 license
see also: Terms of Use | Privacy Policy | Imprint
dblp was originally created in 1993 at:
since 2018, dblp has been operated and maintained by:
the dblp computer science bibliography is funded and supported by:
