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"Integration of 5G and OPC UA for Smart Manufacturing of the Future."

Xiongfeng Zhang et al. (2023)

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DOI: 10.1109/SII55687.2023.10039191

access: closed

type: Conference or Workshop Paper

metadata version: 2023-02-23

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  dblp key:
  - conf/sii/ZhangLLSKYHYW23
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  - https://dblp.org/rec/conf/sii/ZhangLLSKYHYW23
Xiongfeng Zhang, Seonjo Lim, Changdae Lee, Won Seok Song, Yu Chul Kim, Mengmeng Yu, Seung Ho Hong, NamHyun Yoo, Min Wei:
Integration of 5G and OPC UA for Smart Manufacturing of the Future. SII 2023: 1-6

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