"A Temporary Bonding De-Bonding Tape with High Thermal Resistance, Easy ..."

Moeki Nakano et al. (2024)

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DOI: 10.1109/3DIC63395.2024.10830209

access: closed

type: Conference or Workshop Paper

metadata version: 2025-01-23

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Moeki Nakano, Shigenori Nagahama, Toshio Takahashi, Takuya Yamamoto:
A Temporary Bonding De-Bonding Tape with High Thermal Resistance, Easy peeling and Excellent TTV for 3DIC. 3DIC 2024: 1-3

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