"Determination of temperature change inside IC packages during laser ..."

P. Schwindenhammer et al. (2008)

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DOI: 10.1016/J.MICROREL.2008.07.044

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type: Journal Article

metadata version: 2020-02-22

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P. Schwindenhammer, H. Murray, Philippe Descamps, Patrick Poirier:
Determination of temperature change inside IC packages during laser ablation of molding compound. Microelectron. Reliab. 48(8-9): 1263-1267 (2008)

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