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Design and analysis of Thin-BOX FD/SOI devices for low-power and stable SRAM in sub-50nm technologies

Published: 27 August 2007 Publication History

Abstract

This paper demonstrates viable device design options for low-leakage and robust SRAM in sub-50nm FD/SOI technology. We explore the possibilities of reducing the body-doping of FD/SOI devices with proper tuning of back-gate bias or gate workfunction to achieve a given leakage target. The reduction of body-doping density helps reduce the effect of the random dopant fluctuation (RDF), while the Vt and leakage are controlled using the back-gate bias. Our analysis show that, body-doping reduction combined with back-gate biasing is the most efficient FD/SOI device design for low-leakage and robust SRAM.

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M. Yamaoka et al., "SRAM circuit with extended operating margin and reduced standby leakage current using thin-BOX FD-SOI transistors", ASSCC, p. 109, Nov. 2005.
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H.-S. P. Wong, et. al, "Device Design Considerations for Double-Gate, Ground-Plane, and Single-Gated Ultra-Thin SOI MOSFET's at the 25 nm Channel Length Generation," IEDM, p. 407, Dec. 1998.
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Cited By

View all
  • (2010)Substrate impact on threshold voltage and subthreshold slope of sub-32nm ultra thin SOI MOSFETs with thin buried oxide and undoped channelSolid-State Electronics10.1016/j.sse.2009.12.02154:2(213-219)Online publication date: Feb-2010
  • (2009)Underlap channel UTBB MOSFETs for low—power analog/RF applications2009 10th International Conference on Ultimate Integration of Silicon10.1109/ULIS.2009.4897564(173-176)Online publication date: Mar-2009
  • (2008)Device Design and Optimization Methodology for Leakage and Variability Reduction in Sub-45-nm FD/SOI SRAMIEEE Transactions on Electron Devices10.1109/TED.2007.91107355:1(152-162)Online publication date: Jan-2008
  • Show More Cited By

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  1. Design and analysis of Thin-BOX FD/SOI devices for low-power and stable SRAM in sub-50nm technologies

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    Published In

    cover image ACM Conferences
    ISLPED '07: Proceedings of the 2007 international symposium on Low power electronics and design
    August 2007
    432 pages
    ISBN:9781595937094
    DOI:10.1145/1283780
    Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for components of this work owned by others than ACM must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. Request permissions from [email protected]

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    New York, NY, United States

    Publication History

    Published: 27 August 2007

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    Author Tags

    1. FD/SOI
    2. SRAM
    3. low-power
    4. stability

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    Cited By

    View all
    • (2010)Substrate impact on threshold voltage and subthreshold slope of sub-32nm ultra thin SOI MOSFETs with thin buried oxide and undoped channelSolid-State Electronics10.1016/j.sse.2009.12.02154:2(213-219)Online publication date: Feb-2010
    • (2009)Underlap channel UTBB MOSFETs for low—power analog/RF applications2009 10th International Conference on Ultimate Integration of Silicon10.1109/ULIS.2009.4897564(173-176)Online publication date: Mar-2009
    • (2008)Device Design and Optimization Methodology for Leakage and Variability Reduction in Sub-45-nm FD/SOI SRAMIEEE Transactions on Electron Devices10.1109/TED.2007.91107355:1(152-162)Online publication date: Jan-2008
    • (2007)High-performance SRAM in nanoscale CMOSProceedings of the 2007 IEEE International Workshop on Memory Technology, Design and Testing10.1109/MTDT.2007.4547603(4-12)Online publication date: 3-Dec-2007

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