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"Using GA-SVM for defect inspection of flip chips based on vibration signals."

Ke Li et al. (2018)

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DOI: 10.1016/J.MICROREL.2017.12.032

access: closed

type: Journal Article

metadata version: 2020-02-22

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  - journals/mr/LiWWZLS18
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  - https://dblp.org/rec/journals/mr/LiWWZLS18
Ke Li, Lingyu Wang, Jingjing Wu, Qiuju Zhang, Guanglan Liao, Lei Su:
Using GA-SVM for defect inspection of flip chips based on vibration signals. Microelectron. Reliab. 81: 159-166 (2018)

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