"Interconnect thermal modeling for determining design limits on current ..."

Danqing Chen et al. (1999)

> Home

Details and statistics

DOI: 10.1145/299996.300057

access: closed

type: Conference or Workshop Paper

metadata version: 2018-11-06

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - conf/ispd/ChenLRK99
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/ispd/ChenLRK99
Danqing Chen, Erhong Li, Elyse Rosenbaum, Sung-Mo Kang:
Interconnect thermal modeling for determining design limits on current density. ISPD 1999: 172-178

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.