"Toward quantifying the IC design value of interconnect technology ..."

Tuck-Boon Chan, Andrew B. Kahng, Jiajia Li (2013)

> Home

Details and statistics

DOI: 10.1109/SLIP.2013.6681680

access: closed

type: Conference or Workshop Paper

metadata version: 2023-03-24

- view
  authority control:
- export record
  dblp key:
  - conf/slip/ChanKL13
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/slip/ChanKL13
Tuck-Boon Chan, Andrew B. Kahng, Jiajia Li:
Toward quantifying the IC design value of interconnect technology improvements. SLIP 2013: 1-6

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.