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"Fast 3-D thermal analysis of complex interconnect structures using ..."

Chuan Xu et al. (2009)

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DOI: 10.1145/1687399.1687521

access: closed

type: Conference or Workshop Paper

metadata version: 2022-10-07

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  dblp key:
  - conf/iccad/XuJKRDSB09
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  - https://dblp.org/rec/conf/iccad/XuJKRDSB09
Chuan Xu, Lijun Jiang, Seshadri K. Kolluri, Barry J. Rubin, Alina Deutsch, Howard H. Smith, Kaustav Banerjee:
Fast 3-D thermal analysis of complex interconnect structures using electrical modeling and simulation methodologies. ICCAD 2009: 658-665

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