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Larry Smith 0004

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affiliation: Sematech, Albany, NY, USA
affiliation (PhD): University of Illinois, IL, USA

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2010 – 2019

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2012
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Benjamin Backes, Colin McDonough, Larry Smith, Wei Wang, Robert E. Geer:
Effects of Copper Plasticity on the Induction of Stress in Silicon from Copper Through-Silicon Vias (TSVs) for 3D Integrated Circuits. J. Electron. Test. 28(1): 53-62 (2012)

2000 – 2009

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2009
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Sherief Reda, Gregory Smith, Larry Smith:
Maximizing the Functional Yield of Wafer-to-Wafer 3-D Integration. IEEE Trans. Very Large Scale Integr. Syst. 17(9): 1357-1362 (2009)

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