"Thermal analysis of multi-layer functional 3D logic stacks."

Michael Scheuermann et al. (2016)

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DOI: 10.1109/3DIC.2016.7969996

access: closed

type: Conference or Workshop Paper

metadata version: 2022-02-25

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Michael Scheuermann, Shurong Tian, Raphael Robertazzi, Matthew R. Wordeman, C. Bergeron, H. Jacobson, Phillip J. Restle, Joel Silberman, Christy Tyberg:
Thermal analysis of multi-layer functional 3D logic stacks. 3DIC 2016: 1-4

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