"An IC manufacturing yield model considering intra-die variations."

Jianfeng Luo et al. (2006)

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DOI: 10.1145/1146909.1147100

access: closed

type: Conference or Workshop Paper

metadata version: 2018-11-06

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Jianfeng Luo, Subarna Sinha, Qing Su, Jamil Kawa, Charles C. Chiang:
An IC manufacturing yield model considering intra-die variations. DAC 2006: 749-754

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