Location via proxy:   [ UP ]  
[Report a bug]   [Manage cookies]                
skip to main content
10.5555/2555692.2555699acmconferencesArticle/Chapter ViewAbstractPublication PagesesweekConference Proceedingsconference-collections
research-article

DHeating: dispersed heating repair for self-healing NAND flash memory

Published: 29 September 2013 Publication History

Abstract

Short lifetimes are becoming a critical issue in NAND flash memory with the advent of multi-level cell and triple-level cell flash memory. Researchers at Macronix have recently discovered that heating can cause worn-out NAND flash cells to become reusable and greatly prolong the lifetime of flash memory cells. However, the heating process consumes a substantial amount of power. This means that some fundamental changes are required if existing NAND flash management techniques are to be applied in self-healing NAND flash memory. In particular, all existing wear-leveling techniques are based on the principle of evenly distributing writes and erases. This causes NAND flash cells tend to wear out in a short time period. Moreover, healing these cells in a concentrated manner may cause power outages in mobile devices.
In this paper, we propose for the first time a new wear-leveling scheme called DHeating (Dispersed Heating) to solve the concentrated heating problem in self-healing flash memory. In DHeating, rather than evenly distributing writes and erases over a time period, write and erase operations are concentrated on a small portion of flash memory cells, so that these cells can be worn-out and healed by heating first. In this way, we can disperse healing to avoid the problem of concentrated power usage caused by heating. Furthermore, with the very long lifetime that results from self-healing, we can sacrifice lifetime for reliability. Therefore, we propose an early heating strategy to solve the reliability problem caused by concentrated heating. The idea is to start the healing process earlier by heating NAND flash cells before their expected endurance. We evaluate our scheme based on a real embedded platform. The experimental results show that our scheme can effectively solve the concentrated heating problem.

References

[1]
L.-P. Chang. On efficient wear leveling for large-scale flash-memory storage systems. In Proceedings of the 2007 ACM Symposium on Applied Computing (SAC '07), pages 1126--1130, 2007.
[2]
L.-P. Chang and L.-C. Huang. A low-cost wear-leveling algorithm for block-mapping solid-state disks. In Proceedings of the 2011 SIGPLAN/SIGBED Conference on Languages, Compilers and Tools for Embedded Systems (LCTES '11), pages 31--40, 2011.
[3]
Y.-H. Chang, J.-W. Hsieh, and T.-W. Kuo. Endurance enhancement of flash-memory storage, systems: An efficient static wear leveling design. In Proceedings of the 44th ACM/IEEE Design Automation Conference (DAC '07), pages 212--217, 2007.
[4]
Y.-H. Chang, J.-W. Hsieh, and T.-W. Kuo. Improving flash wear-leveling by proactively moving static data. IEEE Transactions on Computers, 59:53--65, 2010.
[5]
F. Chen, D. A. Koufaty, and X. Zhang. Understanding intrinsic characteristics and system implications of flash memory based solid state drives. In Proceedings of 2009 ACM SIGMETRICS Conference on Measurement and Modeling of Computer Systems (SIGMETRICS/Performance 2009), pages 181--192, 2009.
[6]
F. Chen, T. Luo, and X. Zhang. Caftl: A content-aware flash translation layer enhancing the lifespan of flash memory based solid state drives. In Proceedings of 9th USENIX Conference on File and Storage Technologies (FAST'11), pages 77--90, 2011.
[7]
Y. Chen, H. Li, X. Wang, W. Zhu, W. Xu, and T. Zhang. A nondestructive self-reference scheme for spin-transfer torque random access memory (STT-RAM). In Proceedings of the Design, Automation & Test in Europe Conference & Exhibition (DATE '10), 2010.
[8]
Y.-T. Chiu. Forever flash. IEEE Spectrum, 49(12):11--12, December 2012.
[9]
S. Electronics. K9LBG08U0M(v1.0)-32GB DDP MLC. http://www.samsung.com.
[10]
Y. Guan, G. Wang, Y. Wang, R. Chen, and Z. Shao. Blog: block-level log-block management for NAND flash memorystorage systems. In Proceedings of the 14th ACM SIGPLAN/SIGBED Conference on Languages, Compilers and Tools for Embedded Systems (LCTES '13), pages 111--120, 2013.
[11]
J. Hu, C. J. Xue, W.-C. Tseng, Y. He, M. Qiu, and E. H.-M. Sha. Reducing write activities on non-volatile memories in embedded CMPs via data migration and recomputation. In Proceedings of the 47th Design Automation Conference (DAC '10), pages 350--355, 2010.
[12]
J. Hu, Q. Zhuge, C. J. Xue, W.-C. Tseng, and E. H.-M. Sha. Software enabled wear-leveling for hybrid PCM main memory on embedded systems. In Proceedings of the Design, Automation Test in Europe Conference Exhibition (DATE '13), pages 599--602, 2013.
[13]
L. Jiang, B. Zhao, Y. Zhang, J. Yang, and B. Childers. Improving write operations in MLC phase change memory. In Proceedings of the 18th IEEE International Symposium on High Performance Computer Architecture (HPCA '12), pages 1--10, 2012.
[14]
T.-W. Kuo, Y.-H. Chang, P.-C. Huang, and C.-W. Chang. Special issues in flash. In Proceedings of the IEEE/ACM International Conference on Computer-Aided Design (ICCAD '08), pages 821--826, 2008.
[15]
B. Lee, P. Zhou, J. Yang, Y. Zhang, B. Zhao, E. Ipek, O. Mutlu, and D. Burger. Phase-change technology and the future of main memory. IEEE Micro, 30(1):143--143, 2010.
[16]
D. Liu, T. Wang, Y. Wang, Z. Qin, and Z. Shao. PCM-FTL: A write-activity-aware NAND flash memory management scheme for PCM-based embedded systems. In Proceedings of the 32nd IEEE Real-Time Systems Symposium (RTSS '11), pages 357--366, 2011.
[17]
C. Mellor. TLC flash gets tender loving care from DensBits. http://www.theregister.co.uk/2012/05/02/densbit_tlc/, 2012.
[18]
A. K. Mishra, X. Dong, G. Sun, Y. Xie, N. Vijaykrishnan, and C. R. Das. Architecting on-chip interconnects for stacked 3D STT-RAM caches in CMPs. In Proceedings of the 2011 38th Annual International Symposium on Computer Architecture (ISCA '11), 2011.
[19]
D. Niu, Y. Chen, C. Xu, and Y. Xie. Impact of process variations on emerging memristor. In Proceedings of the 47th ACM/IEEE Design Automation Conference (DAC '10), 2010.
[20]
Z. Qin, Y. Wang, D. Liu, Z. Shao, and Y. Guan. MNFTL: An efficient flash translation layer for MLC NAND flash memory storage systems. In Proceedings of the 48th Design Automation Conference (DAC '11), pages 17--22, 2011.
[21]
Samsung. S3C6410. http://www.samsung.com/global/business/semiconductor/product/application/detail?productId=7115&iaId=835.
[22]
Z. Shao, Y. Liu, Y. Chen, and T. Li. Utilizing PCM for energy optimization in embedded systems. In Proceedings of the 2012 IEEE Computer Society Annual Symposium on VLSI (ISVLSI '12), pages 398--403, 2012.
[23]
G. Sun, X. Wu, and Y. Xie. Exploration of 3D stacked L2 cache design for high performance and efficient thermal control. In Proceedings of the 14th ACM/IEEE International Symposium on Low Power Electronics and Design (ISLPED '09), 2009.
[24]
L. Tian, M. Siyuan, L. Rubao, Z. Xiaodong, L. Deng, and Z. Li. S-CAVE: Effective SSD caching to improve virtual machine storage performance. In Proceedings of 22nd International Conference on Parallel Architectures and Compilation Techniques (PACT 2013), pages 1--10, 2013.
[25]
C. Wang and W.-F. Wong. Observational wear leveling: An efficient algorithm for flash memory management. In Proceedings of the 49th ACM/EDAC/IEEE Design Automation Conference (DAC '12), pages 235--242, June 2012.
[26]
X. Wang, Y. Chen, H. Li, D. Dimitrov, and H. Liu. Spin torque random access memory down to 22 nm technology. IEEE Transactions on Magnetics, 44:2479--2482, 2008.
[27]
Y. Wang, L. Bathen, N. Dutt, and Z. Shao. Meta-cure: A reliability enhancement strategy for metadata in NAND flash memory storage systems. In Proceedings of the 49th ACM/EDAC/IEEE Design Automation Conference (DAC '12), pages 214--219, 2012.
[28]
Y. Wang, L. Bathen, Z. Shao, and N. Dutt. 3D-FlashMap: A physical-location-aware block mapping strategy for 3D NAND flash memory. In Proceedings of the Design, Automation Test in Europe Conference Exhibition (DATE '12), pages 1307--1312, 2012.
[29]
Y. Wang, Y. Liu, Y. Liu, D. Zhang, S. Li, B. Sai, M. Chiang, and H. Yang. A compression-based area-efficient recovery architecture for nonvolatile processors. In Proceedings of the Design, Automation & Test in Europe Conference & Exhibition (DATE '12), pages 1519--1524, 2012.
[30]
C. J. Xue, Y. Zhang, Y. Chen, G. Sun, J. J. Yang, and H. Li. Emerging non-volatile memories: opportunities and challenges. In Proceedings of the 7th IEEE/ACM/IFIP International Conference on Hardware/Software Codesign and System Synthesis (CODES+ISSS '11), pages 325--334, 2011.
[31]
W. Zhang, N. K. Jha, and L. Shang. Low-power 3D NANO/CMOS hybrid dynamically reconfigurable architecture. ACM Journal on Emerging Technologies in Computing Systems, 6(3):10.1--10.32, 2010.
[32]
P. Zhou, B. Zhao, J. Yang, and Y. Zhang. A durable and energy efficient main memory using phase change memory technology. In Proceedings of the 36th Annual International Symposium on Computer Architecture (ISCA '09), pages 14--23, 2009.

Cited By

View all

Recommendations

Comments

Information & Contributors

Information

Published In

cover image ACM Conferences
CODES+ISSS '13: Proceedings of the Ninth IEEE/ACM/IFIP International Conference on Hardware/Software Codesign and System Synthesis
September 2013
335 pages
ISBN:9781479914173

Sponsors

Publisher

IEEE Press

Publication History

Published: 29 September 2013

Check for updates

Author Tags

  1. dispersed heating
  2. flash memory
  3. power consumption
  4. self-healing
  5. wear leveling

Qualifiers

  • Research-article

Conference

ESWEEK'13
ESWEEK'13: Ninth Embedded System Week
September 29 - October 4, 2013
Quebec, Montreal, Canada

Acceptance Rates

CODES+ISSS '13 Paper Acceptance Rate 31 of 111 submissions, 28%;
Overall Acceptance Rate 280 of 864 submissions, 32%

Contributors

Other Metrics

Bibliometrics & Citations

Bibliometrics

Article Metrics

  • Downloads (Last 12 months)3
  • Downloads (Last 6 weeks)0
Reflects downloads up to 20 Jan 2025

Other Metrics

Citations

Cited By

View all

View Options

Login options

View options

PDF

View or Download as a PDF file.

PDF

eReader

View online with eReader.

eReader

Media

Figures

Other

Tables

Share

Share

Share this Publication link

Share on social media