"Wafer map defect recognition based on deep transfer learning-based densely ..."

Jianbo Yu, Zongli Shen, Shijin Wang (2021)

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DOI: 10.1016/J.ENGAPPAI.2021.104387

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type: Journal Article

metadata version: 2022-02-01

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Jianbo Yu, Zongli Shen, Shijin Wang:
Wafer map defect recognition based on deep transfer learning-based densely connected convolutional network and deep forest. Eng. Appl. Artif. Intell. 105: 104387 (2021)

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