Context-aware Post Routing Redundant Via Insertion

As the technology node advances into the nanometer era, via-open defects are one of the dominant failures due to the copper cladding process. To improve via yield and reliability, redundant-via insertion is a highly recommended technique proposed by ...

Despite the rapid advances in process technology, via failure is still problematic in nanometer-scale semiconductor manufacturing. Adding redundant vias is a typical approach for improving yield and reliability. Cell-based design methodologies are ...

Yield loss caused by via failures is unacceptably high in many semiconductor manufacturing processes. Redundant via insertion (RVI) is a typical approach for improving manufacturing competitiveness. The double-via insertion in concurrent routing or post-...