"Experimental Exploration of the Backside ESD Impacts on an IC Chip in Flip ..."

Takuya Wadatsumi et al. (2023)

> Home

Details and statistics

DOI: 10.1587/TRANSELE.2022CTP0004

access: closed

type: Journal Article

metadata version: 2024-02-05

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/ieicetc/WadatsumiKHMHSFKMN23
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/ieicetc/WadatsumiKHMHSFKMN23
Takuya Wadatsumi, Kohei Kawai, Rikuu Hasegawa, Kikuo Muramatsu, Hiromu Hasegawa, Takuya Sawada, Takahito Fukushima, Hisashi Kondo, Takuji Miki, Makoto Nagata:
Experimental Exploration of the Backside ESD Impacts on an IC Chip in Flip Chip Packaging. IEICE Trans. Electron. 106(10): 556-564 (2023)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.