"Impact of die thinning on the thermal performance of a central TSV bus in ..."

Samson Melamed et al. (2015)

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DOI: 10.1016/J.MEJO.2015.09.007

access: closed

type: Journal Article

metadata version: 2020-10-26

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Samson Melamed, Fumito Imura, Hiroshi Nakagawa, Katsuya Kikuchi, Michiya Hagimoto, Yukoh Matsumoto, Masahiro Aoyagi:
Impact of die thinning on the thermal performance of a central TSV bus in a 3D stacked circuit. Microelectron. J. 46(12): 1106-1113 (2015)

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