Article

Performance modeling and optimization for single- and multi-wall carbon nanotube interconnects

Authors:

James D. MeindlAuthors Info & Claims

DAC '07: Proceedings of the 44th annual Design Automation Conference

Pages 568 - 573

https://doi.org/10.1145/1278480.1278624

Published: 04 June 2007 Publication History

Abstract

Based on physical circuit models the performances of signal and power interconnects at the local, semi-global and global levels are modeled at 100°C. For local signal interconnects, replacing copper wires with a typical aspect ratio of 2 by thin SWNT interconnects can lower power dissipation by 50%. This would also improve their speed by up to 50% by the end of the ITRS. Copper wires and large diameter MWNTs offer the lowest resistance for power distribution in the first and second interconnect levels, respectively. SWNT-bundles and MWNTs can be used to lower the delay of signal interconnects in semi-global levels. MWNTs with diameters of 50nm and 100nm can potentially increase the bandwidth density of global interconnects by up to 50% and 100%, respectively.

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Cited By

Naeemi AMeindl J(2009)Compact Physics-Based Circuit Models for Graphene Nanoribbon InterconnectsIEEE Transactions on Electron Devices10.1109/TED.2009.202612256:9(1822-1833)Online publication date: Sep-2009
https://doi.org/10.1109/TED.2009.2026122
Naeemi AMeindl JNassif SRoychowdhury J(2008)Physical models for electron transport in graphene nanoribbons and their junctionsProceedings of the 2008 IEEE/ACM International Conference on Computer-Aided Design10.5555/1509456.1509549(400-405)Online publication date: 10-Nov-2008
https://dl.acm.org/doi/10.5555/1509456.1509549
Pasricha SDutt N(2008)Trends in Emerging On-Chip Interconnect TechnologiesIPSJ Transactions on System LSI Design Methodology10.2197/ipsjtsldm.1.21(2-17)Online publication date: 2008
https://doi.org/10.2197/ipsjtsldm.1.2
Show More Cited By

Index Terms

Performance modeling and optimization for single- and multi-wall carbon nanotube interconnects
1. Hardware
  1. Emerging technologies
  2. Very large scale integration design

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cover image ACM Conferences

DAC '07: Proceedings of the 44th annual Design Automation Conference

June 2007

1016 pages

ISBN:9781595936271

DOI:10.1145/1278480

General Chair:
Steven P. Levitan
Univ. of Pittsburgh, Pittsburgh, PA

Copyright © 2007 ACM.

Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for components of this work owned by others than ACM must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. Request permissions from [email protected]

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Published: 04 June 2007

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DAC07: The 44th Annual Design Automation Conference 2007

June 4 - 8, 2007

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DAC '07 Paper Acceptance Rate 152 of 659 submissions, 23%;

Overall Acceptance Rate 1,770 of 5,499 submissions, 32%

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Cited By

Naeemi AMeindl J(2009)Compact Physics-Based Circuit Models for Graphene Nanoribbon InterconnectsIEEE Transactions on Electron Devices10.1109/TED.2009.202612256:9(1822-1833)Online publication date: Sep-2009
https://doi.org/10.1109/TED.2009.2026122
Naeemi AMeindl JNassif SRoychowdhury J(2008)Physical models for electron transport in graphene nanoribbons and their junctionsProceedings of the 2008 IEEE/ACM International Conference on Computer-Aided Design10.5555/1509456.1509549(400-405)Online publication date: 10-Nov-2008
https://dl.acm.org/doi/10.5555/1509456.1509549
Pasricha SDutt N(2008)Trends in Emerging On-Chip Interconnect TechnologiesIPSJ Transactions on System LSI Design Methodology10.2197/ipsjtsldm.1.21(2-17)Online publication date: 2008
https://doi.org/10.2197/ipsjtsldm.1.2
Nieuwoudt AMassoud Y(2008)On the Optimal Design, Performance, and Reliability of Future Carbon Nanotube-Based Interconnect SolutionsIEEE Transactions on Electron Devices10.1109/TED.2008.92673355:8(2097-2110)Online publication date: Aug-2008
https://doi.org/10.1109/TED.2008.926733
Pasricha SKurdahi FDutt N(2008)System level performance analysis of carbon nanotube global interconnects for emerging chip multiprocessorsProceedings of the 2008 IEEE International Symposium on Nanoscale Architectures10.1109/NANOARCH.2008.4585785(1-7)Online publication date: 12-Jun-2008
https://dl.acm.org/doi/10.1109/NANOARCH.2008.4585785
Nieuwoudt AMassoud Y(2008)Investigating the Design, Performance, and Reliability of Multi-Walled Carbon Nanotube Interconnect9th International Symposium on Quality Electronic Design (isqed 2008)10.1109/ISQED.2008.4479821(691-696)Online publication date: Mar-2008
https://doi.org/10.1109/ISQED.2008.4479821
Massoud YNieuwoudt A(2008)Performance analysis of optimized carbon nanotube interconnect2008 IEEE International Symposium on Circuits and Systems10.1109/ISCAS.2008.4541537(792-795)Online publication date: May-2008
https://doi.org/10.1109/ISCAS.2008.4541537
Sekar DNaeemi ASarvari RDavis JMeindl JGielen G(2007)IntSimProceedings of the 2007 IEEE/ACM international conference on Computer-aided design10.5555/1326073.1326189(560-567)Online publication date: 5-Nov-2007
https://dl.acm.org/doi/10.5555/1326073.1326189

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