Location via proxy:   [ UP ]  
[Report a bug]   [Manage cookies]                

"Thermal coupling phenomenon in ICs cooled by integrated microchannels."

Piotr Zajac et al. (2017)

Details and statistics

DOI: 10.23919/MIXDES.2017.8005236

access: closed

type: Conference or Workshop Paper

metadata version: 2021-04-09