Session details: Beyond the die - packaging and die stacking
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Session details: Session 50: special session: key technologies for beyond the die
DAC '06: Proceedings of the 43rd annual Design Automation Conference
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Copyright © 2008 ACM.
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- The EDA Consortium
- IEEE/CASS/CANDE/CEDA
- SIGDA: ACM Special Interest Group on Design Automation
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Association for Computing Machinery
New York, NY, United States
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Published: 08 June 2008
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DAC '08
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Overall Acceptance Rate 1,770 of 5,499 submissions, 32%
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DAC '25
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