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This paper addresses the fundamental and practically useful question of identifying a minimum set of sensors and their locations through which a large complex dynamical network system and its time-dependent states can be observed. The paper defines the ...

Thermal hot spots and unbalanced temperatures between cores on chip can cause either degradation in performance or may have a severe impact on reliability, or both. In this paper, we propose mDTM, a proactive dynamic thermal management technique for on-...

Thermal analysis and management of batteries have been an important research issue for battery-operated systems such as electric vehicles and mobile devices. Nowadays, battery packs are designed considering heat dissipation, and external cooling devices ...

High temperature is one of the limiting factors and major concerns in 3D-chip integration. In this paper we use a 3D test chip (WIDEIO DRAM on top of a logic die) equipped with temperature sensors and heaters to explore thermal effects. We correlated ...

Scaling of future many-core chips is hindered by the challenge imposed by ever-escalating power consumption. At its worst, an increasing fraction of the chips will have to be shut down, as power supply is inadequate to simultaneously switch all the ...

Per-core power proxies for multi-core processors are known to use several dozens of hardware activity monitors to achieve a 2% accuracy on core power estimation. These activity monitors are typically not accessible to the user, and even if they were ...