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"Reliability of wire-bonding and solder joint for high temperature ..."
Yasushi Yamada et al. (2007)
- Yasushi Yamada, Yoshikazu Takaku, Yuji Yagi, Ikuo Nakagawa, Takashi Atsumi, Mikio Shirai, Ikuo Ohnuma, Kiyohito Ishida:
Reliability of wire-bonding and solder joint for high temperature operation of power semiconductor device. Microelectron. Reliab. 47(12): 2147-2151 (2007)
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