"Effects of Copper Plasticity on the Induction of Stress in Silicon from ..."

Benjamin Backes et al. (2012)

> Home

Details and statistics

DOI: 10.1007/S10836-011-5242-7

access: closed

type: Journal Article

metadata version: 2024-10-06

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/et/BackesMSWG12
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/et/BackesMSWG12
Benjamin Backes, Colin McDonough, Larry Smith, Wei Wang, Robert E. Geer:
Effects of Copper Plasticity on the Induction of Stress in Silicon from Copper Through-Silicon Vias (TSVs) for 3D Integrated Circuits. J. Electron. Test. 28(1): 53-62 (2012)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.