"Global interconnect design in a three-dimensional system-on-a-chip."

James W. Joyner, Payman Zarkesh-Ha, James D. Meindl (2004)

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DOI: 10.1109/TVLSI.2004.825835

access: closed

type: Journal Article

metadata version: 2022-06-10

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James W. Joyner, Payman Zarkesh-Ha, James D. Meindl:
Global interconnect design in a three-dimensional system-on-a-chip. IEEE Trans. Very Large Scale Integr. Syst. 12(4): 367-372 (2004)

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