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ORCIDIEEE Micro, Volume 44
Volume 44, Number 1, January - February 2024
- Hsien-Hsin S. Lee
:
Computing With COOL Chips. 4-5 - Ryusuke Egawa, Yasutaka Wada:
Special Issue on COOL Chips. 6-7 - Reon Oshio, Sugahara Takuya, Atsushi Sawada, Mutsumi Kimura, Renyuan Zhang, Yasuhiko Nakashima:
A Compressed Spiking Neural Network Onto a Memcapacitive In-Memory Computing Array. 8-16 - Donghyeon Han, Junha Ryu, Sangyeob Kim, Sangjin Kim, Jongjun Park, Hoi-Jun Yoo:
A Low-Power Artificial-Intelligence-Based 3-D Rendering Processor With Hybrid Deep Neural Network Computing. 17-27 - Sangyeob Kim, Soyeon Kim, Seongyon Hong, Sangjin Kim, Jiwon Choi, Donghyeon Han, Hoi-Jun Yoo:
COOL-NPU: Complementary Online Learning Neural Processing Unit. 28-37 - Tatsuya Kubo, Shinya Takamaeda-Yamazaki:
Cachet: Low-Overhead Integrity Verification on Metadata Cache in Secure Nonvolatile Memory Systems. 38-48 - Jianqing Liu, Na Gong:
Privacy by Memory Design: Visions and Open Problems. 49-58 - Cyrius Nugier, Vincent Migliore:
Acceleration of a Classic McEliece Postquantum Cryptosystem With Cache Processing. 59-68 - Joshua J. Yi:
Analysis of Historical Patenting Behavior and Patent Characteristics of Computer Architecture Companies - Part VIII: Patent Families. 70-74 - Shane Greenstein:
After the Gold Rush. 76-78
Volume 44, Number 2, March - April 2024
- Hsien-Hsin S. Lee:
Beyond Wires: The Future of Interconnects. 4-5 - Scott Levy, Whit Schonbein:
Special Issue on Hot Interconnects 30. 6-7 - Yuke Li, Arjun Kashyap, Yanfei Guo, Xiaoyi Lu:
Compression Analysis for BlueField-2/-3 Data Processing Units: Lossy and Lossless Perspectives. 8-19 - Rafael Oliveira, Ada Gavrilovska:
Comprex: In-Network Compression for Accelerating IoT Analytics at Scale. 20-30 - Liuyao Dai, Hao Qi, Weicong Chen, Xiaoyi Lu:
High-Speed Data Communication With Advanced Networks in Large Language Model Training. 31-40 - Dennis Abts, John Kim:
Enabling Artificial Intelligence Supercomputers With Domain-Specific Networks. 41-49 - Debendra Das Sharma, Swadesh Choudhary:
Pipelined and Partitionable Forward Error Correction and Cyclic Redundancy Check Circuitry Implementation for PCI Express 6.0 and Compute Express Link 3.0. 50-59 - Huseyin Ekin Sumbul, Jae-sun Seo, Daniel H. Morris, Edith Beigné:
A Fully Digital and Row-Pipelined Compute-in-Memory Neural Network Accelerator With System-on-Chip-Level Benchmarking for Augmented/Virtual Reality Applications. 61-70 - Joshua J. Yi:
Analysis of Historical Patenting Behavior and Patent Characteristics of Computer Architecture Companies - Part IX: Patent Families. 72-77 - Shane Greenstein:
Party Like It's 1999? 78-80
Volume 44, Number 3, May - June 2024
- Hsien-Hsin S. Lee:
An Incoming World of Decoupling Siliconomy. 4-5 - Heiner Litz, Natalia Vassilieva:
Special Issue on Hot Chips 2023. 6-7 - Ravi Bhargava, Kai Troester:
AMD Next-Generation "Zen 4" Core and 4th Gen AMD EPYC Server CPUs. 8-17 - Mahesh Subramony, David Kramer, Indrani Paul:
AMD Ryzen 7040 Series. 18-24 - Jason Howard, Joshua B. Fryman, Shamsul Abedin:
The First Direct Mesh-to-Mesh Photonic Fabric. 25-32 - Amir Gholami, Zhewei Yao, Sehoon Kim, Coleman Hooper, Michael W. Mahoney, Kurt Keutzer:
AI and Memory Wall. 33-39 - Byeongho Kim, Sanghoon Cha, Sangsoo Park, Jieun Lee, Sukhan Lee, Shinhaeng Kang, Jinin So, Kyungsoo Kim, Jin Jung, Jong-Geon Lee, Sunjung Lee, Yoonah Paik, Hyeonsu Kim, Jin-Seong Kim, Won-Jo Lee, Yuhwan Ro, Yeongon Cho, Jin Hyun Kim, Joon-Ho Song, Jaehoon Yu, Seungwon Lee, Jeonghyeon Cho, Kyomin Sohn:
The Breakthrough Memory Solutions for Improved Performance on LLM Inference. 40-48 - Sean Lie:
Inside the Cerebras Wafer-Scale Cluster. 49-57 - Ian Winfield, Tim Ouradnik, Joseph Madril, Michael Matthews, Guillermo Romero:
High-Performance Cooling for Power Electronics via Electrochemical Additive Manufacturing. 58-66 - Michael Gibbs, Kieran Woodward, Eiman Kanjo:
Combining Multiple Tiny Machine Learning Models for Multimodal Context-Aware Stress Recognition on Constrained Microcontrollers. 67-75 - Joshua J. Yi:
Analysis of Historical Patenting Behavior and Patent Characteristics of Computer Architecture Companies - Part X: Patent Families. 76-80 - Shane M. Greenstein:
The Worlds I See: Curiosity, Exploration, and the Discovery at the Dawn of AI - Fei-Fei Li (New York, NY, USA: Flatiron Books, 2023, 336 pp.). 82-84
Volume 44, Number 4, July - August 2024
- Hsien-Hsin S. Lee:
Top Picks Ignite Innovation. 4-5 - Yan Solihin:
Special Issue on Top Picks From the 2023 Computer Architecture Conferences. 6-10 - Kuan-Chieh Hsu, Hung-Wei Tseng:
Simultaneous and Heterogenous Multithreading: Exploiting Simultaneous and Heterogeneous Parallelism in Accelerator-Rich Architectures. 11-19 - Ajeya Naithani, Jaime Roelandts, Sam Ainsworth, Timothy M. Jones, Lieven Eeckhout:
Decoupled Vector Runahead for Prefetching Nested Memory-Access Chains. 20-26 - Björn Gottschall, Lieven Eeckhout, Magnus Jahre:
Per-Instruction Cycle Stacks Through Time-Proportional Event Analysis. 27-33 - Mingyu Liang, Yu Gan, Yueying Li, Carlos Torres, Abhishek Dhanotia, Mahesh Ketkar, Christina Delimitrou:
End-to-End Cloud Application Cloning With Ditto. 34-43 - Kaiyang Zhao, Kaiwen Xue, Ziqi Wang, Dan Schatzberg, Leon Yang, Antonis Manousis, Johannes Weiner, Rik van Riel, Bikash Sharma, Chunqiang Tang, Dimitrios Skarlatos:
Contiguitas: The Pursuit of Physical Memory Contiguity in Data Centers. 44-51 - Jaehyun Han, Krishnan Gosakan, William Kuszmaul, Ibrahim N. Mubarek, Nirjhar Mukherjee, Karthik Sriram, Guido Tagliavini, Evan West, Michael A. Bender, Abhishek Bhattacharjee, Alex Conway, Martín Farach-Colton, Jayneel Gandhi, Rob Johnson, Sudarsun Kannan, Donald E. Porter:
Mosaic Pages: Big TLB Reach With Small Pages. 52-59 - Haocong Luo, Ataberk Olgun, Abdullah Giray Yaglikçi, Yahya Can Tugrul, Steve Rhyner, Meryem Banu Cavlak, Joël Lindegger, Mohammad Sadrosadati, Onur Mutlu:
RowPress Vulnerability in Modern DRAM Chips. 60-69 - Shravan Narayan, Tal Garfinkel, Mohammadkazem Taram, Joey Rudek, Daniel Moghimi, Evan Johnson, Chris Fallin, Anjo Vahldiek-Oberwagner, Michael LeMay, Ravi Sahita, Dean M. Tullsen, Deian Stefan:
Hardware-Assisted Fault Isolation: Going Beyond the Limits of Software-Based Sandboxing. 70-79 - Gerasimos Gerogiannis, Josep Torrellas:
Practical Online Reinforcement Learning for Microprocessors With Micro-Armed Bandit. 80-87 - Nathaniel Bleier, Abigail Wezelis, Lav R. Varshney, Rakesh Kumar:
Programmable Olfactory Computing. 88-96 - Seah Kim, Jerry Zhao, Krste Asanovic, Borivoje Nikolic, Yakun Sophia Shao:
AuRORA: A Full-Stack Solution for Scalable and Virtualized Accelerator Integration. 97-105 - Raghavendra Pradyumna Pothukuchi, Karthik Sriram, Michal Gerasimiuk, Muhammed Ugur, Rajit Manohar, Anurag Khandelwal, Abhishek Bhattacharjee:
Distributed Brain-Computer Interfacing With a Networked Multiaccelerator Architecture. 106-115 - Joshua J. Yi:
Analysis of Historical Patenting Behavior and Patent Characteristics of Computer Architecture Companies - Part XI: Patent Families. 116-120 - Shane Greenstein:
Navigating Applications Development in Generative AI. 122-124
Volume 44, Number 5, September - October 2024
- Hsien-Hsin S. Lee:
The Path to Powering Intelligence. 4-5 - John L. Hennessy, Christos Kozyrakis, Gabriel Falcão:
Special Issue on The Past, Present, and Future of Warehouse-Scale Computing. 6-7 - John L. Hennessy:
Luiz André Barroso: Brilliant Engineer, Humble Leader, and Mentor. 8-10 - Parthasarathy Ranganathan, Urs Hölzle:
Twenty Five Years of Warehouse-Scale Computing. 11-22 - Leah Shalev, Hani Ayoub, Nafea Bshara, Yuval Fatael, Ori Golan, Omer Ilany, Anna Levin, Zorik Machulsky, Kevin Milczewski, Marc Olson, Valentin Priescu, Shyam Rajagopal, Ali Saidi:
The Tail at Amazon Web Services Scale. 23-29 - Ricardo Bianchini, Christian Belady, Anand Sivasubramaniam:
Data Center Power and Energy Management: Past, Present, and Future. 30-36 - Carole-Jean Wu, Bilge Acun, Ramya Raghavendra, Kim M. Hazelwood:
Beyond Efficiency: Scaling AI Sustainably. 37-46 - Yiquan Chen, Yuan Xie, Yijing Wang, Jiexiong Xu, Zhen Jin, Anyu Li, Xiaoyan Fu, Qiang Liu, Wenzhi Chen:
Optimizing NVMe Storage for Large-Scale Deployment: Key Technologies and Strategies in Alibaba Cloud. 47-56 - Christina Delimitrou, Michael Marty:
Tales of the Tail: Past and Future. 57-64 - Babak Falsafi, Michael Ferdman, Boris Grot:
Server Architecture From Enterprise to Post-Moore. 65-73 - Andrei Bersatti, Euna Kim, Hyesoon Kim:
Quantifying CO2 Emission Reduction Through Spatial Partitioning in Deep Learning Recommendation System Workloads. 75-82 - Joshua J. Yi:
Analysis of Historical Patenting Behavior and Patent Characteristics of Computer Architecture Companies - Part XII: Patent Families. 83-88 - Shane Greenstein:
Commercial and Scientific Prototypes. 90-92
Volume 44, Number 6, November - December 2024
- Hsien-Hsin S. Lee:
Strategic Pivot of Long-Standing x86 Rivals. 4-5 - John B. Carter:
Special Issue on Contemporary Industry Products 2024. 6-7 - Patrick J. Meaney, Ashutosh Mishra, Rajat Rao:
Synchronous, Low-Latency, Off-Module Interface for the IBM z16 Telum Processor. 8-16 - Seungjae Moon, Jung-Hoon Kim, Junsoo Kim, Seongmin Hong, Junseo Cha, Minsu Kim, Sukbin Lim, Gyubin Choi, Dongjin Seo, Jongho Kim, Hunjong Lee, Hyunjun Park, Ryeowook Ko, Soongyu Choi, Jongse Park, Jinwon Lee, Joo-Young Kim:
A Latency Processing Unit: A Latency-Optimized and Highly Scalable Processor for Large Language Model Inference. 17-33 - Raghu Prabhakar, Ram Sivaramakrishnan, Darshan Gandhi, Yun Du, Mingran Wang, Xiangyu Song, Kejie Zhang, Tianren Gao, Angela Wang, Xiaoyan Li, Joshua Brot, Calvin Leung, Tuowen Zhao, Mark Gottscho, Zhengyu Chen, Kaizhao Liang, Swayambhoo Jain, Urmish Thakker, Kevin J. Brown, Kunle Olukotun:
Composition of Experts on the SN40L Reconfigurable Dataflow Unit. 34-43 - Krishnakumar Nair, Avinash-Chandra Pandey, Siddappa Karabannavar, Meena Arunachalam, John Kalamatianos, Varun Agrawal, Saurabh Gupta, Ashish Sirasao, Elliott Delaye, Steven K. Reinhardt, Rajesh Vivekanandham, Ralph Wittig, Vinod Kathail, Padmini Gopalakrishnan, Satyaprakash Pareek, Rishabh Jain, Mahmut Taylan Kandemir, Jun-Liang Lin, Gulsum Gudukbay Akbulut, Chita R. Das:
Parallelization Strategies for DLRM Embedding Bag Operator on AMD CPUs. 44-51 - Nathan Beckmann, Brandon Lucia, Graham Gobieski, Tony Nowatzki, Thomas C. Jackson, Guénolé Lallement, Keyi Zhang, Amolak Nagi, Atharv Sathe, Harsh Desai:
Monza: An Energy-Minimal, General-Purpose Dataflow System-on-Chip for the Internet of Things. 52-62 - Sanchari Sen, Shubham Jain, Sarada Krithivasan, Swagath Venkataramani, Vijayalakshmi Srinivasan:
DNNDaSher: A Compiler Framework for Dataflow Compatible End-to-End Acceleration on IBM AIU. 63-72 - Alejandro Rico, Satyaprakash Pareek, Javier Cabezas, David Clarke, Baris Özgül, Francisco Barat, Yao Fu, Stephan Münz, Dylan Stuart, Patrick Schlangen, Pedro Duarte, Sneha Date, Indrani Paul, Jian Weng, Sonal Santan, Vinod Kathail, Ashish Sirasao, Juanjo Noguera:
AMD XDNA NPU in Ryzen AI Processors. 73-82 - Jade Alglave, Richard Grisenthwaite, Artem Khyzha, Luc Maranget, Nikos Nikoleris:
Puss in Boots: Formalizing Arm's Virtual Memory System Architecture. 83-91 - Joshua J. Yi:
A Review of Wisconsin Alumni Research Foundation v. Apple - Part I. 92-96 - Lizy Kurian John:
Mauricio Breternitz Jr. 98-99 - Shane Greenstein:
Unpriced and Crucial. 100-102
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