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Nanometer-scale standard cell library for enhanced redundant via1 insertion rate

Published: 02 May 2011 Publication History

Abstract

Despite the rapid advances in process technology, via failure is still problematic in nanometer-scale semiconductor manufacturing. Adding redundant vias is the typical approach for improving yield and reliability. Standard cells are essential for increasing the insertion rate of redundant via1s in cell-based designs. This study proposes an efficient library check and staggered pin arrangement approach that considers different configurations of redundant vias such as double-via and rectangle-via in order to increase redundant via1 insertion rate. Moreover, the proposed standard cell library is easily implemented in all currently available routers. The experimental results reveal that the proposed library improves total inserted redundant vias, total inserted redundant via1s, and total run time by 20.5%, 33.3%, and 44.8%, respectively. Compared to conventional approach, the average via1 insertion rate in double-via pattern is improved by 14.8%, and the via1 insertion rate in rectangle-via pattern is achieved at 100%.

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R. Aitken. DFM metrics for standard cells. In Proceedings of the 7th International Symposium on Quality Electronic Design, pages 491--496, 2006.
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H.-Y. Chen, M.-F. Chiang, Y.-W. Chang, L. Chen, and B. Han. Full-chip routing considering double-via insertion. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 27(5):844--857, 2008.
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T. Fujimaki, K. Higashi, N. Nakamura, N. Matsunaga, K. Yoshida, N. Miyawaki, M. Hatano, M. Hasunuma, J. Wada, T. Nishioka, K. Akiyama, H. Kawashima, Y. Enomoto, T. Hasegawa, K. Honda, M. Iwai, S. Yamada, and F. Matsuoka. Mechanism of moisture uptake induced via failure and its impact on 45nm node interconnect design. In IEEE International Electron Devices Meeting, pages 183--186, 2005.
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H. Heineken, J. Khare, and M. d'Abreu. Manufacturability analysis of standard cell libraries. In Proceedings of the IEEE on Custom Integrated Circuits Conference, pages 321 --324, 1998.
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K.-Y. Lee and T.-C. Wang. Post-routing redundant via insertion for yield/reliability improvement. In Asia and South Paci_c Conference on Design Automation, page 6, 2006.
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J.-T. Yan, B.-Y. Chiang, and Z.-W. Chen. Yield-driven redundant via insertion based on probabilistic via-connection analysis. In IEEE International Conference on Electronics, Circuits and Systems, pages 874--877, 2006.

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  1. Nanometer-scale standard cell library for enhanced redundant via1 insertion rate

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    cover image ACM Conferences
    GLSVLSI '11: Proceedings of the 21st edition of the great lakes symposium on Great lakes symposium on VLSI
    May 2011
    496 pages
    ISBN:9781450306676
    DOI:10.1145/1973009
    Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for components of this work owned by others than ACM must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. Request permissions from [email protected]

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    Published: 02 May 2011

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    Author Tags

    1. design for manufacturability
    2. layout
    3. standard-cell

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    GLSVLSI '11
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    GLSVLSI '11: Great Lakes Symposium on VLSI 2011
    May 2 - 4, 2011
    Lausanne, Switzerland

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