"Double-Pumping the Interconnect for Area Reduction in Coarse-Grained ..."

Xinyuan Wang et al. (2021)

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DOI: 10.1109/ASAP52443.2021.00043

access: closed

type: Conference or Workshop Paper

metadata version: 2023-08-04

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Xinyuan Wang, Tianyi Yu, Hsuan Hsiao, Jason Helge Anderson:
Double-Pumping the Interconnect for Area Reduction in Coarse-Grained Reconfigurable Arrays. ASAP 2021: 242-249

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