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Circuit and Platform Design Challenges in Technologies beyond 90nm

Published: 03 March 2003 Publication History

Abstract

There are already a huge number of problems for silicon designers and it is likely to just get worse. Many of these problems are technical associated with shrinking geometries and increasing architecture complexities, but there are a significant number that seem to be caused by procedurally related mistakes and issues. Many of the technical problems are solved and re-solved on a piece-meal basis, focusing on local optimizations of small design-space problems. Unfortunately, many of these local solutions really create a less apparent but larger inefficiency in the whole design flow. The reason for this is that a few ever look at the whole design methodology, especially as it applies to large design teams. As a consequence, this lack of oversight for the whole methodology is causing project procedural problems and inefficiencies.

References

[1]
{1} F. Pollack, "New Microarchitecture Challenges in the Coming Generations of CMOS Process Technologies," Micro32, 1999.
[2]
{2} G. Sery et al., "Life is CMOS: why chase the life after?," DAC 2002, 78-83.
[3]
{3} T. Karnik et al., "Sub-90nm Technologies - Challenges and Opportunities for CAD," ICCAD 2002
[4]
{4} S. Kundu et al., "Test Challenges in Nanometer Technologies," Journal of Electronic Testing: Theory and Applications, pp. 209-218, 2001
[5]
{5} S. Sengupta et al., "Defect-Based Test: A Key Enabler for Successful Migration to Structural Test", Intel Technical Journal, http://developer.intel.com/technology/itj/, 1999 1st quarterly issue

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        cover image ACM Conferences
        DATE '03: Proceedings of the conference on Design, Automation and Test in Europe - Volume 1
        March 2003
        1112 pages
        ISBN:0769518702

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        Published: 03 March 2003

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