"Fast temperature cycling and electromigration induced thin film cracking ..."

H. V. Nguyen et al. (2002)

> Home

Details and statistics

DOI: 10.1016/S0026-2714(02)00161-0

access: closed

type: Journal Article

metadata version: 2021-10-14

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/mr/NguyenSVVKBMK02
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/mr/NguyenSVVKBMK02
H. V. Nguyen, Cora Salm, J. Vroemen, J. Voets, Benno Krabbenborg, Jaap Bisschop, A. J. Mouthaan, Fred G. Kuper:
Fast temperature cycling and electromigration induced thin film cracking in multilevel interconnection: experiments and modeling. Microelectron. Reliab. 42(9-11): 1415-1420 (2002)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.