"Heat Dissipation Capability of a Package-on-Package Embedded Wafer-Level ..."

Yong Han et al. (2015)

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DOI: 10.1109/MDAT.2015.2440414

access: closed

type: Journal Article

metadata version: 2020-10-26

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Yong Han, Boon Long Lau, Boo Yang Jung, Xiaowu Zhang:
Heat Dissipation Capability of a Package-on-Package Embedded Wafer-Level Package. IEEE Des. Test 32(4): 32-39 (2015)

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