"Characterization of stress distribution in ultra-thinned DRAM wafer."

Tomoji Nakamura et al. (2015)

> Home

Details and statistics

DOI: 10.1109/3DIC.2015.7334558

access: closed

type: Conference or Workshop Paper

metadata version: 2019-10-19

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - conf/3dic/NakamuraMKSO15
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/3dic/NakamuraMKSO15
Tomoji Nakamura, Yoriko Mizushima, Young-Suk Kim, Ryuichi Sugie, Takayuki Ohba:
Characterization of stress distribution in ultra-thinned DRAM wafer. 3DIC 2015: TS3.2.1-TS3.2.5

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.