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ORCIDEren Kursun
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2020 – today
- 2021
[i1]Hongda Shen, Eren Kursun:
Label Augmentation via Time-based Knowledge Distillation for Financial Anomaly Detection. CoRR abs/2101.01689 (2021)
2010 – 2019
- 2017
- [j16]Krishnendu Chakrabarty
, Massimo Alioto, Bevan M. Baas, Chirn Chye Boon, Meng-Fan Chang, Naehyuck Chang, Yao-Wen Chang, Chip-Hong Chang, Shih-Chieh Chang, Poki Chen, Masud H. Chowdhury, Pasquale Corsonello, Ibrahim Abe M. Elfadel, Said Hamdioui, Masanori Hashimoto, Tsung-Yi Ho, Houman Homayoun, Yuh-Shyan Hwang, Rajiv V. Joshi, Tanay Karnik, Mehran Mozaffari Kermani, Chulwoo Kim, Tae-Hyoung Kim, Jaydeep P. Kulkarni, Eren Kursun, Erik Larsson, Hai (Helen) Li, Huawei Li, Patrick P. Mercier, Prabhat Mishra, Makoto Nagata, Arun S. Natarajan, Koji Nii, Partha Pratim Pande, Ioannis Savidis, Mingoo Seok, Sheldon X.-D. Tan, Mark M. Tehranipoor, Aida Todri-Sanial, Miroslav N. Velev, Xiaoqing Wen, Jiang Xu, Wei Zhang, Zhengya Zhang, Stacey Weber Jackson:
Editorial. IEEE Trans. Very Large Scale Integr. Syst. 25(1): 1-20 (2017) - [j15]Qiaosha Zou, Eren Kursun, Yuan Xie:
Thermomechanical Stress-Aware Management for 3-D IC Designs. IEEE Trans. Very Large Scale Integr. Syst. 25(9): 2678-2682 (2017) - [c21]Jaya Dofe, Peng Gu, Dylan C. Stow, Qiaoyan Yu, Eren Kursun, Yuan Xie:
Security Threats and Countermeasures in Three-Dimensional Integrated Circuits. ACM Great Lakes Symposium on VLSI 2017: 321-326 - [c20]Pavan Kumar Chundi, Yini Zhou, Martha A. Kim, Eren Kursun, Mingoo Seok:
Hotspot monitoring and Temperature Estimation with miniature on-chip temperature sensors. ISLPED 2017: 1-6 - [c19]Teng Yang, Pavan Kumar Chundi, Seongjong Kim, Eren Kursun, Martha A. Kim, Peter R. Kinget, Mingoo Seok:
Compact and voltage-scalable sensor for accurate thermal sensing in dynamic thermal management. MWSCAS 2017: 33-36 - 2016
- [c18]Peng Gu, Shuangchen Li, Dylan C. Stow, Russell Barnes, Liu Liu, Yuan Xie, Eren Kursun:
Leveraging 3D Technologies for Hardware Security: Opportunities and Challenges. ACM Great Lakes Symposium on VLSI 2016: 347-352 - [c17]Peng Gu, Dylan C. Stow, Russell Barnes, Eren Kursun, Yuan Xie:
Thermal-aware 3D design for side-channel information leakage. ICCD 2016: 520-527 - 2014
- [c16]Philip G. Emma, Alper Buyuktosunoglu, Michael B. Healy, Krishnan Kailas, Valentin Puente, Roy Yu, Allan Hartstein, Pradip Bose, Jaime H. Moreno, Eren Kursun:
3D stacking of high-performance processors. HPCA 2014: 500-511 - 2013
- [j14]Guangyu Sun, Eren Kursun, Jude A. Rivers, Yuan Xie:
Exploring the vulnerability of CMPs to soft errors with 3D stacked nonvolatile memory. ACM J. Emerg. Technol. Comput. Syst. 9(3): 22:1-22:22 (2013) - [j13]Yibo Chen, Eren Kursun, Dave Motschman, Charles Johnson, Yuan Xie:
Through Silicon Via Aware Design Planning for Thermally Efficient 3-D Integrated Circuits. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 32(9): 1335-1346 (2013) - [c15]Qiaosha Zou, Tao Zhang, Eren Kursun, Yuan Xie:
Thermomechanical stress-aware management for 3D IC designs. DATE 2013: 1255-1258 - 2012
- [j12]Eren Kursun, Jamil A. Wakil, Mukta Farooq, Robert Hannon:
Spatial and temporal thermal characterization of stacked multicore architectures. ACM J. Emerg. Technol. Comput. Syst. 8(3): 21:1-21:17 (2012) - [j11]Haifeng Qian, Sachin S. Sapatnekar, Eren Kursun:
Fast poisson solvers for thermal analysis. ACM Trans. Design Autom. Electr. Syst. 17(3): 32:1-32:23 (2012) - [c14]Huapeng Zhou, Xin Li, Chen-Yong Cher, Eren Kursun, Haifeng Qian, Shi-Chune Yao:
An information-theoretic framework for optimal temperature sensor allocation and full-chip thermal monitoring. DAC 2012: 642-647 - 2011
- [j10]Víctor Jiménez, Francisco J. Cazorla, Roberto Gioiosa, Mateo Valero, Carlos Boneti, Eren Kursun, Chen-Yong Cher, Canturk Isci, Alper Buyuktosunoglu, Pradip Bose:
Characterizing Power and Temperature Behavior of POWER6-Based System. IEEE J. Emerg. Sel. Topics Circuits Syst. 1(3): 228-241 (2011) - [j9]Víctor Jiménez, Francisco J. Cazorla, Roberto Gioiosa, Eren Kursun, Canturk Isci, Alper Buyuktosunoglu, Pradip Bose, Mateo Valero:
Energy-Aware Accounting and Billing in Large-Scale Computing Facilities. IEEE Micro 31(3): 60-71 (2011) - [j8]Chen-Yong Cher, Eren Kursun:
Exploring the effects of on-chip thermal variation on high-performance multicore architectures. ACM Trans. Archit. Code Optim. 8(1): 2:1-2:22 (2011) - [c13]Jeff Burns, Gary Carpenter, Eren Kursun, Ruchir Puri, James D. Warnock, Michael Scheuermann:
Design, CAD and technology challenges for future processors: 3D perspectives. DAC 2011: 212 - [c12]Guangyu Sun, Eren Kursun, Jude A. Rivers, Yuan Xie:
Exploring the vulnerability of CMPs to soft errors with 3D stacked non-volatile memory. ICCD 2011: 366-372 - [c11]Yibo Chen, Eren Kursun, Dave Motschman, Charles Johnson, Yuan Xie:
Analysis and mitigation of lateral thermal blockage effect of through-silicon-via in 3D IC designs. ISLPED 2011: 397-402 - 2010
- [c10]Víctor Jiménez, Francisco J. Cazorla, Roberto Gioiosa, Mateo Valero, Carlos Boneti, Eren Kursun, Chen-Yong Cher, Canturk Isci, Alper Buyuktosunoglu, Pradip Bose:
Power and thermal characterization of POWER6 system. PACT 2010: 7-18 - [c9]Pradip Bose, Alper Buyuktosunoglu, Chen-Yong Cher, John A. Darringer, Meeta Sharma Gupta, Hendrik F. Hamann, Hans M. Jacobson, Prabhakar Kudva, Eren Kursun, Niti Madan, Indira Nair, Jude A. Rivers, Jeonghee Shin, Alan J. Weger, Victor V. Zyuban:
Power-efficient, reliable microprocessor architectures: modeling and design methods. ACM Great Lakes Symposium on VLSI 2010: 299-304 - [c8]Víctor Jiménez, Roberto Gioiosa, Eren Kursun, Francisco J. Cazorla, Chen-Yong Cher, Alper Buyuktosunoglu, Pradip Bose, Mateo Valero:
Trends and techniques for energy efficient architectures. VLSI-SoC 2010: 276-279
2000 – 2009
- 2009
- [j7]Philip G. Emma, Eren Kursun:
Opportunities and Challenges for 3D Systems and Their Design. IEEE Des. Test Comput. 26(5): 6-14 (2009) - [j6]Eren Kursun, Chen-Yong Cher:
Temperature Variation Characterization and Thermal Management of Multicore Architectures. IEEE Micro 29(1): 116-126 (2009) - 2008
- [j5]Philip G. Emma, Eren Kursun:
Is 3D chip technology the next growth engine for performance improvement? IBM J. Res. Dev. 52(6): 541-552 (2008) - [j4]Yuchun Ma, Yongxiang Liu, Eren Kursun, Glenn Reinman, Jason Cong:
Investigating the effects of fine-grain three-dimensional integration on microarchitecture design. ACM J. Emerg. Technol. Comput. Syst. 4(4): 17:1-17:30 (2008) - [c7]Eren Kursun, Chen-Yong Cher:
Variation-aware thermal characterization and management of multi-core architectures. ICCD 2008: 280-285 - 2007
- [c6]Yongxiang Liu, Yuchun Ma, Eren Kursun, Glenn Reinman, Jason Cong:
Fine grain 3D integration for microarchitecture design through cube packing exploration. ICCD 2007: 259-266 - 2006
- [j3]Eren Kursun, Anahita Shayesteh, Suleyman Sair, Timothy Sherwood, Glenn Reinman:
An Evaluation of Deeply Decoupled Cores. J. Instr. Level Parallelism 8 (2006) - 2005
- [j2]Eren Kursun, Rajarshi Mukherjee, Seda Ogrenci Memik:
Early Quality Assessment for Low Power Behavioral Synthesis. J. Low Power Electron. 1(3): 273-285 (2005) - [c5]Anahita Shayesteh, Eren Kursun, Timothy Sherwood, Suleyman Sair, Glenn Reinman:
Reducing the Latency and Area Cost of Core Swapping through Shared Helper Engines. ICCD 2005: 17-23 - 2004
- [c4]Eren Kursun, Soheil Ghiasi, Majid Sarrafzadeh:
Transistor Level Budgeting for Power Optimization. ISQED 2004: 116-121 - [c3]Eren Kursun, Glenn Reinman, Suleyman Sair, Anahita Shayesteh, Timothy Sherwood:
Low-Overhead Core Swapping for Thermal Management. PACS 2004: 46-60 - 2003
- [c2]Seda Ogrenci Memik, Gokhan Memik, Roozbeh Jafari, Eren Kursun:
Global resource sharing for synthesis of control data flow graphs on FPGAs. DAC 2003: 604-609 - 2002
- [j1]Ankur Srivastava, Eren Kursun, Majid Sarrafzadeh:
Predictability in RT-Level Designs. J. Circuits Syst. Comput. 11(4): 323-332 (2002) - [c1]Eren Kursun, Ankur Srivastava, Seda Ogrenci Memik, Majid Sarrafzadeh:
Early evaluation techniques for low power binding. ISLPED 2002: 160-165
Coauthor Index
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