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ORCIDChirag S. Patel
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2010 – 2019
- 2011
[c9]Chirag S. Patel, Varun Khaitan, Sumeeth Nagaraja, Farhad Meshkati, Yeliz Tokgoz, Mehmet Yavuz:
Downlink interference management techniques for residential femtocells. PIMRC 2011: 117-121- [c8]Sumeeth Nagaraja, Varun Khaitan, Yi Jiang, Chirag S. Patel, Farhad Meshkati, Yeliz Tokgoz, Mehmet Yavuz:
Downlink Transmit Power Calibration for Enterprise Femtocells. VTC Fall 2011: 1-5
2000 – 2009
- 2009
- [j11]Pierre A. Humblet, Balaji Raghothaman, Anand Srinivas, Srinivasan Balasubramanian, Chirag S. Patel, Mehmet Yavuz:
System design of CDMA2000 femtocells. IEEE Commun. Mag. 47(9): 92-100 (2009) - 2008
- [j10]John U. Knickerbocker, Paul S. Andry, Bing Dang, Raymond R. Horton, Mario J. Interrante, Chirag S. Patel, Robert J. Polastre, Katsuyuki Sakuma
, Ranjani Sirdeshmukh, Edmund J. Sprogis, Sri M. Sri-Jayantha, Antonio M. Stephens, Anna W. Topol, Cornelia K. Tsang, Bucknell C. Webb, Steven L. Wright:
Three-dimensional silicon integration. IBM J. Res. Dev. 52(6): 553-569 (2008) - [j9]Bing Dang, Steven L. Wright, Paul S. Andry, Edmund J. Sprogis, Cornelia K. Tsang, M. John Interrante, Bucknell C. Webb, Robert J. Polastre, Raymond R. Horton, Chirag S. Patel, Arun Sharma, J. Zheng, Katsuyuki Sakuma, John U. Knickerbocker:
3D chip stacking with C4 technology. IBM J. Res. Dev. 52(6): 599-609 (2008) - [j8]Katsuyuki Sakuma, Paul S. Andry, Cornelia K. Tsang, Steven L. Wright, Bing Dang, Chirag S. Patel, Bucknell C. Webb, J. Maria, Edmund J. Sprogis, S. K. Kang, Robert J. Polastre, Raymond R. Horton, John U. Knickerbocker:
3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnections. IBM J. Res. Dev. 52(6): 611-622 (2008) - [c7]Harris Teague, Chirag S. Patel, Dhananjay Gore, Hemanth Sampath, Ayman F. Naguib, Tamer Kadous, Alexei Gorokhov, Avneesh Agrawal:
Field Results on MIMO Performance in UMB Systems. VTC Spring 2008: 1009-1015 - 2007
- [j7]Chirag S. Patel, Gordon L. Stüber:
Channel Estimation for Amplify and Forward Relay Based Cooperation Diversity Systems. IEEE Trans. Wirel. Commun. 6(6): 2348-2356 (2007) - 2006
- [b1]Chirag S. Patel:
Wireless Channel Modeling, Simulation, and Estimation. Georgia Institute of Technology, Atlanta, GA, USA, 2006 - [j6]John U. Knickerbocker, Chirag S. Patel, Paul S. Andry, Cornelia K. Tsang, L. Paivikki Buchwalter, Edmund J. Sprogis, Hua Gan, Raymond R. Horton, Robert J. Polastre, Steven L. Wright, John M. Cotte:
3-D Silicon Integration and Silicon Packaging Technology Using Silicon Through-Vias. IEEE J. Solid State Circuits 41(8): 1718-1725 (2006) - [j5]Chirag S. Patel, Gordon L. Stüber, Thomas G. Pratt:
Statistical properties of amplify and forward relay fading channels. IEEE Trans. Veh. Technol. 55(1): 1-9 (2006) - [c6]Chirag S. Patel:
Silicon carrier for computer systems. DAC 2006: 857-862 - [c5]Chirag S. Patel, Mehmet Yavuz, Yeliz Tokgoz:
Handoff performance analysis for 1xEV-DO Rev. A systems. ICC 2006: 4924-4929 - 2005
- [j4]John U. Knickerbocker, Paul S. Andry, L. Paivikki Buchwalter, Alina Deutsch, Raymond R. Horton, Keith A. Jenkins, Young Hoon Kwark, Gerald McVicker, Chirag S. Patel, Robert J. Polastre, Christian D. Schuster, Arun Sharma, Sri M. Sri-Jayantha, Christopher W. Surovic, Cornelia K. Tsang, Bucknell C. Webb, Steven L. Wright, Samuel R. McKnight, Edmund J. Sprogis, Bing Dang:
Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection. IBM J. Res. Dev. 49(4-5): 725-754 (2005) - [j3]Chirag S. Patel, Gordon L. Stüber, Thomas G. Pratt:
Comparative analysis of statistical models for the simulation of Rayleigh faded cellular channels. IEEE Trans. Commun. 53(6): 1017-1026 (2005) - [j2]Chirag S. Patel, Gordon L. Stüber, Thomas G. Pratt:
Simulation of Rayleigh-faded mobile-to-mobile communication channels. IEEE Trans. Commun. 53(11): 1876-1884 (2005) - [c4]John U. Knickerbocker, Chirag S. Patel, Paul S. Andry, Cornelia K. Tsang, L. Paivikki Buchwalter, Edmund J. Sprogis, Hua Gan, Raymond R. Horton, Robert J. Polastre, Steven L. Wright, Christian D. Schuster, Christian W. Baks, Fuad E. Doany, Joanna Rosner, Steven Cordes:
Three dimensional silicon integration using fine pitch interconnection, silicon processing and silicon carrier packaging technology. CICC 2005: 659-662 - 2004
- [c3]Chirag S. Patel, Gordon L. Stüber, Thomas G. Pratt:
Analysis of OFDM/MC-CDMA under channel estimation and jamming. WCNC 2004: 954-958 - 2002
- [j1]James D. Meindl, Jeffrey A. Davis, Payman Zarkesh-Ha, Chirag S. Patel, Kevin P. Martin, Paul A. Kohl:
Interconnect opportunities for gigascale integration. IBM J. Res. Dev. 46(2-3): 245-264 (2002)
1990 – 1999
- 1997
- [c2]Chirag S. Patel, Sek M. Chai, Sudhakar Yalamanchili, David E. Schimmel:
Power Constrained Design of Multiprocessor Interconnection Networks. ICCD 1997: 408-416 - [c1]Chirag S. Patel, Sek M. Chai, Sudhakar Yalamanchili, David E. Schimmel:
Power/Performance Trade-offs for Direct Networks. PCRCW 1997: 231-246
Coauthor Index
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