"Package and solder joint reliability analysed by FEM simulation and ..."

Bart Vandevelde, Dag Andersson (2004)

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DOI: 10.1016/J.MICROREL.2004.04.014

access: closed

type: Journal Article

metadata version: 2020-02-22

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Bart Vandevelde, Dag Andersson:
Package and solder joint reliability analysed by FEM simulation and experiments. Microelectron. Reliab. 44(12): 1891-1892 (2004)

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