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ORCIDChee Lip Gan
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- affiliation: Nanyang Technological University, Temasek Laboratories, Singapore
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2020 – today
- 2024
[j19]Xiao Mei Zeng
, Qing Liu, Chee Lip Gan:
A Comprehensive Data Retrieval and Correction Approach From 40-nm Flash Memory With Selective Chemical Engraving. IEEE Trans. Inf. Forensics Secur. 19: 1031-1040 (2024)- [c9]Xiaomei Zeng, Qing Liu, Samuel Chef, Chee Lip Gan:
A Security Assessment of Protected Execute-Only Firmware in Microcontrollers Through Selective Chemical Engraving. HOST 2024: 12-20 - [c8]Samuel Chef, Chung Tah Chua, Jing Yun Tay, Chee Lip Gan:
Explainable automated data estimation in Logic State Imaging of embedded SRAM. ISCAS 2024: 1-5 - 2022
- [j18]Xiao Mei Zeng, Qing Liu, Jing Yun Tay, Chee Lip Gan:
Selective Staining on Non-Volatile Memory Cells for Data Retrieval. IEEE Trans. Inf. Forensics Secur. 17: 1884-1892 (2022) - [c7]Samuel Chef, Chung Tah Chua, Jing Yun Tay, Jason Cheah, Chee Lip Gan:
Embedded-EEPROM descrambling via laser-based techniques - A case study on AVR MCU. FDTC 2022: 1-8
2010 – 2019
- 2018
- [j17]Wardhana A. Sasangka, Yu Gao, Chee Lip Gan, Carl V. Thompson:
Impact of carbon impurities on the initial leakage current of AlGaN/GaN high electron mobility transistors. Microelectron. Reliab. 88-90: 393-396 (2018) - 2017
- [j16]Jakub Breier, Wei He, Shivam Bhasin, Dirmanto Jap, Samuel Chef, Hock Guan Ong, Chee Lip Gan:
Extensive Laser Fault Injection Profiling of 65 nm FPGA. J. Hardw. Syst. Secur. 1(3): 237-251 (2017) - [j15]Wardhana A. Sasangka, Govindo J. Syaranamual, Y. Gao, Riko I. Made, Chee Lip Gan, Carl V. Thompson:
Improved reliability of AlGaN/GaN-on-Si high electron mobility transistors (HEMTs) with high density silicon nitride passivation. Microelectron. Reliab. 76-77: 287-291 (2017) - [j14]Riko I. Made, Yu Gao, Govindo J. Syaranamual, Wardhana A. Sasangka, L. Zhang, Xuan Sang Nguyen, Y. Y. Tay, Jason Scott Herrin, Carl V. Thompson, Chee Lip Gan:
Characterisation of defects generated during constant current InGaN-on-silicon LED operation. Microelectron. Reliab. 76-77: 561-565 (2017) - 2016
- [j13]Adeline B. Y. Lim, Wei Jian Neo, Oranna Yauw, Bob Chylak, Chee Lip Gan, Zhong Chen:
Evaluation of the corrosion performance of Cu-Al intermetallic compounds and the effect of Pd addition. Microelectron. Reliab. 56: 155-161 (2016) - [j12]Vinod K. Murugan, Zhigang Jia, Govindo J. Syaranamual, Chee Lip Gan, Yizhong Huang, Zhong Chen:
Atmospheric corrosion resistance of electroplated Ni/Ni-P/Au electronic contacts. Microelectron. Reliab. 60: 84-92 (2016) - [j11]Adeline B. Y. Lim, Chris B. Boothroyd, Oranna Yauw, Bob Chylak, Chee Lip Gan, Zhong Chen:
Interfacial evolution and bond reliability in thermosonic Pd coated Cu wire bonding on aluminum metallization: Effect of palladium distribution. Microelectron. Reliab. 63: 214-223 (2016) - [j10]Chung Tah Chua, Hock Guan Ong, Kevin Sanchez, Philippe Perdu, Chee Lip Gan:
Effects of voltage stress on the single event upset (SEU) response of 65 nm flip flop. Microelectron. Reliab. 64: 199-203 (2016) - [j9]Govindo J. Syaranamual, Wardhana A. Sasangka, Riko I. Made, Subramaniam Arulkumaran, Geok Ing Ng, Siew Chuen Foo, Chee Lip Gan, Carl V. Thompson:
Role of two-dimensional electron gas (2DEG) in AlGaN/GaN high electron mobility transistor (HEMT) ON-state degradation. Microelectron. Reliab. 64: 589-593 (2016) - [c6]Wei He, Jakub Breier, Shivam Bhasin, Dirmanto Jap, Hock Guan Ong, Chee Lip Gan:
Comprehensive Laser Sensitivity Profiling and Data Register Bit-Flips for Cryptographic Fault Attacks in 65 Nm FPGA. SPACE 2016: 47-65 - 2015
- [j8]Samuel Chef, Sabir Jacquir, Kevin Sanchez, Philippe Perdu, Stéphane Binczak, Chee Lip Gan:
Unsupervised learning for signal mapping in dynamic photon emission. Microelectron. Reliab. 55(9-10): 1564-1568 (2015) - [c5]Yuan Yuan Dai, Mei Zhen Ng, P. Anantha, Chee Lip Gan, Chuan Seng Tan:
Copper micro and nano particles mixture for 3D interconnections application. 3DIC 2015: TS8.9.1-TS8.9.5 - [c4]Wardhana A. Sasangka, Govindo J. Syaranamual, Chee Lip Gan, Carl V. Thompson:
Origin of physical degradation in AlGaN/GaN on Si high electron mobility transistors under reverse bias stressing. IRPS 2015: 6 - 2014
- [j7]Adeline B. Y. Lim, Andrew C. K. Chang, Oranna Yauw, Bob Chylak, Chee Lip Gan, Zhong Chen:
Ultra-fine pitch palladium-coated copper wire bonding: Effect of bonding parameters. Microelectron. Reliab. 54(11): 2555-2563 (2014) - [j6]Ahmed Sharif, Chee Lip Gan, Zhong Chen:
Customized glass sealant for ceramic substrates for high temperature electronic application. Microelectron. Reliab. 54(12): 2905-2910 (2014) - 2013
- [j5]M. K. Lim, Vassilios A. Chouliaras, Chee Lip Gan, Vincent M. Dwyer:
Bidirectional electromigration failure. Microelectron. Reliab. 53(9-11): 1261-1265 (2013) - [j4]F. L. Lau, Riko I. Made, Wahyuaji Narottama Putra, J. Z. Lim, V. C. Nachiappan, J. L. Aw, Chee Lip Gan:
Electrical behavior of Au-Ge eutectic solder under aging for solder bump application in high temperature Electronics. Microelectron. Reliab. 53(9-11): 1581-1586 (2013) - 2012
- [j3]Meng Keong Lim, Jingyuan Lin, Yong Chiang Ee, Chee Mang Ng, Jun Wei, Chee Lip Gan:
Experimental characterization and modelling of electromigration lifetime under unipolar pulsed current stress. Microelectron. Reliab. 52(8): 1553-1558 (2012) - 2011
- [j2]Fulvio Infante, Philippe Perdu, H. B. Kor, Chee Lip Gan, Dean Lewis:
Magnetic field spatial Fourier analysis: A new opportunity for high resolution current localization. Microelectron. Reliab. 51(9-11): 1684-1688 (2011) - [c3]Fa Xing Che, Wahyuaji Narottama Putra, A. Heryanto, A. Trigg, S. Gao, Chee Lip Gan:
Numerical and experimental study on Cu protrusion of Cu-filled through-silicon vias (TSV). 3DIC 2011: 1-6
2000 – 2009
- 2007
- [j1]Syed M. Alam, Chee Lip Gan, Carl V. Thompson, Donald E. Troxel:
Reliability computer-aided design tool for full-chip electromigration analysis and comparison with different interconnect metallizations. Microelectron. J. 38(4-5): 463-473 (2007) - 2005
- [c2]Syed M. Alam, Frank L. Wei, Chee Lip Gan, Carl V. Thompson, Donald E. Troxel:
Electromigration Reliability Comparison of Cu and Al Interconnects. ISQED 2005: 303-308 - 2004
- [c1]Syed M. Alam, Chee Lip Gan, Carl V. Thompson, Donald E. Troxel:
Circuit Level Reliability Analysis of Cu Interconnects. ISQED 2004: 238-243
Coauthor Index
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