"Evaluation of the impact of the physical dimensions and material of the ..."

Pushparajah Rajaguru et al. (2017)

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DOI: 10.1016/J.MICROREL.2016.12.002

access: closed

type: Journal Article

metadata version: 2021-10-14

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Pushparajah Rajaguru, Hua Lu, Chris Bailey, Jose Angel Ortiz Gonzalez, Olayiwola Alatise:
Evaluation of the impact of the physical dimensions and material of the semiconductor chip on the reliability of Sn3.5Ag solder interconnect in power electronic module: A finite element analysis perspective. Microelectron. Reliab. 68: 77-85 (2017)

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