"Test structure assembly for bump bond yield measurement on high density ..."

Miguel Ullán et al. (2006)

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DOI: 10.1016/J.MICROREL.2005.10.001

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type: Journal Article

metadata version: 2024-10-06

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Miguel Ullán, Manuel Lozano, Mokhtar Chmeissani, G. Blanchot, Enric Cabruja, J. García, M. Maiorino, Ricardo Martínez, Giulio Pellegrini, Carles Puigdengoles:
Test structure assembly for bump bond yield measurement on high density flip chip technologies. Microelectron. Reliab. 46(7): 1095-1100 (2006)

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